KR102368739B1 - 내열성 점착 시트 및 기능성 필름의 제조 방법 - Google Patents

내열성 점착 시트 및 기능성 필름의 제조 방법 Download PDF

Info

Publication number
KR102368739B1
KR102368739B1 KR1020150163468A KR20150163468A KR102368739B1 KR 102368739 B1 KR102368739 B1 KR 102368739B1 KR 1020150163468 A KR1020150163468 A KR 1020150163468A KR 20150163468 A KR20150163468 A KR 20150163468A KR 102368739 B1 KR102368739 B1 KR 102368739B1
Authority
KR
South Korea
Prior art keywords
film
heat
adhesive sheet
layer
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020150163468A
Other languages
English (en)
Korean (ko)
Other versions
KR20160060595A (ko
Inventor
료 다카하시
Original Assignee
린텍 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20160060595A publication Critical patent/KR20160060595A/ko
Application granted granted Critical
Publication of KR102368739B1 publication Critical patent/KR102368739B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/40Adhesives in the form of films or foils characterised by release liners
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/28Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/283Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/38Layered products comprising a layer of synthetic resin comprising epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/06Interconnection of layers permitting easy separation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/10Interconnection of layers at least one layer having inter-reactive properties
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • C09J7/25Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255Polyesters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/40Adhesives in the form of films or foils characterised by release liners
    • C09J7/401Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Chemical Kinetics & Catalysis (AREA)
KR1020150163468A 2014-11-20 2015-11-20 내열성 점착 시트 및 기능성 필름의 제조 방법 Active KR102368739B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014235770A JP6424070B2 (ja) 2014-11-20 2014-11-20 耐熱性粘着シート及び機能性フィルムの製造方法
JPJP-P-2014-235770 2014-11-20

Publications (2)

Publication Number Publication Date
KR20160060595A KR20160060595A (ko) 2016-05-30
KR102368739B1 true KR102368739B1 (ko) 2022-02-28

Family

ID=56035489

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150163468A Active KR102368739B1 (ko) 2014-11-20 2015-11-20 내열성 점착 시트 및 기능성 필름의 제조 방법

Country Status (4)

Country Link
JP (1) JP6424070B2 (https=)
KR (1) KR102368739B1 (https=)
CN (1) CN105619979B (https=)
TW (1) TWI671381B (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101993352B1 (ko) * 2015-12-09 2019-06-26 주식회사 엘지화학 광흡수 필름 및 이를 포함하는 편광판
CN109313962A (zh) * 2016-06-10 2019-02-05 日东电工株式会社 透明导电性薄膜及触摸面板
KR101852837B1 (ko) * 2016-07-21 2018-04-27 주식회사 오킨스전자 반도체 패키지 검사용 캐리어 제조 방법
JP7111301B2 (ja) * 2018-03-27 2022-08-02 リンテック株式会社 剥離シート
JP7100541B2 (ja) * 2018-08-29 2022-07-13 日本カーバイド工業株式会社 積層体の製造方法及び積層体
JP2020105407A (ja) 2018-12-27 2020-07-09 日東電工株式会社 保護シート
EP3904084A4 (en) 2018-12-27 2022-08-31 Nitto Denko Corporation PROTECTIVE FILM
JPWO2020196222A1 (https=) * 2019-03-26 2020-10-01
CN110885663A (zh) * 2019-11-26 2020-03-17 塔威新材料科技(上海)有限公司 一种uv湿气双重固化反应型聚氨酯热熔胶组合物
KR102562078B1 (ko) * 2020-01-10 2023-09-01 이솔화학 주식회사 투명 필름 적층체의 제조방법
WO2021193935A1 (ja) * 2020-03-27 2021-09-30 リンテック株式会社 半導体装置製造用シート及びフィルム状接着剤付き半導体チップの製造方法
CN113999639A (zh) * 2021-11-17 2022-02-01 九江福莱克斯有限公司 一种高透明耐温耐黄变聚酯胶粘剂及制作的挠性覆盖膜
CN116410502B (zh) * 2021-12-31 2024-12-03 山东东岳高分子材料有限公司 一种低剥离强度氟素离型膜及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008251529A (ja) 2007-03-02 2008-10-16 Nitto Denko Corp 粘着剤層付き透明導電性フィルムおよびその製造方法
JP2014193527A (ja) 2013-03-28 2014-10-09 Lintec Corp 粘着シート

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS548121Y2 (https=) * 1974-08-28 1979-04-14
JP4151821B2 (ja) 2002-01-11 2008-09-17 日東電工株式会社 透明導電性フィルム用表面保護フィルム及び透明導電性フィルム
JP5612388B2 (ja) * 2010-07-30 2014-10-22 日東電工株式会社 透明導電性フィルム用粘着剤層、粘着剤層付き透明導電性フィルム、透明導電性積層体、およびタッチパネル
JP5825949B2 (ja) * 2011-09-14 2015-12-02 リンテック株式会社 離型フィルム及びその製造方法
JP5877122B2 (ja) * 2012-05-21 2016-03-02 藤森工業株式会社 表面処理フィルム、表面保護フィルム及びそれが貼り合わされた精密電気・電子部品
JP6346413B2 (ja) * 2013-06-10 2018-06-20 日東電工株式会社 セパレータ付き粘着剤層、その製造方法およびセパレータ付きの粘着剤層付き光学フィルム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008251529A (ja) 2007-03-02 2008-10-16 Nitto Denko Corp 粘着剤層付き透明導電性フィルムおよびその製造方法
JP2014193527A (ja) 2013-03-28 2014-10-09 Lintec Corp 粘着シート

Also Published As

Publication number Publication date
CN105619979A (zh) 2016-06-01
TWI671381B (zh) 2019-09-11
CN105619979B (zh) 2019-11-12
KR20160060595A (ko) 2016-05-30
JP2016098297A (ja) 2016-05-30
TW201627443A (zh) 2016-08-01
JP6424070B2 (ja) 2018-11-14

Similar Documents

Publication Publication Date Title
KR102368739B1 (ko) 내열성 점착 시트 및 기능성 필름의 제조 방법
JP6626998B2 (ja) ガスバリア性粘着シート、その製造方法、並びに電子部材及び光学部材
JP2022130400A (ja) 両面粘着シート、画像表示装置構成用部材を有する積層体、積層体形成キット及び両面粘着シートの使用
JP6062759B2 (ja) 粘着剤組成物、光学用粘着シート、光学フィルム、及び表示装置
JP5986242B2 (ja) 転写印刷のための無基材粘着転写テープ及びその製造方法
JP5607565B2 (ja) 粘着剤、及び粘着シート
JP6100989B2 (ja) Ito用粘着テープ
JP6291679B2 (ja) 透明導電性基板用表面保護フィルムの製造方法、透明導電性基板用表面保護フィルムおよび積層体
WO2012128294A1 (ja) 粘着剤、及び粘着シート
TWI606932B (zh) 高硬度膜
JP6325653B2 (ja) 粘着性組成物、粘着剤および粘着シート
TWI686454B (zh) 黏著片、雙面黏著片及光學構件
KR102303304B1 (ko) 점착 시트
WO2014157445A1 (ja) 両面粘着シート
CN105008477B (zh) 双面粘贴片
JP2013001817A (ja) 基材レス両面粘着シート
JP6210110B2 (ja) 虹ムラ発生低減積層体、虹ムラ発生低減シート、および虹ムラ発生低減方法
JP2005066919A (ja) 表面保護フィルム
TWI632064B (zh) 硬塗積層體及其製造方法
JP2023070974A (ja) 積層ポリエステルフィルム

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 4