CN109581674B - 一种锡膏激光诱导前向转移设备与方法 - Google Patents
一种锡膏激光诱导前向转移设备与方法 Download PDFInfo
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Abstract
本发明一种锡膏激光诱导前向转移设备与方法,该设备包括激光器、光束整形模块、光路调节模块、锡膏转移模块以及计算机控制系统,所述激光器与光束整形模块相连接,紧接着光路调节模块,而锡膏转移模块位于光路调节模块的下方。光束整形模块包括扩束透镜、光圈、平顶光束整形器以及空间光调制器。光路调节模块包括二维振镜和f‑θ透镜计。所述锡膏转移模块由透明基片、锡膏薄膜、夹具、Z轴升降台、接收基片、XYZ精密移动平台组成。计算机控制系统由计算机和其他设备的驱动器组成。本发明可以实现无需掩模、非接触式的高精度锡膏转移。能大大缩短生产周期,降低生产成本。
Description
技术领域
本发明是利用激光诱导前向转移技术(Laser induced forward transfer,简称LIFT)来实现锡膏转移的工艺和设备,属于激光应用及锡膏印刷技术领域,尤其涉及一种锡膏激光诱导前向转移设备与方法。
背景技术
SMT(Surface Mount Technology)是一种将无引脚或短引线表面封装元器件,如电阻、电容、晶体管、集成电路等等安装到印刷电路板上,并通过回流焊形成电气联结的电路装连技术。而锡膏印刷则是整个SMT加工过程的第一步。目前的锡膏印刷技术主要是采用丝网印刷的方法,而丝网印刷对于不同的PCB板往往需要制作不同的丝网,相对成本高,周期长,并不能满足小规模快速生产的需求。
激光诱导前向转移技术(LIFT技术)是一种材料沉积技术。LIFT技术是将目标材料事先以薄膜的形式涂抹到透明基片上,并让目标材料薄膜面朝下方与接收基片保持一定距离,让激光透过透明基片照射到目标材料上,并引发局部区域内的材料转移。因此,LIFT技术是一种无需掩模、非接触式的高精度微量转移技术。
由于LIFT技术无需制备掩模,一旦应用于锡膏印刷中,可以大大缩短小规模生产中的生产周期,并降低生产成本,尤其适合于实验室研究以及工业小规模试产。而激光振镜的使用,使得光束能以远超机械运动的速度进行扫描,从而满足大规模生产中对于生产速度的需求。
发明内容
本发明的目的在于克服上述现有技术的缺点和不足,提供一种锡膏激光诱导前向转移设备与方法。
本发明通过下述技术方案实现:
一种锡膏激光诱导前向转移设备,包括激光单元、计算机控制系统14,其特征在于:还包括锡膏转移模块;所述计算机控制系统14控制激光单元的激光束出射以及锡膏转移模块的运动;
所述锡膏转移模块包括透明基片8、夹具10、Z轴升降台11、接收基片12、XYZ轴移动平台13;
所述透明基片8的下表面为用于容纳锡膏薄膜9的凹面;
所述接收基片12和Z轴升降台11放置在XYZ轴移动平台13上,以调整接收基片12与激光束光斑的相对工位;
所述夹具10安装在Z轴升降台11上;透明基片8的凹面朝下,并平行置于接收基片12的上方,所述夹具10夹持透明基片8的边缘,由Z轴升降台11搭载其在接收基片12上方垂直升降运动,以调整透明基片8相对于接收基片12之间的距离。
所述激光单元包括依次光路连接的激光器1、光束整形模块、光路调节模块;
所述激光器1、光束整形模块、光路调节模块、锡膏转移模块分别连接计算机控制系统14。
所述光束整形模块包括依次光路连接的扩束透镜2、光圈3、平顶光束整形器4、空间光调制器5;
所述光路调节模块包括依次光路连接的二维振镜6、f-θ透镜7。
所述容纳锡膏薄膜9的凹面深度为20μm~150μm。
所述接收基片12为PCB板。
一种锡膏激光诱导前向转移方法,其包括如下步骤:
步骤1:将待印刷的接收基片12的电路图纸导入计算机控制系统14,计算机控制系统14根据待印刷接收基片12上焊盘的位置规划激光15的扫描路线、扫描速度,并根据每个焊盘的形状尺寸选择激光参数以及光束整形模块的参数;
步骤2:根据实际生产中所需锡膏的厚度,选择所需凹面深度的透明基片8,利用刮涂的方法将锡膏涂抹在整个凹面内,在凹面内形成锡膏薄膜9;将锡膏薄膜9面朝下方,再将透明基片8固定在Z轴升降台11所连接的夹具10上,调整透明基片8和接收基片12的距离;
步骤3:在每一次激光脉冲发射前,计算机控制系统14根据预先规划好的路线,控制二维振镜6的转动,改变激光光束路径;
步骤4:激光器1发出的光束经过光束整形模块整形后,进入由二维振镜6和f-θ透镜7组成的光路调节模块,经过二维振镜6改变光路的走向后,最终通过f-θ透镜7后聚焦到步骤2所述锡膏薄膜9上方;激光15通过透明基片8,被锡膏薄膜9吸收后,导致照射部位部分汽化,在锡膏薄膜9内部形成气泡16,并且随着气泡16不断的膨胀,会推动周围未汽化部分冲向接收基片12;并在透明基片8和接收基片12之间形成稳定的桥式结构17;
步骤5:重复进行步骤3和步骤4直至接收基片12上所有焊盘和透明基片8之间都形成一个稳定的桥式结构17;之后,计算机控制系统14控制Z轴升降台11上升,使透明基片8垂直离开接收基片12,使所有桥式结构17断裂,留下点状锡膏18,进而整个接收基片12印刷完成。
本发明相对于现有技术,具有如下的优点及效果:
本发明锡膏转移模块包括透明基片8、夹具10、Z轴升降台11、接收基片12、XYZ轴移动平台13;在透明基片8的下表面开设有用于容纳锡膏薄膜9的凹面;将接收基片12和Z轴升降台11放置在XYZ轴移动平台13上,以调整接收基片12与激光束光斑的相对工位;作业时,将夹具10安装在Z轴升降台11上,透明基片8的凹面朝下,并平行置于接收基片12的上方,夹具10夹持透明基片8的边缘,由Z轴升降台11搭载其在接收基片12上方垂直升降运动,以调整透明基片8相对于接收基片12之间的距离。通过高能量的脉冲激光,在激光及移动平台的协调运动下,将透明基片8上的锡膏薄膜9按照规划路径转移到接收基片上,实现精确控制的锡膏的局部转移和印刷。
本发明巧妙的采用了在透明基片8的下表面开设有用于容纳锡膏薄膜9的凹面,并将接收基片12和Z轴升降台11放置在XYZ轴移动平台13上,以调整接收基片12与激光束光斑的相对工位,结合高能量的脉冲激光,实现无需掩模、非接触式的高精度锡膏转移方案。
本发明技术手段简便易行,有效简化了生产工艺,而且大大缩短生产周期,降低了生产成本。
附图说明
图1是本发明锡膏激光诱导前向转移设备的结构示意图。
图2是图1中锡膏转移模块的结构示意图。
图3是本发明锡膏激光诱导前向转移工艺的原理图解。
图4是采用本发明转移的点状锡膏在共聚焦显微镜下的照片。
具体实施方式
下面结合具体实施例对本发明作进一步具体详细描述。
实施例
如图1-4所示。本发明公开了一种锡膏激光诱导前向转移设备,包括激光单元、计算机控制系统14,其特征在于:还包括锡膏转移模块;所述计算机控制系统14控制激光单元的激光束出射以及锡膏转移模块的运动;
所述锡膏转移模块包括透明基片8、夹具10、Z轴升降台11、接收基片12、XYZ轴移动平台13;
所述透明基片8的下表面为用于容纳锡膏薄膜9的凹面;透明基片8为石英玻璃或者其他透明物体。
所述接收基片12和Z轴升降台11放置在XYZ轴移动平台13上,以调整接收基片12与激光束光斑的相对工位;
所述夹具10安装在Z轴升降台11上;透明基片8的凹面朝下,并平行置于接收基片12的上方,所述夹具10夹持透明基片8的边缘,由Z轴升降台11搭载其在接收基片12上方垂直升降运动,以调整透明基片8相对于接收基片12之间的距离。
所述激光单元包括依次光路连接的激光器1、光束整形模块、光路调节模块;激光器1、光束整形模块、光路调节模块、锡膏转移模块分别连接计算机控制系统14。光束整形模块包括依次光路连接的扩束透镜2、光圈3、平顶光束整形器4、空间光调制器5;光束经过扩束透镜2、光圈3后,可以去除光斑的杂质,经过平顶光束整形器4后可以使原本高斯能量分布的光斑变成均匀的圆形分布或是方形分布。然后经过空间光调制器5,在计算机控制系统14的操控下,空间光调制器5会将光斑转换成用户需要的形状尺寸。
所述光路调节模块包括依次光路连接的二维振镜6、f-θ透镜7。计算机控制系统14通过控制二维振镜6来实现光束在XY平面内位置的移动,并最终通过f-θ透镜7聚焦在目标平面上。f-θ透镜7有355nm增透膜或是532nm,扫描角±15°,有效焦距120mm。
所述容纳锡膏薄膜9的凹面深度为20μm~150μm。
所述接收基片12为PCB板,即需要印刷锡膏的PCB板。
锡膏薄膜9采用锡膏为5~7号粉锡膏,当为5号粉时锡膏的颗粒尺寸为15μm~25μm,当为6号粉时锡膏的颗粒尺寸为5μm~15μm,当为7号粉时颗粒尺寸为2μm~11μm。
激光器1为脉冲激光器,输出光源的波长为355nm或532nm,脉冲宽度为10ns~50ns,重复频率10khz~100khz。
本发明利用激光前向转移方法,进行锡膏转移的具体原理如图3所示,激光器1发出的激光通过光束整形模块以及光路调节模块后透过透明基片8照射在锡膏薄膜9上,使得锡膏部分气化,产生气泡16。随着气泡16持续膨胀,锡膏薄膜9会和接收基片12相接触,并形成稳定的桥式结构17。当透明基片8垂直离开接收基片12时,桥式结构17会不断拉升,直到结构断裂,并在接收基片12上留下点状锡膏18。
图4显示了运用本发明所转移的点状锡膏在共聚焦显微镜下的图像。
本发明锡膏激光诱导前向转移方法,可通过如下步骤实现:
步骤1:将待印刷的接收基片12的电路图纸导入计算机控制系统14,计算机控制系统14根据待印刷接收基片12上焊盘的位置规划激光15的扫描路线、扫描速度,并根据每个焊盘的形状尺寸选择激光参数以及光束整形模块的参数;
步骤2:根据实际生产中所需锡膏的厚度,选择所需凹面深度的透明基片8,利用刮涂的方法将锡膏涂抹在整个凹面内,在凹面内形成锡膏薄膜9;将锡膏薄膜9面朝下方,再将透明基片8固定在Z轴升降台11所连接的夹具10上,调整透明基片8和接收基片12的距离;距离调整完成后,便可以开始锡膏的转移。
步骤3:在每一次激光脉冲发射前,计算机控制系统14根据预先规划好的路线,控制二维振镜6的转动,改变激光光束路径;并且按照预设的激光参数,以及光束整形模块的参数,调整激光光斑的能量分布;
步骤4:调整好参数后,激光器1发出的光束经过光束整形模块整形后,进入由二维振镜6和f-θ透镜7组成的光路调节模块,经过二维振镜6改变光路的走向后,最终通过f-θ透镜7后聚焦到步骤2所述锡膏薄膜9上方;激光15通过透明基片8,被锡膏薄膜9吸收后,导致照射部位部分汽化,在锡膏薄膜9内部形成气泡16,并且随着气泡16不断的膨胀,会推动周围未汽化部分冲向接收基片12;并在透明基片8和接收基片12之间形成稳定的桥式结构17;
步骤5:重复进行步骤3和步骤4直至接收基片12上所有焊盘和透明基片8之间都形成一个稳定的桥式结构17;之后,计算机控制系统14控制Z轴升降台11上升,使透明基片8垂直离开接收基片12,使所有桥式结构17断裂,留下点状锡膏18,进而整个接收基片12印刷完成。
如上所述,便可较好地实现本发明。
本发明的实施方式并不受上述实施例的限制,其他任何未背离本发明的精神实质与原理下所作的改变、修饰、替代、组合、简化,均应为等效的置换方式,都包含在本发明的保护范围之内。
Claims (3)
1.一种锡膏激光诱导前向转移方法,其特征在于包括锡膏激光诱导前向转移设备,该设备包括激光单元、计算机控制系统(14)和锡膏转移模块;所述计算机控制系统(14)控制激光单元的激光束出射以及锡膏转移模块的运动;
所述锡膏转移模块包括透明基片(8)、夹具(10)、Z轴升降台(11)、接收基片(12)、XYZ轴移动平台(13);
所述透明基片(8)的下表面为用于容纳锡膏薄膜(9)的凹面;
所述接收基片(12)和Z轴升降台(11)放置在XYZ轴移动平台(13)上,以调整接收基片(12)与激光束光斑的相对工位;
所述夹具(10)安装在Z轴升降台(11)上;透明基片(8)的凹面朝下,并平行置于接收基片(12)的上方,所述夹具(10)夹持透明基片(8)的边缘,由Z轴升降台(11)搭载其在接收基片(12)上方垂直升降运动,以调整透明基片(8)相对于接收基片(12)之间的距离;
所述激光单元包括依次光路连接的激光器(1)、光束整形模块、光路调节模块;
所述激光器(1)、光束整形模块、光路调节模块、锡膏转移模块分别连接计算机控制系统(14);
所述光束整形模块包括依次光路连接的扩束透镜(2)、光圈(3)、平顶光束整形器(4)、空间光调制器(5);
所述光路调节模块包括依次光路连接的二维振镜(6)、f-θ透镜(7);
所述锡膏激光诱导前向转移方法通过下述步骤实现:
步骤(1):将待印刷的接收基片(12)的电路图纸导入计算机控制系统(14),计算机控制系统(14)根据待印刷接收基片(12)上焊盘的位置规划激光(15)的扫描路线、扫描速度,并根据每个焊盘的形状尺寸选择激光参数以及光束整形模块的参数;
步骤(2):根据实际生产中所需锡膏的厚度,选择所需凹面深度的透明基片(8),利用刮涂的方法将锡膏涂抹在整个凹面内,在凹面内形成锡膏薄膜(9);将锡膏薄膜(9)面朝下方,再将透明基片(8)固定在Z轴升降台(11)所连接的夹具(10)上,调整透明基片(8)和接收基片(12)的距离;
步骤(3):在每一次激光脉冲发射前,计算机控制系统(14)根据预先规划好的路线,控制二维振镜(6)的转动,改变激光光束路径;
步骤(4):激光器(1)发出的光束经过光束整形模块整形后,进入由二维振镜(6)和f-θ透镜(7)组成的光路调节模块,经过二维振镜(6)改变光路的走向后,最终通过f-θ透镜(7)后聚焦到步骤(2)所述锡膏薄膜(9)上方;激光(15)通过透明基片(8),被锡膏薄膜(9)吸收后,导致照射部位部分汽化,在锡膏薄膜(9)内部形成气泡(16),并且随着气泡(16)不断的膨胀,会推动周围未汽化部分冲向接收基片(12);并在透明基片(8)和接收基片(12)之间形成稳定的桥式结构(17);
步骤(5):重复进行步骤(3)和步骤(4)直至接收基片(12)上所有焊盘和透明基片(8)之间都形成一个稳定的桥式结构(17);之后,计算机控制系统(14)控制Z轴升降台(11)上升,使透明基片(8)垂直离开接收基片(12),使所有桥式结构(17)断裂,留下点状锡膏(18),进而整个接收基片(12)印刷完成。
2.根据权利要求1所述锡膏激光诱导前向转移方法,其特征在于:所述容纳锡膏薄膜(9)的凹面深度为20μm~150μm。
3.根据权利要求1所述锡膏激光诱导前向转移方法,其特征在于:所述接收基片(12)为PCB板。
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