JPWO2021112134A1 - - Google Patents

Info

Publication number
JPWO2021112134A1
JPWO2021112134A1 JP2021519686A JP2021519686A JPWO2021112134A1 JP WO2021112134 A1 JPWO2021112134 A1 JP WO2021112134A1 JP 2021519686 A JP2021519686 A JP 2021519686A JP 2021519686 A JP2021519686 A JP 2021519686A JP WO2021112134 A1 JPWO2021112134 A1 JP WO2021112134A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021519686A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021112134A1 publication Critical patent/JPWO2021112134A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • C09J123/30—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment by oxidation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204—Di-electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2021519686A 2019-12-04 2020-12-02 Pending JPWO2021112134A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019219824 2019-12-04
PCT/JP2020/044900 WO2021112134A1 (ja) 2019-12-04 2020-12-02 低誘電積層体

Publications (1)

Publication Number Publication Date
JPWO2021112134A1 true JPWO2021112134A1 (zh) 2021-06-10

Family

ID=76221687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021519686A Pending JPWO2021112134A1 (zh) 2019-12-04 2020-12-02

Country Status (5)

Country Link
JP (1) JPWO2021112134A1 (zh)
KR (1) KR20220108030A (zh)
CN (1) CN114302933B (zh)
TW (1) TW202130504A (zh)
WO (1) WO2021112134A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI828469B (zh) * 2022-12-09 2024-01-01 南亞塑膠工業股份有限公司 黏著劑組成物與使用其製造的覆銅積層板

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4065595B2 (ja) * 1997-02-20 2008-03-26 三井化学株式会社 接着剤組成物、および該接着剤組成物を使用したボードの製造方法
JP3820668B2 (ja) * 1997-02-25 2006-09-13 日立化成工業株式会社 金属ベース基板及びその製造方法
JP2006045388A (ja) * 2004-08-05 2006-02-16 Kaneka Corp 絶縁性接着シートおよびその利用
JP2008153313A (ja) * 2006-12-15 2008-07-03 Matsushita Electric Ind Co Ltd 光学デバイス装置およびその製造方法ならびにカメラモジュール
JP4918380B2 (ja) * 2007-03-13 2012-04-18 ソマール株式会社 遮光フィルム及びその製造方法
JP2009084507A (ja) * 2007-10-02 2009-04-23 Hitachi Kasei Polymer Co Ltd 多層接着フィルム及びそれを用いたカバーレイフィルム、銅箔付き多層接着フィルム
WO2009055554A2 (en) * 2007-10-26 2009-04-30 E. I. Du Pont De Nemours And Company Multi-layer chip carrier and process for making
JP5327937B2 (ja) * 2007-12-25 2013-10-30 旭化成ケミカルズ株式会社 レーザー溶着接合用接着剤
TWI506082B (zh) * 2009-11-26 2015-11-01 Ajinomoto Kk Epoxy resin composition
JP2014141603A (ja) * 2013-01-25 2014-08-07 Toyo Ink Sc Holdings Co Ltd 誘電特性に優れる接着剤組成物、それを用いた接着剤シート、およびプリント配線板
WO2014148155A1 (ja) * 2013-03-22 2014-09-25 ナミックス株式会社 樹脂組成物、ならびに、それによる接着フィルム、カバーレイフィルム、層間接着剤
CN107075335B (zh) * 2014-09-24 2020-02-14 东亚合成株式会社 粘接剂组合物和使用了其的带有粘接剂层的层叠体
JP6686587B2 (ja) * 2015-03-30 2020-04-22 大日本印刷株式会社 電池用包装材料、その製造方法及び電池
JP6579309B2 (ja) * 2015-05-01 2019-09-25 味の素株式会社 硬化性組成物
CN107109182B (zh) * 2015-05-15 2019-06-07 东洋纺株式会社 含有低介电粘合剂层的层叠体
JP6791163B2 (ja) * 2015-11-02 2020-11-25 東洋紡株式会社 低誘電難燃性接着剤組成物
TW201800543A (zh) * 2016-03-08 2018-01-01 東洋油墨Ｓｃ控股股份有限公司 積層體及其製造方法、以及帶接著劑層的樹脂膜
WO2018116728A1 (ja) * 2016-12-22 2018-06-28 株式会社村田製作所 回路モジュール
JP2018135467A (ja) * 2017-02-22 2018-08-30 藤森工業株式会社 ホットメルト接着性樹脂積層体及び積層体
JP2019127501A (ja) * 2018-01-22 2019-08-01 藤森工業株式会社 熱硬化性接着剤組成物、接着フィルム、カバーレイフィルム及びフレキシブルプリント配線板
US20210009865A1 (en) * 2018-03-07 2021-01-14 Toagosei Co., Ltd. Adhesive composition, and adhesive layer-equipped layered product using same

Also Published As

Publication number Publication date
TW202130504A (zh) 2021-08-16
WO2021112134A1 (ja) 2021-06-10
CN114302933A (zh) 2022-04-08
KR20220108030A (ko) 2022-08-02
CN114302933B (zh) 2024-05-10

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