JP2020529940A5 - - Google Patents

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Publication number
JP2020529940A5
JP2020529940A5 JP2020507075A JP2020507075A JP2020529940A5 JP 2020529940 A5 JP2020529940 A5 JP 2020529940A5 JP 2020507075 A JP2020507075 A JP 2020507075A JP 2020507075 A JP2020507075 A JP 2020507075A JP 2020529940 A5 JP2020529940 A5 JP 2020529940A5
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JP
Japan
Prior art keywords
printing system
imaging surface
station
polymer
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2020507075A
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English (en)
Japanese (ja)
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JP2020529940A (ja
Filing date
Publication date
Priority claimed from GBGB1712726.7A external-priority patent/GB201712726D0/en
Application filed filed Critical
Publication of JP2020529940A publication Critical patent/JP2020529940A/ja
Publication of JP2020529940A5 publication Critical patent/JP2020529940A5/ja
Priority to JP2022148364A priority Critical patent/JP2022188090A/ja
Pending legal-status Critical Current

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JP2020507075A 2017-08-08 2018-08-08 印刷システム及びその書込みモジュール Pending JP2020529940A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022148364A JP2022188090A (ja) 2017-08-08 2022-09-16 印刷システム及びその書込みモジュール

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB1712726.7A GB201712726D0 (en) 2017-08-08 2017-08-08 Electric current and heat mitigation in a printing machine writing module
GB1712726.7 2017-08-08
PCT/IB2018/055971 WO2019030694A1 (en) 2017-08-08 2018-08-08 PRINTING SYSTEM AND WRITING MODULE

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022148364A Division JP2022188090A (ja) 2017-08-08 2022-09-16 印刷システム及びその書込みモジュール

Publications (2)

Publication Number Publication Date
JP2020529940A JP2020529940A (ja) 2020-10-15
JP2020529940A5 true JP2020529940A5 (enExample) 2021-08-19

Family

ID=59894977

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2020507075A Pending JP2020529940A (ja) 2017-08-08 2018-08-08 印刷システム及びその書込みモジュール
JP2022148364A Pending JP2022188090A (ja) 2017-08-08 2022-09-16 印刷システム及びその書込みモジュール

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022148364A Pending JP2022188090A (ja) 2017-08-08 2022-09-16 印刷システム及びその書込みモジュール

Country Status (7)

Country Link
US (1) US11865782B2 (enExample)
EP (1) EP3665015B1 (enExample)
JP (2) JP2020529940A (enExample)
CN (1) CN110997330B (enExample)
ES (1) ES2902045T3 (enExample)
GB (1) GB201712726D0 (enExample)
WO (1) WO2019030694A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3842864B1 (en) * 2019-12-23 2022-08-03 Cubicure GmbH Systems and methods for lithography-based additive manufacturing three-dimensional (3d) structures
CN112531461A (zh) * 2020-12-30 2021-03-19 江西铭德半导体科技有限公司 一种可控横向光场的多结型半导体激光器及其制造方法
US12300969B2 (en) * 2021-01-20 2025-05-13 Sony Group Corporation Surface emitting laser, electronic device, and method for manufacturing surface emitting laser
FR3124030A1 (fr) * 2021-06-09 2022-12-16 Sidel Participations Emetteur laser pour station de chauffage
CN113591300B (zh) * 2021-07-29 2024-03-15 深圳市创想三维科技股份有限公司 3d打印文件的生成方法、装置、计算机设备和存储介质
US20230054034A1 (en) * 2021-08-23 2023-02-23 Palo Alto Research Center Incorporated 3d package for semiconductor thermal management
US11827037B2 (en) * 2021-08-23 2023-11-28 Xerox Corporation Semiconductor array imager for printing systems
US11984701B2 (en) * 2021-08-23 2024-05-14 Xerox Corporation System for electronically controlling and driving independently addressable semiconductor lasers
US12366815B2 (en) * 2021-08-23 2025-07-22 Xerox Corporation Focusing optics for use with semiconductor lasers for imaging applications
US20230056905A1 (en) * 2021-08-23 2023-02-23 Palo Alto Research Center Incorporated Independently-addressable high power surface-emitting laser array with tight-pitch packing
TWI785780B (zh) 2021-09-06 2022-12-01 虹光精密工業股份有限公司 發光晶片打件偏差之調節方法及列印頭
CN113733546A (zh) * 2021-09-13 2021-12-03 数造科技(湖南)有限公司 一种3d发光字打印的自动化一体成型设备及方法
CN116277938A (zh) * 2023-02-09 2023-06-23 京东方科技集团股份有限公司 一种光固化3d打印机及打印方法
FR3149229B1 (fr) * 2023-05-31 2025-04-25 Sidel Participations Unité de traitement thermique de préformes comprenant des éléments de chauffage connectés en série
WO2025057054A1 (en) 2023-09-11 2025-03-20 Landa Labs (2012) Ltd Method and apparatus for 3d printing
GB2633405A (en) * 2023-09-11 2025-03-12 Landa Labs 2012 Ltd Method an apparatus for 3D printing

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61118273A (ja) * 1984-11-15 1986-06-05 Erumu:Kk レ−ザ−式インクジエツトプリンタ
US5600363A (en) * 1988-12-28 1997-02-04 Kyocera Corporation Image forming apparatus having driving means at each end of array and power feeding substrate outside head housing
JPH03114341U (enExample) * 1990-03-12 1991-11-25
US5572540A (en) * 1992-08-11 1996-11-05 University Of New Mexico Two-dimensional opto-electronic switching arrays
AUPO799197A0 (en) 1997-07-15 1997-08-07 Silverbrook Research Pty Ltd Image processing method and apparatus (ART01)
FR2761537B1 (fr) 1997-04-01 1999-06-11 Thomson Csf Laser comprenant un empilement de diodes laser epitaxiees compris entre deux miroirs de bragg
US6493371B1 (en) * 1998-04-14 2002-12-10 Bandwidth9, Inc. Vertical cavity apparatus with tunnel junction
US6487230B1 (en) * 1998-04-14 2002-11-26 Bandwidth 9, Inc Vertical cavity apparatus with tunnel junction
US6635861B1 (en) * 1998-10-22 2003-10-21 Wavefront Research, Inc. Relaxed tolerance optical interconnect system having a GRIN rod lens
US6863444B2 (en) * 2000-12-26 2005-03-08 Emcore Corporation Housing and mounting structure
US6799902B2 (en) * 2000-12-26 2004-10-05 Emcore Corporation Optoelectronic mounting structure
US20030057363A1 (en) * 2000-12-26 2003-03-27 Anderson Gene R. Optical power control system
GB0121308D0 (en) * 2001-09-03 2001-10-24 Thomas Swan & Company Ltd Optical processing
JP2003080761A (ja) * 2001-09-12 2003-03-19 Fuji Xerox Co Ltd 画像形成方法及び装置
US7002613B2 (en) * 2002-09-06 2006-02-21 Heidelberger Druckmaschinen Ag Method for printing an image on a printing substrate and device for inputting energy to a printing-ink carrier
JP2004122512A (ja) 2002-10-01 2004-04-22 Sanyo Electric Co Ltd プリントヘッド
US6771680B2 (en) * 2002-10-22 2004-08-03 Agilent Technologies, Inc Electrically-pumped, multiple active region vertical-cavity surface-emitting laser (VCSEL)
US7796885B2 (en) * 2002-11-05 2010-09-14 Lightfleet Corporation Distribution optical elements and compound collecting lenses for broadcast optical interconnect
US6936486B2 (en) 2002-11-19 2005-08-30 Jdsu Uniphase Corporation Low voltage multi-junction vertical cavity surface emitting laser
JP5017804B2 (ja) * 2005-06-15 2012-09-05 富士ゼロックス株式会社 トンネル接合型面発光半導体レーザ装置およびその製造方法
US7936953B2 (en) * 2005-07-15 2011-05-03 Xyratex Technology Limited Optical printed circuit board and manufacturing method
DE102006010728A1 (de) 2005-12-05 2007-06-06 Osram Opto Semiconductors Gmbh Halbleiterbauelement und Laservorrichtung
JP4884810B2 (ja) 2006-03-17 2012-02-29 古河電気工業株式会社 半導体発光素子及びその製造方法
JP4697077B2 (ja) * 2006-07-12 2011-06-08 日立電線株式会社 光モジュール
JP5144243B2 (ja) * 2006-12-28 2013-02-13 富士フイルム株式会社 画像形成方法及び画像形成装置
CN101742980B (zh) * 2007-08-06 2014-04-16 花王株式会社 液体涂敷装置
DE602007011610D1 (de) * 2007-09-14 2011-02-10 Punch Graphix Int Nv Lichtemittierendes Array zum Drucken oder Kopieren
JP2009260205A (ja) * 2008-03-17 2009-11-05 Ricoh Co Ltd 光源装置、光走査装置及び画像形成装置
DE102008030818B4 (de) * 2008-06-30 2022-03-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Oberflächenemittierender Halbleiterlaser mit mehreren aktiven Zonen
CN102461340B (zh) 2009-05-14 2014-10-22 4233999加拿大股份有限公司 利用发光二极管单片阵列来提供高分辨率图像的系统和方法
US9160450B2 (en) * 2011-09-23 2015-10-13 Te Connectivity Nederland B.V. Multi-channel transceiver
JP2013165188A (ja) 2012-02-10 2013-08-22 Oki Data Corp 半導体発光装置、光源装置、画像形成装置及び画像表示装置
JP2015524756A (ja) * 2012-06-15 2015-08-27 ハイデルベルガー ドルツクマシーネン アクチエンゲゼルシヤフトHeidelberger Druckmaschinen AG 印刷液を被印刷物に間接的に転写する方法
US9573360B2 (en) * 2013-09-09 2017-02-21 Xerox Corporation Thermally conductive aqueous transfix blanket
RU2674511C1 (ru) * 2013-12-17 2018-12-11 Эос Гмбх Электро Оптикал Системз Система лазерной печати
NZ727729A (en) * 2014-05-17 2017-11-24 Sun Tool Corp Roller transfer application method and application device for hot-melt adhesive
US20160072258A1 (en) 2014-09-10 2016-03-10 Princeton Optronics Inc. High Resolution Structured Light Source
JP2016078238A (ja) 2014-10-09 2016-05-16 株式会社リコー プリントヘッド及び画像形成装置
CA2986514C (en) 2015-05-27 2023-01-03 Landa Labs (2012) Ltd. Imaging device
GB201509080D0 (en) * 2015-05-27 2015-07-08 Landa Labs 2012 Ltd Coating apparatus
IL255934B (en) 2015-05-27 2022-08-01 Landa Labs 2012 Ltd Method and apparatus for applying a polymer film to regions of the surface of a substrate
US10913835B2 (en) * 2016-11-30 2021-02-09 Landa Labs (2012) Ltd. Thermal transfer printing
US11125664B2 (en) 2017-12-04 2021-09-21 Montana Instruments Corporation Analytical instruments, methods, and components
US10509128B1 (en) * 2019-04-12 2019-12-17 K Laser Technology, Inc. Programmable pattern optical projector for depth detection

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