KR102284487B1 - 저유전 난연성 접착제 조성물 - Google Patents

저유전 난연성 접착제 조성물 Download PDF

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Publication number
KR102284487B1
KR102284487B1 KR1020177032931A KR20177032931A KR102284487B1 KR 102284487 B1 KR102284487 B1 KR 102284487B1 KR 1020177032931 A KR1020177032931 A KR 1020177032931A KR 20177032931 A KR20177032931 A KR 20177032931A KR 102284487 B1 KR102284487 B1 KR 102284487B1
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KR
South Korea
Prior art keywords
resin
adhesive layer
laminate
carboxyl group
mass
Prior art date
Application number
KR1020177032931A
Other languages
English (en)
Korean (ko)
Other versions
KR20180077099A (ko
Inventor
료 소노다
다케시 이토
다다히코 미카미
Original Assignee
도요보 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도요보 가부시키가이샤 filed Critical 도요보 가부시키가이샤
Publication of KR20180077099A publication Critical patent/KR20180077099A/ko
Application granted granted Critical
Publication of KR102284487B1 publication Critical patent/KR102284487B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C09J125/04—Homopolymers or copolymers of styrene
    • C09J125/06—Polystyrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204—Di-electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020177032931A 2015-11-02 2016-10-26 저유전 난연성 접착제 조성물 KR102284487B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015215631 2015-11-02
JPJP-P-2015-215631 2015-11-02
PCT/JP2016/081678 WO2017077912A1 (ja) 2015-11-02 2016-10-26 低誘電難燃性接着剤組成物

Publications (2)

Publication Number Publication Date
KR20180077099A KR20180077099A (ko) 2018-07-06
KR102284487B1 true KR102284487B1 (ko) 2021-08-02

Family

ID=58663004

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177032931A KR102284487B1 (ko) 2015-11-02 2016-10-26 저유전 난연성 접착제 조성물

Country Status (5)

Country Link
JP (2) JP6791163B2 (zh)
KR (1) KR102284487B1 (zh)
CN (1) CN107848259B (zh)
TW (1) TWI688474B (zh)
WO (1) WO2017077912A1 (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102340014B1 (ko) * 2016-08-09 2021-12-16 도요보 가부시키가이샤 저유전 접착제층을 함유하는 적층체
JP2019127501A (ja) * 2018-01-22 2019-08-01 藤森工業株式会社 熱硬化性接着剤組成物、接着フィルム、カバーレイフィルム及びフレキシブルプリント配線板
CN109666434B (zh) * 2018-12-27 2021-09-10 苏州赛伍应用技术股份有限公司 粘合剂及制备方法、包含其的胶膜和制备方法及应用
CN113557321A (zh) * 2019-03-12 2021-10-26 出光兴产株式会社 电路基板及电路基板的制造方法
JP6919776B1 (ja) * 2019-11-28 2021-08-18 東洋紡株式会社 接着フィルム、積層体およびプリント配線板
JPWO2021112134A1 (zh) * 2019-12-04 2021-06-10
JPWO2021132058A1 (zh) * 2019-12-23 2021-07-01
JP7306569B2 (ja) * 2020-03-25 2023-07-11 東洋紡株式会社 難燃性二軸配向ポリエステルフィルム
JP7484517B2 (ja) 2020-07-14 2024-05-16 ａｒｔｉｅｎｃｅ株式会社 熱硬化性接着シート、およびその利用
EP4190855A4 (en) * 2020-07-28 2024-07-17 Mitsubishi Eng Plastics Corp RESIN COMPOSITION AND METHOD FOR PRODUCING A MOLDED ARTICLE AND PLATED MOLDED ARTICLES
KR102327558B1 (ko) * 2020-11-09 2021-11-16 동우 화인켐 주식회사 회로 기판, 안테나 패키지 및 디스플레이 장치
WO2022196617A1 (ja) * 2021-03-17 2022-09-22 Ａｇｃ株式会社 金属張積層板および配線基板
WO2023136361A1 (ja) * 2022-01-17 2023-07-20 東洋紡株式会社 接着剤組成物、接着シート、電磁波シールドフィルム、積層体およびプリント配線板
JP2023147329A (ja) 2022-03-30 2023-10-13 藤森工業株式会社 接着剤付金属基材及び積層体
JP2023147328A (ja) 2022-03-30 2023-10-13 藤森工業株式会社 接着剤付金属基材及び積層体

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000104025A (ja) * 1998-09-29 2000-04-11 Nisshinbo Ind Inc フレキシブルプリント配線板用フィルム
JP2000345132A (ja) * 1999-06-01 2000-12-12 Nisshinbo Ind Inc Ｌｃｐ接合方法
JP2002235061A (ja) * 2001-02-08 2002-08-23 Nitto Denko Corp 熱反応性接着剤組成物および熱反応性接着フィルム
JP2010222408A (ja) * 2009-03-19 2010-10-07 Panasonic Electric Works Co Ltd フレキシブルプリント配線板用樹脂組成物、樹脂フィルム、プリプレグ、樹脂付き金属箔、フレキシブルプリント配線板

Family Cites Families (7)

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JP4067144B2 (ja) * 1996-08-20 2008-03-26 三井化学株式会社 接着剤組成物
JP2007073738A (ja) * 2005-09-07 2007-03-22 Toyo Ink Mfg Co Ltd 接着剤層付き補強材および補強材付きフレキシブルプリント配線板並びにその製造方法
JP2008111102A (ja) * 2006-10-02 2008-05-15 Shin Etsu Chem Co Ltd 難燃性接着剤組成物、ならびにそれを用いた接着剤シート、カバーレイフィルムおよびフレキシブル銅張積層板
JP5577107B2 (ja) * 2010-01-22 2014-08-20 パナソニック株式会社 樹脂組成物、樹脂組成物の製造方法、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板
JP2012025917A (ja) 2010-07-27 2012-02-09 Panasonic Electric Works Co Ltd ハロゲンフリーエポキシ樹脂組成物、カバーレイフィルム、ボンディングシート、プリプレグ、プリント配線板用積層板
JP5955156B2 (ja) 2012-08-10 2016-07-20 ナミックス株式会社 樹脂組成物、ならびに、それによる接着フィルムおよびカバーレイフィルム
KR102250655B1 (ko) 2013-09-20 2021-05-12 도아고세이가부시키가이샤 난연성 접착제 조성물 및 이것을 사용한 커버레이 필름 및 플렉시블 동 클래드 적층판

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000104025A (ja) * 1998-09-29 2000-04-11 Nisshinbo Ind Inc フレキシブルプリント配線板用フィルム
JP2000345132A (ja) * 1999-06-01 2000-12-12 Nisshinbo Ind Inc Ｌｃｐ接合方法
JP2002235061A (ja) * 2001-02-08 2002-08-23 Nitto Denko Corp 熱反応性接着剤組成物および熱反応性接着フィルム
JP2010222408A (ja) * 2009-03-19 2010-10-07 Panasonic Electric Works Co Ltd フレキシブルプリント配線板用樹脂組成物、樹脂フィルム、プリプレグ、樹脂付き金属箔、フレキシブルプリント配線板

Also Published As

Publication number Publication date
JP2021003886A (ja) 2021-01-14
CN107848259B (zh) 2020-08-21
KR20180077099A (ko) 2018-07-06
JP6791163B2 (ja) 2020-11-25
CN107848259A (zh) 2018-03-27
TW201728445A (zh) 2017-08-16
JPWO2017077912A1 (ja) 2018-08-16
WO2017077912A1 (ja) 2017-05-11
JP6874896B2 (ja) 2021-05-19
TWI688474B (zh) 2020-03-21

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