TWI651992B - 印刷電路軌跡線之修復 - Google Patents

印刷電路軌跡線之修復 Download PDF

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Publication number
TWI651992B
TWI651992B TW103143716A TW103143716A TWI651992B TW I651992 B TWI651992 B TW I651992B TW 103143716 A TW103143716 A TW 103143716A TW 103143716 A TW103143716 A TW 103143716A TW I651992 B TWI651992 B TW I651992B
Authority
TW
Taiwan
Prior art keywords
substrate
donor
donor film
printed circuit
pulse
Prior art date
Application number
TW103143716A
Other languages
English (en)
Chinese (zh)
Other versions
TW201536139A (zh
Inventor
麥克 奇諾
茲維 寇特勒
蕭山納 奈吉德
Original Assignee
奧寶科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 奧寶科技有限公司 filed Critical 奧寶科技有限公司
Publication of TW201536139A publication Critical patent/TW201536139A/zh
Application granted granted Critical
Publication of TWI651992B publication Critical patent/TWI651992B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/34—Laser welding for purposes other than joining
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
TW103143716A 2013-12-15 2014-12-15 印刷電路軌跡線之修復 TWI651992B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361916233P 2013-12-15 2013-12-15
US61/916,233 2013-12-15

Publications (2)

Publication Number Publication Date
TW201536139A TW201536139A (zh) 2015-09-16
TWI651992B true TWI651992B (zh) 2019-02-21

Family

ID=53516975

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103143716A TWI651992B (zh) 2013-12-15 2014-12-15 印刷電路軌跡線之修復

Country Status (4)

Country Link
JP (2) JP6665386B2 (ja)
KR (2) KR102289386B1 (ja)
CN (1) CN104797087B (ja)
TW (1) TWI651992B (ja)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6665386B2 (ja) * 2013-12-15 2020-03-13 オーボテック リミテッド プリント回路配線の修復
JP6600351B2 (ja) 2014-08-07 2019-10-30 オルボテック リミテッド Ｌｉｆｔプリント・システム
US10193004B2 (en) 2014-10-19 2019-01-29 Orbotech Ltd. LIFT printing of conductive traces onto a semiconductor substrate
KR102282860B1 (ko) 2015-01-19 2021-07-28 오르보테크 엘티디. 희생 지지부를 가진 3차원 금속 구조물의 프린팅
KR20180030609A (ko) 2015-07-09 2018-03-23 오르보테크 엘티디. Lift 토출 각도의 제어
KR102546450B1 (ko) * 2015-11-22 2023-06-21 오르보테크 엘티디. 프린팅된 3-차원 구조들의 표면 특성들의 제어
WO2017173281A1 (en) * 2016-03-31 2017-10-05 Electro Scientific Industries, Inc. Laser-seeding for electro-conductive plating
KR20180035127A (ko) * 2016-09-28 2018-04-05 오르보테크 엘티디. 고-점도 프린팅 방법 및 장치
TW201901887A (zh) 2017-05-24 2019-01-01 以色列商奧寶科技股份有限公司 於未事先圖樣化基板上電器互連電路元件
CN107995793A (zh) * 2017-11-27 2018-05-04 合肥通彩自动化设备有限公司 一种缺陷玻璃板印刷修复装置及方法
CN111684550A (zh) * 2018-01-11 2020-09-18 奥宝科技股份有限公司 嵌入式电阻的直接印刷
EP3521483A1 (en) * 2018-02-06 2019-08-07 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Lift deposition apparatus and method
EP3624571A1 (en) * 2018-09-14 2020-03-18 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO A process for the manufacturing of printed conductive tracks on an object and 3d printed electronics
JP2022521170A (ja) * 2019-02-11 2022-04-06 ナンヤン・テクノロジカル・ユニバーシティー 界面構造体を作製する方法および作製された界面構造体
EP3939394A1 (en) * 2019-05-01 2022-01-19 IO Tech Group, Ltd. Method to electrically connect chip with top connectors using 3d printing
JP7287124B2 (ja) 2019-06-03 2023-06-06 株式会社リコー 光吸収材を飛翔させる装置、立体造形物を造形する装置、光吸収材を飛翔させる方法
CN110972406B (zh) * 2019-12-04 2020-07-28 广东工业大学 一种用于精细线路的修复方法
CN110753454B (zh) * 2019-12-04 2020-08-18 广东工业大学 一种用于精细线路的成型及修复方法
CN114850503A (zh) * 2022-04-18 2022-08-05 青岛理工大学 激光辅助电场驱动喷射沉积修复叶片气膜孔的装置及方法
TWI819583B (zh) * 2022-04-27 2023-10-21 東捷科技股份有限公司 電路基板的修補方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4880959A (en) * 1988-10-26 1989-11-14 International Business Machines Corporation Process for interconnecting thin-film electrical circuits
JPH1098251A (ja) * 1996-09-23 1998-04-14 Matsushita Electric Ind Co Ltd 蒸着された金属配線および誘電配線のｕｖレーザーアニーリングおよび洗浄
US6583381B1 (en) * 1999-05-24 2003-06-24 Potomac Photonics, Inc. Apparatus for fabrication of miniature structures
JP3713506B1 (ja) * 2005-03-15 2005-11-09 財団法人北九州産業学術推進機構 回路基板用配線パターン形成装置および配線パターンの補修方法
IL197349A0 (en) * 2009-03-02 2009-12-24 Orbotech Ltd A method and system for electrical circuit repair
JP6665386B2 (ja) * 2013-12-15 2020-03-13 オーボテック リミテッド プリント回路配線の修復

Also Published As

Publication number Publication date
KR102289386B1 (ko) 2021-08-12
JP2020061553A (ja) 2020-04-16
JP7130614B2 (ja) 2022-09-05
TW201536139A (zh) 2015-09-16
KR20150070028A (ko) 2015-06-24
CN104797087B (zh) 2019-10-01
CN104797087A (zh) 2015-07-22
JP6665386B2 (ja) 2020-03-13
KR20210096038A (ko) 2021-08-04
JP2015144252A (ja) 2015-08-06
KR102407668B1 (ko) 2022-06-10

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