JP6665386B2 - プリント回路配線の修復 - Google Patents
プリント回路配線の修復 Download PDFInfo
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- JP6665386B2 JP6665386B2 JP2014250687A JP2014250687A JP6665386B2 JP 6665386 B2 JP6665386 B2 JP 6665386B2 JP 2014250687 A JP2014250687 A JP 2014250687A JP 2014250687 A JP2014250687 A JP 2014250687A JP 6665386 B2 JP6665386 B2 JP 6665386B2
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- 230000008439 repair process Effects 0.000 title description 75
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 229910052802 copper Inorganic materials 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 19
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- 229910000881 Cu alloy Inorganic materials 0.000 claims description 6
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- 239000000463 material Substances 0.000 description 24
- 238000009792 diffusion process Methods 0.000 description 14
- 238000007639 printing Methods 0.000 description 13
- ZMHWQAHZKUPENF-UHFFFAOYSA-N 1,2-dichloro-3-(4-chlorophenyl)benzene Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC(Cl)=C1Cl ZMHWQAHZKUPENF-UHFFFAOYSA-N 0.000 description 9
- 239000004020 conductor Substances 0.000 description 9
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- 238000013461 design Methods 0.000 description 3
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- 239000012768 molten material Substances 0.000 description 3
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- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
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- 229910000431 copper oxide Inorganic materials 0.000 description 2
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
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- 230000033001 locomotion Effects 0.000 description 2
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- 229910000510 noble metal Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
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- 239000004332 silver Substances 0.000 description 2
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- CCEKAJIANROZEO-UHFFFAOYSA-N sulfluramid Chemical group CCNS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F CCEKAJIANROZEO-UHFFFAOYSA-N 0.000 description 2
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/34—Laser welding for purposes other than joining
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laser Beam Processing (AREA)
Description
本出願は、2013年12月15日に出願された米国仮特許出願61/916,233の利益を主張する。本出願は、2010年2月7日に出願されたPCT特許出願PCT/IL2010/000106の国内段階において、2011年7月26日に出願された米国特許出願13/146,200の一部継続でもある。これらの関連出願のすべてが、参照により本明細書に組み込まれる。
レーザ直接描画(LDW)技術において、レーザビームは、制御された物質の除去又は堆積により、空間的に分解された3次元構造を用いてパターン化された表面を生成するために使用される。レーザ誘起前方転写(LIFT)は、表面上にマイクロパターンを堆積するのに適用できるLDW技術である。
Claims (6)
- 回路修復の方法であって、
プリント回路基板上の第1の金属材料を有する導電配線内の欠陥のサイトを識別する段階と、
対向する第1及び第2の面と前記第2の面上に形成されて、前記第1の金属材料より高いガルバニー電位を有し、第2の金属材料を有するドナーフィルムとを有するトランスペアレントなドナー基板を、前記欠陥の前記サイトに近接して、前記第2の面を前記プリント回路基板に向けて位置決めする段階と、
レーザ放射の複数のパルスを向ける段階であり、前記ドナー基板の前記第1の面に通し、前記ドナーフィルム上に衝突して、前記プリント回路基板上の前記欠陥の前記サイト上に前記ドナーフィルムからの前記第2の金属材料の複数の溶滴の放出を誘導し、それにより前記欠陥を修復するとともにガルバニック腐食を防止する、段階と、
を備える方法。 - 前記第1の金属材料は銅を含み、前記第2の金属材料は銅合金を含む、請求項1に記載の方法。
- 犠牲金属層を前記欠陥の前記サイトで前記第2の金属材料の上に堆積する段階を備え、前記犠牲金属層は前記第2の金属材料より低いガルバニーポテンシャルを有する、請求項1または2に記載の方法。
- プリント回路基板上の第1の金属材料を含む導電配線内の欠陥を修復する装置であって、
対向する第1及び第2の面と前記第2の面上に形成されて、前記第1の金属材料より高いガルバニー電位を有し、第2の金属材料を有するドナーフィルムとを有するトランスペアレントなドナー基板と、
前記ドナー基板を、前記欠陥のサイトに近接して、前記第2の面を前記プリント回路基板に向けて位置決めする位置決めアセンブリと、
レーザ放射の複数のパルスを向けて、前記ドナー基板の前記第1の面に通し、前記ドナーフィルム上に衝突して、前記プリント回路基板上の前記欠陥の前記サイト上に前記ドナーフィルムからの前記第2の金属材料の複数の溶滴の放出を誘導し、それにより前記欠陥を修復するとともにガルバニック腐食を防止する、光学アセンブリと、
を備える装置。 - 前記第1の金属材料は銅を含み、前記第2の金属材料は銅合金を含む、請求項4に記載の装置。
- 前記光学アセンブリは、前記欠陥の前記サイトで前記第2の金属材料の上への犠牲金属層の堆積を誘導し、前記犠牲金属層は前記第2の金属材料より低いガルバニーポテンシャルを有する、請求項4または5に記載の装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361916233P | 2013-12-15 | 2013-12-15 | |
US61/916,233 | 2013-12-15 |
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JP2019194619A Division JP7130614B2 (ja) | 2013-12-15 | 2019-10-25 | プリント回路配線の修復 |
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JP2015144252A JP2015144252A (ja) | 2015-08-06 |
JP6665386B2 true JP6665386B2 (ja) | 2020-03-13 |
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JP2014250687A Active JP6665386B2 (ja) | 2013-12-15 | 2014-12-11 | プリント回路配線の修復 |
JP2019194619A Active JP7130614B2 (ja) | 2013-12-15 | 2019-10-25 | プリント回路配線の修復 |
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JP (2) | JP6665386B2 (ja) |
KR (2) | KR102289386B1 (ja) |
CN (1) | CN104797087B (ja) |
TW (1) | TWI651992B (ja) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6665386B2 (ja) * | 2013-12-15 | 2020-03-13 | オーボテック リミテッド | プリント回路配線の修復 |
KR102353254B1 (ko) | 2014-08-07 | 2022-01-18 | 오르보테크 엘티디. | 리프트 인쇄 시스템 |
WO2016063270A1 (en) | 2014-10-19 | 2016-04-28 | Orbotech Ltd. | Llift printing of conductive traces onto a semiconductor substrate |
KR102282860B1 (ko) | 2015-01-19 | 2021-07-28 | 오르보테크 엘티디. | 희생 지지부를 가진 3차원 금속 구조물의 프린팅 |
US10471538B2 (en) | 2015-07-09 | 2019-11-12 | Orbotech Ltd. | Control of lift ejection angle |
KR102546450B1 (ko) * | 2015-11-22 | 2023-06-21 | 오르보테크 엘티디. | 프린팅된 3-차원 구조들의 표면 특성들의 제어 |
TW202224211A (zh) * | 2016-03-31 | 2022-06-16 | 美商伊雷克托科學工業股份有限公司 | 用於導電電鍍的雷射種晶之方法 |
KR20180035127A (ko) * | 2016-09-28 | 2018-04-05 | 오르보테크 엘티디. | 고-점도 프린팅 방법 및 장치 |
TW201901887A (zh) | 2017-05-24 | 2019-01-01 | 以色列商奧寶科技股份有限公司 | 於未事先圖樣化基板上電器互連電路元件 |
CN107995793A (zh) * | 2017-11-27 | 2018-05-04 | 合肥通彩自动化设备有限公司 | 一种缺陷玻璃板印刷修复装置及方法 |
WO2019138404A1 (en) * | 2018-01-11 | 2019-07-18 | Orbotech Ltd. | Direct printing of embedded resistors |
EP3521483A1 (en) * | 2018-02-06 | 2019-08-07 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Lift deposition apparatus and method |
EP3624571A1 (en) | 2018-09-14 | 2020-03-18 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | A process for the manufacturing of printed conductive tracks on an object and 3d printed electronics |
SG11202107982WA (en) * | 2019-02-11 | 2021-08-30 | Univ Nanyang Tech | Method of fabricating an interfacial structure and a fabricated interfacial structure |
KR20220004975A (ko) * | 2019-05-01 | 2022-01-12 | 아이오 테크 그룹 엘티디. | 3d 프린팅을 사용하여 칩을 상부 커넥터에 전기 연결하는 방법 |
JP7287124B2 (ja) | 2019-06-03 | 2023-06-06 | 株式会社リコー | 光吸収材を飛翔させる装置、立体造形物を造形する装置、光吸収材を飛翔させる方法 |
CN110972406B (zh) * | 2019-12-04 | 2020-07-28 | 广东工业大学 | 一种用于精细线路的修复方法 |
CN110753454B (zh) * | 2019-12-04 | 2020-08-18 | 广东工业大学 | 一种用于精细线路的成型及修复方法 |
CN114850503A (zh) * | 2022-04-18 | 2022-08-05 | 青岛理工大学 | 激光辅助电场驱动喷射沉积修复叶片气膜孔的装置及方法 |
TWI819583B (zh) * | 2022-04-27 | 2023-10-21 | 東捷科技股份有限公司 | 電路基板的修補方法 |
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---|---|---|---|---|
US4880959A (en) * | 1988-10-26 | 1989-11-14 | International Business Machines Corporation | Process for interconnecting thin-film electrical circuits |
JPH1098251A (ja) * | 1996-09-23 | 1998-04-14 | Matsushita Electric Ind Co Ltd | 蒸着された金属配線および誘電配線のuvレーザーアニーリングおよび洗浄 |
AU5266900A (en) * | 1999-05-24 | 2000-12-12 | Potomac Photonics, Inc. | Apparatus for fabrication of miniature structures |
JP3713506B1 (ja) * | 2005-03-15 | 2005-11-09 | 財団法人北九州産業学術推進機構 | 回路基板用配線パターン形成装置および配線パターンの補修方法 |
IL197349A0 (en) * | 2009-03-02 | 2009-12-24 | Orbotech Ltd | A method and system for electrical circuit repair |
JP6665386B2 (ja) * | 2013-12-15 | 2020-03-13 | オーボテック リミテッド | プリント回路配線の修復 |
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2014
- 2014-12-11 JP JP2014250687A patent/JP6665386B2/ja active Active
- 2014-12-15 CN CN201410778053.6A patent/CN104797087B/zh active Active
- 2014-12-15 KR KR1020140180464A patent/KR102289386B1/ko active IP Right Grant
- 2014-12-15 TW TW103143716A patent/TWI651992B/zh active
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2019
- 2019-10-25 JP JP2019194619A patent/JP7130614B2/ja active Active
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- 2021-07-26 KR KR1020210098090A patent/KR102407668B1/ko active IP Right Grant
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Publication number | Publication date |
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JP7130614B2 (ja) | 2022-09-05 |
JP2015144252A (ja) | 2015-08-06 |
KR20150070028A (ko) | 2015-06-24 |
CN104797087A (zh) | 2015-07-22 |
TWI651992B (zh) | 2019-02-21 |
KR102289386B1 (ko) | 2021-08-12 |
JP2020061553A (ja) | 2020-04-16 |
KR102407668B1 (ko) | 2022-06-10 |
CN104797087B (zh) | 2019-10-01 |
TW201536139A (zh) | 2015-09-16 |
KR20210096038A (ko) | 2021-08-04 |
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |