KR102353254B1 - 리프트 인쇄 시스템 - Google Patents

리프트 인쇄 시스템 Download PDF

Info

Publication number
KR102353254B1
KR102353254B1 KR1020177001308A KR20177001308A KR102353254B1 KR 102353254 B1 KR102353254 B1 KR 102353254B1 KR 1020177001308 A KR1020177001308 A KR 1020177001308A KR 20177001308 A KR20177001308 A KR 20177001308A KR 102353254 B1 KR102353254 B1 KR 102353254B1
Authority
KR
South Korea
Prior art keywords
donor
multiple output
output beams
substrate
donor film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020177001308A
Other languages
English (en)
Korean (ko)
Other versions
KR20170040194A (ko
Inventor
즈비 코틀러
마이클 제노우
이테이 펠리드
Original Assignee
오르보테크 엘티디.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오르보테크 엘티디. filed Critical 오르보테크 엘티디.
Publication of KR20170040194A publication Critical patent/KR20170040194A/ko
Application granted granted Critical
Publication of KR102353254B1 publication Critical patent/KR102353254B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14088—Structure of heating means
    • B41J2/14104—Laser or electron beam heating the ink
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/44—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using single radiation source per colour, e.g. lighting beams or shutter arrangements
    • B41J2/442—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using single radiation source per colour, e.g. lighting beams or shutter arrangements using lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/455—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using laser arrays, the laser array being smaller than the medium to be recorded
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/70025—Production of exposure light, i.e. light sources by lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/04—Heads using conductive ink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • General Health & Medical Sciences (AREA)
  • Electronic Switches (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Thermal Transfer Or Thermal Recording In General (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020177001308A 2014-08-07 2015-08-02 리프트 인쇄 시스템 Active KR102353254B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462034168P 2014-08-07 2014-08-07
US62/034,168 2014-08-07
PCT/IB2015/055862 WO2016020817A1 (en) 2014-08-07 2015-08-02 Lift printing system

Publications (2)

Publication Number Publication Date
KR20170040194A KR20170040194A (ko) 2017-04-12
KR102353254B1 true KR102353254B1 (ko) 2022-01-18

Family

ID=55263236

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177001308A Active KR102353254B1 (ko) 2014-08-07 2015-08-02 리프트 인쇄 시스템

Country Status (7)

Country Link
US (1) US9925797B2 (enExample)
EP (1) EP3177965A4 (enExample)
JP (1) JP6600351B2 (enExample)
KR (1) KR102353254B1 (enExample)
CN (2) CN106575077A (enExample)
IL (1) IL249858B (enExample)
WO (1) WO2016020817A1 (enExample)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10629442B2 (en) * 2013-10-14 2020-04-21 Orbotech Ltd. Lift printing of multi-composition material structures
EP3207772B1 (en) 2014-10-19 2024-04-17 Orbotech Ltd. Lift printing of conductive traces onto a semiconductor substrate
EP3247816A4 (en) 2015-01-19 2018-01-24 Orbotech Ltd. Printing of three-dimensional metal structures with a sacrificial support
KR20170102984A (ko) * 2015-01-21 2017-09-12 오르보테크 엘티디. 경사진 lift 제팅
KR20180030609A (ko) 2015-07-09 2018-03-23 오르보테크 엘티디. Lift 토출 각도의 제어
KR102546450B1 (ko) 2015-11-22 2023-06-21 오르보테크 엘티디. 프린팅된 3-차원 구조들의 표면 특성들의 제어
JP6997469B2 (ja) * 2016-07-17 2022-01-17 アイオー テック グループ リミテッド レーザー励起材料分注のためのキットおよびシステム
US12042984B2 (en) 2016-11-17 2024-07-23 Orbotech Ltd. Hybrid, multi-material 3D printing
EP3395579B1 (de) * 2017-04-24 2019-10-09 Penteq GmbH Laser-transferdrucker und vorrichtung zum bereitstellen einer farbpartikel-folie hiefür
TW201901887A (zh) 2017-05-24 2019-01-01 以色列商奧寶科技股份有限公司 於未事先圖樣化基板上電器互連電路元件
DE102018005010A1 (de) * 2017-07-13 2019-01-17 Wika Alexander Wiegand Se & Co. Kg Transfer und Aufschmelzen von Schichten
CN107784694B (zh) * 2017-11-23 2024-04-02 尚睦集团有限公司 一种个性化门票制作机
EP3521483A1 (en) * 2018-02-06 2019-08-07 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Lift deposition apparatus and method
DK3543371T3 (da) 2018-03-22 2021-04-06 Fund I D Automocion Y Mecatronica Kontinuerlig laserinduceret fremad-overføring af et materialesystem
KR102391800B1 (ko) * 2018-06-15 2022-04-29 주식회사 엘지화학 비정질 박막의 제조방법
EP3659728B1 (en) * 2018-11-29 2021-01-27 Ivoclar Vivadent AG Method for layer-wise additive manufacturing of a shaped body
CN109581674B (zh) * 2019-01-04 2020-04-28 华南理工大学 一种锡膏激光诱导前向转移设备与方法
JP7424093B2 (ja) * 2019-03-08 2024-01-30 株式会社リコー 立体造形物を造形する装置、立体造形物を造形する方法
US12046575B2 (en) 2019-05-01 2024-07-23 Io Tech Group Ltd. Method to electrically connect chip with top connectors using 3D printing
US12162294B2 (en) 2019-05-07 2024-12-10 Orbotech Ltd. Lift printing using thin donor foils
FR3096929B1 (fr) * 2019-06-06 2021-09-03 Schott Vtf Méthode de réalisation d’un panneau décoratif
WO2020250058A1 (en) 2019-06-14 2020-12-17 Io Tech Group Ltd. Additive manufacturing of a free form object made of multicomponent materials
CN110753454B (zh) * 2019-12-04 2020-08-18 广东工业大学 一种用于精细线路的成型及修复方法
US11446750B2 (en) * 2020-02-03 2022-09-20 Io Tech Group Ltd. Systems for printing solder paste and other viscous materials at high resolution
US11622451B2 (en) 2020-02-26 2023-04-04 Io Tech Group Ltd. Systems and methods for solder paste printing on components
JP7442146B2 (ja) * 2020-03-23 2024-03-04 株式会社リコー 飛翔体発生方法及び飛翔体発生装置、並びに画像形成方法
US11627667B2 (en) * 2021-01-29 2023-04-11 Orbotech Ltd. High-resolution soldering
US11497124B2 (en) 2020-06-09 2022-11-08 Io Tech Group Ltd. Methods for printing conformal materials on component edges at high resolution
US11691332B2 (en) 2020-08-05 2023-07-04 Io Tech Group Ltd. Systems and methods for 3D printing with vacuum assisted laser printing machine
EP4267332A4 (en) 2020-12-23 2024-04-24 Cornell University CONTROLLED DEPOSIT OF MOLTEN METAL
US12420479B2 (en) * 2021-12-23 2025-09-23 Reophotonics, Ltd. Systems for printing viscous materials using laser assisted deposition
US11779955B1 (en) 2022-03-04 2023-10-10 Reophotonics, Ltd. Methods for residual material collection in laser-assisted deposition
CN115041836B (zh) * 2022-06-30 2023-08-22 华南理工大学 一种磁驱折纸软体机器人的磁驱动单元激光诱导转印方法
GB2634881A (en) * 2023-10-20 2025-04-30 Asmpt Smt Singapore Pte Ltd Laser-assisted deposition with beam-shaping

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003524074A (ja) * 2000-02-25 2003-08-12 ボストン サイエンティフィック リミテッド 医療用デバイスへの構成要素のレーザ堆積
JP2009536882A (ja) * 2006-05-12 2009-10-22 フォトン・ダイナミクス・インコーポレーテッド 堆積修復の装置及び方法
US20110188016A1 (en) 2008-09-22 2011-08-04 Asml Netherlands B.V. Lithographic apparatus, programmable patterning device and lithographic method
WO2013023874A1 (en) 2011-08-16 2013-02-21 Asml Netherlands B.V. Lithographic apparatus, programmable patterning device and lithographic method
WO2013124114A1 (en) 2012-02-23 2013-08-29 Asml Netherlands B.V. Device, lithographic apparatus, method for guiding radiation and device manufacturing method
JP2014510419A (ja) * 2011-04-08 2014-04-24 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置、プログラマブル・パターニングデバイス、及びリソグラフィ方法

Family Cites Families (115)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1393637A (en) 1917-09-21 1921-10-11 Hydesaburo Ohashi & Co Inc Coating-machine
US4608328A (en) 1985-05-02 1986-08-26 Xerox Corporation Donor for touchdown development
US4752455A (en) 1986-05-27 1988-06-21 Kms Fusion, Inc. Pulsed laser microfabrication
US4891183A (en) 1986-12-03 1990-01-02 Chrysler Motors Corporation Method of preparing alloy compositions
US4970196A (en) 1987-01-15 1990-11-13 The Johns Hopkins University Method and apparatus for the thin film deposition of materials with a high power pulsed laser
US4942056A (en) 1988-02-18 1990-07-17 Seiko Epson Corporation Method for replenishing a depleted ink sheet
US4987006A (en) 1990-03-26 1991-01-22 Amp Incorporated Laser transfer deposition
JPH04197774A (ja) 1990-11-29 1992-07-17 Nec Corp プリンタ用インキング装置
US5173441A (en) 1991-02-08 1992-12-22 Micron Technology, Inc. Laser ablation deposition process for semiconductor manufacture
US5204696A (en) 1991-12-16 1993-04-20 Xerox Corporation Ceramic printhead for direct electrostatic printing
US5292559A (en) 1992-01-10 1994-03-08 Amp Incorporated Laser transfer process
JPH0634283A (ja) 1992-06-16 1994-02-08 Ishikawajima Harima Heavy Ind Co Ltd 宇宙用熱交換器の製作方法
DE4232373A1 (de) 1992-09-03 1994-03-10 Deutsche Forsch Luft Raumfahrt Verfahren zum Auftragen strukturierter Schichten
US5683601A (en) 1994-10-24 1997-11-04 Panasonic Technologies, Inc. Laser ablation forward metal deposition with electrostatic assisted bonding
US5935758A (en) 1995-04-20 1999-08-10 Imation Corp. Laser induced film transfer system
US7534543B2 (en) 1996-04-15 2009-05-19 3M Innovative Properties Company Texture control of thin film layers prepared via laser induced thermal imaging
US5692844A (en) 1996-08-29 1997-12-02 Eastman Kodak Company Re-application of dye to a dye donor element of thermal printers
AU6868598A (en) 1997-03-20 1998-10-12 Therics, Inc. Fabrication of tissue products using a mold formed by solid free-form methods
US5885929A (en) 1997-06-17 1999-03-23 Eastman Kodak Company Reusable donor layer containing dye wells for thermal printing
US6025110A (en) 1997-09-18 2000-02-15 Nowak; Michael T. Method and apparatus for generating three-dimensional objects using ablation transfer
US6159832A (en) 1998-03-18 2000-12-12 Mayer; Frederick J. Precision laser metallization
JP3871096B2 (ja) 1998-05-21 2007-01-24 株式会社ティラド 蒸発器、吸収器および過冷却器の組合せ一体型熱交換器と、その製造方法
US6155330A (en) 1998-11-04 2000-12-05 Visteon Global Technologies, Inc. Method of spray forming metal deposits using a metallic spray forming pattern
US6177151B1 (en) 1999-01-27 2001-01-23 The United States Of America As Represented By The Secretary Of The Navy Matrix assisted pulsed laser evaporation direct write
US6805918B2 (en) 1999-01-27 2004-10-19 The United States Of America As Represented By The Secretary Of The Navy Laser forward transfer of rheological systems
US6815015B2 (en) 1999-01-27 2004-11-09 The United States Of America As Represented By The Secretary Of The Navy Jetting behavior in the laser forward transfer of rheological systems
AU5266900A (en) 1999-05-24 2000-12-12 Potomac Photonics, Inc. Apparatus for fabrication of miniature structures
US6792326B1 (en) 1999-05-24 2004-09-14 Potomac Photonics, Inc. Material delivery system for miniature structure fabrication
US6649861B2 (en) 2000-05-24 2003-11-18 Potomac Photonics, Inc. Method and apparatus for fabrication of miniature structures
US8741194B1 (en) 2000-09-25 2014-06-03 Voxeljet Ag Method for producing a part using a depostion technique
DE10062683A1 (de) * 2000-12-15 2002-06-20 Heidelberger Druckmasch Ag Mehrstrahl-Abtastvorrichtung
US6412143B1 (en) 2001-01-08 2002-07-02 Cheng-Lu Chen Structure of material for forming a stop at an end of lashing string
US7087200B2 (en) 2001-06-22 2006-08-08 The Regents Of The University Of Michigan Controlled local/global and micro/macro-porous 3D plastic, polymer and ceramic/cement composite scaffold fabrication and applications thereof
GB2379083A (en) 2001-08-20 2003-02-26 Seiko Epson Corp Inkjet printing on a substrate using two immiscible liquids
SG122749A1 (en) 2001-10-16 2006-06-29 Inst Data Storage Method of laser marking and apparatus therefor
GR1004059B (el) 2001-12-31 2002-11-15 Ιωαννα Ζεργιωτη Κατασκευη βιοπολυμερικων σχηματων μεσω εναποθεσης με λειζερ.
US7188492B2 (en) 2002-01-18 2007-03-13 Linde Aktiengesellschaft Plate heat exchanger
DE10210146A1 (de) 2002-03-07 2003-09-25 Aurentum Innovationstechnologi Qualitätsdruckverfahren und Druckmaschine sowie Drucksbustanz hierfür
US7316748B2 (en) 2002-04-24 2008-01-08 Wisconsin Alumni Research Foundation Apparatus and method of dispensing small-scale powders
US6896429B2 (en) 2003-03-12 2005-05-24 Printronix, Inc. Constant density printer system
US6873398B2 (en) 2003-05-21 2005-03-29 Esko-Graphics A/S Method and apparatus for multi-track imaging using single-mode beams and diffraction-limited optics
US6899988B2 (en) 2003-06-13 2005-05-31 Kodak Polychrome Graphics Llc Laser thermal metallic donors
US7277770B2 (en) 2003-07-15 2007-10-02 Huang Wen C Direct write process and apparatus
US7423286B2 (en) 2003-09-05 2008-09-09 Si2 Technologies, Inc. Laser transfer article and method of making
US7521651B2 (en) * 2003-09-12 2009-04-21 Orbotech Ltd Multiple beam micro-machining system and method
US20050095367A1 (en) 2003-10-31 2005-05-05 Babiarz Alec J. Method of noncontact dispensing of viscous material
US7540996B2 (en) 2003-11-21 2009-06-02 The Boeing Company Laser sintered titanium alloy and direct metal fabrication method of making the same
CN101120433B (zh) 2004-06-04 2010-12-08 伊利诺伊大学评议会 用于制造并组装可印刷半导体元件的方法
US7799699B2 (en) 2004-06-04 2010-09-21 The Board Of Trustees Of The University Of Illinois Printable semiconductor structures and related methods of making and assembling
US8217381B2 (en) 2004-06-04 2012-07-10 The Board Of Trustees Of The University Of Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
US7236334B2 (en) 2004-08-31 2007-06-26 Hitachi Global Storage Technologies Netherlands B.V. Repeatable ESD protection utilizing a process for unshorting a first shorting material between electrical pads and reshorting by recreating the short
US8216931B2 (en) 2005-03-31 2012-07-10 Gang Zhang Methods for forming multi-layer three-dimensional structures
US7358169B2 (en) 2005-04-13 2008-04-15 Hewlett-Packard Development Company, L.P. Laser-assisted deposition
US7784173B2 (en) 2005-12-27 2010-08-31 Palo Alto Research Center Incorporated Producing layered structures using printing
US9327056B2 (en) 2006-02-14 2016-05-03 Washington State University Bone replacement materials
US20070224235A1 (en) 2006-03-24 2007-09-27 Barron Tenney Medical devices having nanoporous coatings for controlled therapeutic agent delivery
US7608308B2 (en) 2006-04-17 2009-10-27 Imra America, Inc. P-type semiconductor zinc oxide films process for preparation thereof, and pulsed laser deposition method using transparent substrates
US20080006966A1 (en) 2006-07-07 2008-01-10 Stratasys, Inc. Method for building three-dimensional objects containing metal parts
WO2008014519A2 (en) 2006-07-28 2008-01-31 Microcontinuum, Inc. Addressable flexible patterns
US7935242B2 (en) 2006-08-21 2011-05-03 Micron Technology, Inc. Method of selectively removing conductive material
US20080099515A1 (en) 2006-10-11 2008-05-01 Nordson Corporation Thin line conformal coating apparatus and method
US8420978B2 (en) 2007-01-18 2013-04-16 The Board Of Trustees Of The University Of Illinois High throughput, low cost dual-mode patterning method for large area substrates
US20080233291A1 (en) 2007-03-23 2008-09-25 Chandrasekaran Casey K Method for depositing an inorganic layer to a thermal transfer layer
US10231344B2 (en) 2007-05-18 2019-03-12 Applied Nanotech Holdings, Inc. Metallic ink
US8221822B2 (en) 2007-07-31 2012-07-17 Boston Scientific Scimed, Inc. Medical device coating by laser cladding
US8728589B2 (en) * 2007-09-14 2014-05-20 Photon Dynamics, Inc. Laser decal transfer of electronic materials
US7534544B2 (en) 2007-10-19 2009-05-19 E.I. Du Pont De Nemours And Company Method of separating an exposed thermal transfer assemblage
GB2453774B (en) 2007-10-19 2013-02-20 Materials Solutions A method of making an article
US7938855B2 (en) 2007-11-02 2011-05-10 Boston Scientific Scimed, Inc. Deformable underlayer for stent
KR101540137B1 (ko) * 2008-01-10 2015-07-28 오르보테크 엘티디. 다중 빔 천공 시스템
US8056222B2 (en) 2008-02-20 2011-11-15 The United States Of America, As Represented By The Secretary Of The Navy Laser-based technique for the transfer and embedding of electronic components and devices
US8215371B2 (en) 2008-04-18 2012-07-10 Stratasys, Inc. Digital manufacturing with amorphous metallic alloys
EP2294240B1 (en) * 2008-06-19 2017-03-08 Utilight Ltd. Light induced patterning
US7942987B2 (en) 2008-06-24 2011-05-17 Stratasys, Inc. System and method for building three-dimensional objects with metal-based alloys
US20100022078A1 (en) 2008-07-24 2010-01-28 Joerg Rockenberger Aluminum Inks and Methods of Making the Same, Methods for Depositing Aluminum Inks, and Films Formed by Printing and/or Depositing an Aluminum Ink
KR101080672B1 (ko) * 2008-10-08 2011-11-08 한국과학기술원 패턴 전사 방법 및 패턴 전사 시스템
JP2010098526A (ja) 2008-10-16 2010-04-30 Sony Corp 受信装置、コンテンツ受信方法、およびプログラム
IL197349A0 (en) 2009-03-02 2009-12-24 Orbotech Ltd A method and system for electrical circuit repair
DE102009020774B4 (de) 2009-05-05 2011-01-05 Universität Stuttgart Verfahren zum Kontaktieren eines Halbleitersubstrates
US8262916B1 (en) 2009-06-30 2012-09-11 Microfabrica Inc. Enhanced methods for at least partial in situ release of sacrificial material from cavities or channels and/or sealing of etching holes during fabrication of multi-layer microscale or millimeter-scale complex three-dimensional structures
US20110136162A1 (en) 2009-08-31 2011-06-09 Drexel University Compositions and Methods for Functionalized Patterning of Tissue Engineering Substrates Including Bioprinting Cell-Laden Constructs for Multicompartment Tissue Chambers
US8743165B2 (en) 2010-03-05 2014-06-03 Micronic Laser Systems Ab Methods and device for laser processing
US20130029480A1 (en) 2010-04-09 2013-01-31 Frank Niklaus Free form printing of silicon micro- and nanostructures
GB201009847D0 (en) 2010-06-11 2010-07-21 Dzp Technologies Ltd Deposition method, apparatus, printed object and uses
US20120247740A1 (en) 2011-03-31 2012-10-04 Denso International America, Inc. Nested heat exchangers
WO2013010108A1 (en) 2011-07-13 2013-01-17 Nuvotronics, Llc Methods of fabricating electronic and mechanical structures
RU2539135C2 (ru) 2012-02-27 2015-01-10 Юрий Александрович Чивель Способ получения объемных изделий из порошков и устройство для его осуществления
EP2660352A1 (en) 2012-05-02 2013-11-06 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Donor sheet and method for light induced forward transfer manufacturing
GB2501918B (en) 2012-05-11 2014-06-18 Rolls Royce Plc Casing
US9044805B2 (en) 2012-05-16 2015-06-02 Apple Inc. Layer-by-layer construction with bulk metallic glasses
US9943996B2 (en) 2012-05-22 2018-04-17 University Of Southern California Process planning of meniscus shapes for fabricating smooth surfaces in mask image projection based additive manufacturing
WO2013182562A1 (en) 2012-06-04 2013-12-12 Micronic Mydata AB Optical writer for flexible foils
JP6052931B2 (ja) * 2012-06-08 2016-12-27 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置及びデバイス製造方法
US11376349B2 (en) 2012-10-05 2022-07-05 University of Pittsburgh—of the Commonwealth System of Higher Education Biodegradable iron-containing compositions, methods of preparing and applications therefor
WO2014061024A1 (en) 2012-10-21 2014-04-24 Photon Jet Ltd A multi-technology printing system
MY201381A (en) 2013-02-12 2024-02-21 Carbon3D Inc Continuous liquid interphase printing
WO2014125470A1 (en) 2013-02-18 2014-08-21 Orbotech Ltd. Two-step, direct- write laser metallization
US9249015B2 (en) 2013-02-27 2016-02-02 International Business Machines Corporation Mold for forming complex 3D MEMS components
US20150024317A1 (en) 2013-07-17 2015-01-22 Stratasys, Inc. High-Performance Consumable Materials for Electrophotography-Based Additive Manufacturing
US9023566B2 (en) 2013-07-17 2015-05-05 Stratasys, Inc. ABS part material for electrophotography-based additive manufacturing
US9029058B2 (en) 2013-07-17 2015-05-12 Stratasys, Inc. Soluble support material for electrophotography-based additive manufacturing
US10629442B2 (en) * 2013-10-14 2020-04-21 Orbotech Ltd. Lift printing of multi-composition material structures
JP6665386B2 (ja) 2013-12-15 2020-03-13 オーボテック リミテッド プリント回路配線の修復
EP2886360B1 (en) 2013-12-17 2016-07-20 Braun GmbH Method of laser induced marking of an article
US20150197063A1 (en) 2014-01-12 2015-07-16 Zohar SHINAR Device, method, and system of three-dimensional printing
US9920433B2 (en) 2014-01-13 2018-03-20 Incodema3D, LLC Additive metal deposition process
IL247946B (en) 2014-04-10 2022-08-01 Orbotech Ltd Pulsed-mode direct-write laser metallization
US10052824B2 (en) 2014-05-13 2018-08-21 Massachusetts Institute Of Technology Systems, devices, and methods for three-dimensional printing
JP2017528902A (ja) 2014-05-27 2017-09-28 オーボテック リミテッド レーザ誘起前方転写法による３ｄ構造印刷
EP3207772B1 (en) 2014-10-19 2024-04-17 Orbotech Ltd. Lift printing of conductive traces onto a semiconductor substrate
KR20170102984A (ko) 2015-01-21 2017-09-12 오르보테크 엘티디. 경사진 lift 제팅
US9887356B2 (en) 2015-01-23 2018-02-06 The Trustees Of Princeton University 3D printed active electronic materials and devices
CN110670016A (zh) 2015-02-05 2020-01-10 迈康尼股份公司 用于激光诱导向前转移且高产量的重复方法、以及供体材料回收
US9842831B2 (en) 2015-05-14 2017-12-12 Mediatek Inc. Semiconductor package and fabrication method thereof
KR20180030609A (ko) 2015-07-09 2018-03-23 오르보테크 엘티디. Lift 토출 각도의 제어

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003524074A (ja) * 2000-02-25 2003-08-12 ボストン サイエンティフィック リミテッド 医療用デバイスへの構成要素のレーザ堆積
JP2009536882A (ja) * 2006-05-12 2009-10-22 フォトン・ダイナミクス・インコーポレーテッド 堆積修復の装置及び方法
US20110188016A1 (en) 2008-09-22 2011-08-04 Asml Netherlands B.V. Lithographic apparatus, programmable patterning device and lithographic method
JP2014510419A (ja) * 2011-04-08 2014-04-24 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置、プログラマブル・パターニングデバイス、及びリソグラフィ方法
WO2013023874A1 (en) 2011-08-16 2013-02-21 Asml Netherlands B.V. Lithographic apparatus, programmable patterning device and lithographic method
WO2013124114A1 (en) 2012-02-23 2013-08-29 Asml Netherlands B.V. Device, lithographic apparatus, method for guiding radiation and device manufacturing method

Also Published As

Publication number Publication date
EP3177965A4 (en) 2018-03-14
WO2016020817A1 (en) 2016-02-11
JP6600351B2 (ja) 2019-10-30
CN111703212A (zh) 2020-09-25
US9925797B2 (en) 2018-03-27
IL249858A0 (en) 2017-03-30
IL249858B (en) 2021-01-31
CN111703212B (zh) 2022-11-18
US20170210142A1 (en) 2017-07-27
EP3177965A1 (en) 2017-06-14
CN106575077A (zh) 2017-04-19
JP2017530031A (ja) 2017-10-12
KR20170040194A (ko) 2017-04-12

Similar Documents

Publication Publication Date Title
KR102353254B1 (ko) 리프트 인쇄 시스템
US11548212B2 (en) Laser-based droplet array jetting of high viscous materials
US8916796B2 (en) Method for depositing and curing nanoparticle-based ink
US10471538B2 (en) Control of lift ejection angle
CN110997330B (zh) 打印系统和其写模块
EP1452326A2 (en) Method and apparatus for fixing a functional material onto a surface
US20100012634A1 (en) Method for cutting or perforating film
JP2020529940A5 (enExample)
TW201901887A (zh) 於未事先圖樣化基板上電器互連電路元件
SG172105A1 (en) Printing machine and method for printing a substrate
US20250144874A1 (en) Apparatus for transferring a material
US10882136B2 (en) Method and apparatus for forming a conductive track
Pique et al. Laser-induced forward transfer of functional materials: advances and future directions
US12162294B2 (en) Lift printing using thin donor foils
US20140065294A1 (en) Surface conditioning for depositing and curing nanoparticle-based ink
US5873511A (en) Apparatus and method for forming solder bonding pads
US20220347778A1 (en) Laser Printing of Solder Pastes
JP4337761B2 (ja) 液滴吐出装置、パターン形成方法、識別コードの製造方法、電気光学装置の製造方法
US20250065366A1 (en) Managing spatially-dependent modulation for laser-assisted deposition
JP2014141018A (ja) インクジェット印刷装置

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20170116

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20200528

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20210528

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20211201

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20220114

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20220114

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20241226

Start annual number: 4

End annual number: 4