KR102256154B1 - 용매를 함유하는 코팅으로 코팅된 웨이퍼를 위한 베이킹 장치 - Google Patents

용매를 함유하는 코팅으로 코팅된 웨이퍼를 위한 베이킹 장치 Download PDF

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Publication number
KR102256154B1
KR102256154B1 KR1020150163960A KR20150163960A KR102256154B1 KR 102256154 B1 KR102256154 B1 KR 102256154B1 KR 1020150163960 A KR1020150163960 A KR 1020150163960A KR 20150163960 A KR20150163960 A KR 20150163960A KR 102256154 B1 KR102256154 B1 KR 102256154B1
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South Korea
Prior art keywords
wafer
baking
solvent
discharge
purge gas
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Korean (ko)
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KR20160062702A (ko
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그레고리 조지
아론 폴리
올리버 트라이켈
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수스 마이크로텍 리소그라피 게엠바하
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    • H01L21/324—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any of groups F27B1/00 - F27B15/00
    • F27B17/0016—Chamber type furnaces
    • F27B17/0025—Chamber type furnaces specially adapted for treating semiconductor wafers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B3/00—Hearth-type furnaces, e.g. of reverberatory type; Electric arc furnaces ; Tank furnaces
    • F27B3/02—Hearth-type furnaces, e.g. of reverberatory type; Electric arc furnaces ; Tank furnaces of single-chamber fixed-hearth type
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D3/00—Charging; Discharging; Manipulation of charge
    • F27D3/0084—Charging; Manipulation of SC or SC wafers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • H01L21/02—
    • H01L21/56—
    • H01L21/683—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D7/00—Forming, maintaining or circulating atmospheres in heating chambers
    • F27D7/02—Supplying steam, vapour, gases or liquids
    • H01L2021/60187—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Coating Apparatus (AREA)
KR1020150163960A 2014-11-25 2015-11-23 용매를 함유하는 코팅으로 코팅된 웨이퍼를 위한 베이킹 장치 Active KR102256154B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014117228.0 2014-11-25
DE102014117228.0A DE102014117228B4 (de) 2014-11-25 2014-11-25 Backvorrichtung für einen Wafer, der mit einer ein Lösungsmittel enthaltenden Beschichtung beschichtet ist

Publications (2)

Publication Number Publication Date
KR20160062702A KR20160062702A (ko) 2016-06-02
KR102256154B1 true KR102256154B1 (ko) 2021-05-26

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KR1020150163960A Active KR102256154B1 (ko) 2014-11-25 2015-11-23 용매를 함유하는 코팅으로 코팅된 웨이퍼를 위한 베이킹 장치

Country Status (7)

Country Link
US (1) US10825701B2 (https=)
JP (1) JP6900146B2 (https=)
KR (1) KR102256154B1 (https=)
CN (1) CN105618352A (https=)
AT (1) AT516575B1 (https=)
DE (1) DE102014117228B4 (https=)
TW (1) TWI713472B (https=)

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KR20180000928A (ko) * 2016-06-24 2018-01-04 세메스 주식회사 가열 처리 유닛, 이를 갖는 베이크 장치 및 이를 이용한 기판 처리 방법
JP6872328B2 (ja) * 2016-09-06 2021-05-19 株式会社Ｓｃｒｅｅｎホールディングス 減圧乾燥装置、減圧乾燥システム、減圧乾燥方法
JP6829053B2 (ja) * 2016-11-09 2021-02-10 コマツ産機株式会社 マシンルーム
CN107362953A (zh) * 2017-09-01 2017-11-21 深圳市华星光电半导体显示技术有限公司 光阻烘烤设备
US11779871B2 (en) * 2018-12-21 2023-10-10 Xia Tai Xin Semiconductor (Qing Dao) Ltd. Exhaust module for wafer baking apparatus and wafer processing system having the same
CN109830451B (zh) * 2019-01-23 2021-07-23 武汉华星光电半导体显示技术有限公司 基板干燥装置
CN113249707A (zh) * 2021-04-21 2021-08-13 拓荆科技股份有限公司 一种薄膜沉积装置和薄膜沉积方法
KR102820468B1 (ko) * 2021-04-22 2025-06-17 삼성전자주식회사 베이크 장치
JP7820243B2 (ja) * 2021-07-12 2026-02-25 東京エレクトロン株式会社 加熱装置及び加熱方法
TW202337566A (zh) * 2021-11-18 2023-10-01 日商東京威力科創股份有限公司 熱處理裝置及熱處理方法
JP2023075018A (ja) * 2021-11-18 2023-05-30 東京エレクトロン株式会社 熱処理装置、及び熱処理方法
CN118896475B (zh) * 2024-07-11 2025-11-04 颀中科技（苏州）有限公司 晶圆烘烤装置

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Also Published As

Publication number Publication date
DE102014117228B4 (de) 2022-10-20
JP6900146B2 (ja) 2021-07-07
KR20160062702A (ko) 2016-06-02
US20160148823A1 (en) 2016-05-26
JP2016119452A (ja) 2016-06-30
AT516575A2 (de) 2016-06-15
AT516575A3 (de) 2017-11-15
DE102014117228A1 (de) 2016-05-25
TW201631286A (zh) 2016-09-01
AT516575B1 (de) 2022-07-15
US10825701B2 (en) 2020-11-03
CN105618352A (zh) 2016-06-01
TWI713472B (zh) 2020-12-21

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