KR102323958B1 - 연결 기구 및 기판 연마 장치 - Google Patents

연결 기구 및 기판 연마 장치 Download PDF

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Publication number
KR102323958B1
KR102323958B1 KR1020160010604A KR20160010604A KR102323958B1 KR 102323958 B1 KR102323958 B1 KR 102323958B1 KR 1020160010604 A KR1020160010604 A KR 1020160010604A KR 20160010604 A KR20160010604 A KR 20160010604A KR 102323958 B1 KR102323958 B1 KR 102323958B1
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South Korea
Prior art keywords
contact surface
dresser
concave
convex
center
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KR1020160010604A
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English (en)
Korean (ko)
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KR20160094314A (ko
Inventor
히로유키 시노자키
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가부시키가이샤 에바라 세이사꾸쇼
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Publication of KR20160094314A publication Critical patent/KR20160094314A/ko
Priority to KR1020210149346A priority Critical patent/KR102446908B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • H01L21/304—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0084—Other grinding machines or devices the grinding wheel support being angularly adjustable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/007—Weight compensation; Temperature compensation; Vibration damping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B45/00—Means for securing grinding wheels on rotary arbors
    • B24B45/003—Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/16—Bushings; Mountings
    • H01L21/02024—
    • H01L21/30625—
    • H01L21/461—
    • H01L21/67092—
    • H01L21/67219—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0472—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/129—Preparing bulk and homogeneous wafers by polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
  • Paper (AREA)
  • Pens And Brushes (AREA)
KR1020160010604A 2015-01-30 2016-01-28 연결 기구 및 기판 연마 장치 Active KR102323958B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020210149346A KR102446908B1 (ko) 2015-01-30 2021-11-03 연결 기구

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2015-017732 2015-01-30
JP2015017732 2015-01-30
JP2015249121A JP6592355B2 (ja) 2015-01-30 2015-12-21 連結機構および基板研磨装置
JPJP-P-2015-249121 2015-12-21

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020210149346A Division KR102446908B1 (ko) 2015-01-30 2021-11-03 연결 기구

Publications (2)

Publication Number Publication Date
KR20160094314A KR20160094314A (ko) 2016-08-09
KR102323958B1 true KR102323958B1 (ko) 2021-11-09

Family

ID=56685798

Family Applications (4)

Application Number Title Priority Date Filing Date
KR1020160010604A Active KR102323958B1 (ko) 2015-01-30 2016-01-28 연결 기구 및 기판 연마 장치
KR1020210149346A Active KR102446908B1 (ko) 2015-01-30 2021-11-03 연결 기구
KR1020220118421A Active KR102569773B1 (ko) 2015-01-30 2022-09-20 연결 기구의 회전 중심 위치 결정 방법 및 연결 기구의 회전 중심 위치 결정 프로그램을 기록한 컴퓨터로 판독 가능한 기록 매체
KR1020230108030A Active KR102580141B1 (ko) 2015-01-30 2023-08-18 회전체의 최대 압박 하중 결정 방법 및 회전체의 최대압박 하중 결정 프로그램을 기록한 컴퓨터로 판독 가능한 기록 매체

Family Applications After (3)

Application Number Title Priority Date Filing Date
KR1020210149346A Active KR102446908B1 (ko) 2015-01-30 2021-11-03 연결 기구
KR1020220118421A Active KR102569773B1 (ko) 2015-01-30 2022-09-20 연결 기구의 회전 중심 위치 결정 방법 및 연결 기구의 회전 중심 위치 결정 프로그램을 기록한 컴퓨터로 판독 가능한 기록 매체
KR1020230108030A Active KR102580141B1 (ko) 2015-01-30 2023-08-18 회전체의 최대 압박 하중 결정 방법 및 회전체의 최대압박 하중 결정 프로그램을 기록한 컴퓨터로 판독 가능한 기록 매체

Country Status (4)

Country Link
US (2) US9849557B2 (https=)
JP (4) JP6592355B2 (https=)
KR (4) KR102323958B1 (https=)
TW (2) TWI733212B (https=)

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JP6592355B2 (ja) * 2015-01-30 2019-10-16 株式会社荏原製作所 連結機構および基板研磨装置
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US10363647B2 (en) * 2016-02-05 2019-07-30 Toshiba Kikai Kabushiki Kaisha Grinding tool
JP6715153B2 (ja) 2016-09-30 2020-07-01 株式会社荏原製作所 基板研磨装置
JP6810585B2 (ja) * 2016-11-30 2021-01-06 タツモ株式会社 チャック装置及び貼合装置
JP6823541B2 (ja) 2017-05-30 2021-02-03 株式会社荏原製作所 キャリブレーション方法およびキャリブレーションプログラム
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JP7287761B2 (ja) * 2018-07-31 2023-06-06 株式会社荏原製作所 球面軸受の軸受半径決定方法
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JP7354879B2 (ja) * 2020-03-05 2023-10-03 トヨタ自動車株式会社 自動水研装置
CN111546229B (zh) * 2020-06-05 2021-08-10 业成科技（成都）有限公司 研磨设备、研磨治具及其使用方法
CN114571357A (zh) * 2020-11-30 2022-06-03 台山市兰宝磨具有限公司 一种方便更换的磨具
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TWI765726B (zh) * 2021-05-28 2022-05-21 大量科技股份有限公司 拋光系統及其修整裝置
CN113290476B (zh) * 2021-07-26 2021-10-08 徐州祥瑞工程机械科技有限公司 一种可以更换抛光角度的抛光机
CN115383622B (zh) * 2022-04-20 2024-08-27 北京晶亦精微科技股份有限公司 抛光头用分体式万向节及抛光装置
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