KR102247968B1 - 전체 패드 커버리지 바운더리 스캔 - Google Patents

전체 패드 커버리지 바운더리 스캔 Download PDF

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KR102247968B1
KR102247968B1 KR1020187034345A KR20187034345A KR102247968B1 KR 102247968 B1 KR102247968 B1 KR 102247968B1 KR 1020187034345 A KR1020187034345 A KR 1020187034345A KR 20187034345 A KR20187034345 A KR 20187034345A KR 102247968 B1 KR102247968 B1 KR 102247968B1
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pads
test
state
signals
circuit
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KR20180133926A (ko
Inventor
프라카쉬 나라야난
라제쉬 미탈
라자트 메흐로트라
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텍사스 인스트루먼츠 인코포레이티드
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
    • G01R31/318572—Input/Output interfaces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31712—Input or output aspects
    • G01R31/31713—Input or output interfaces for test, e.g. test pins, buffers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3177—Testing of logic operation, e.g. by logic analysers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
    • G01R31/318536—Scan chain arrangements, e.g. connections, test bus, analog signals

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Test And Diagnosis Of Digital Computers (AREA)
KR1020187034345A 2016-04-29 2017-05-01 전체 패드 커버리지 바운더리 스캔 Active KR102247968B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/143,454 2016-04-29
US15/143,454 US9791505B1 (en) 2016-04-29 2016-04-29 Full pad coverage boundary scan
PCT/US2017/030359 WO2017190123A1 (en) 2016-04-29 2017-05-01 Full pad coverage boundary scan

Publications (2)

Publication Number Publication Date
KR20180133926A KR20180133926A (ko) 2018-12-17
KR102247968B1 true KR102247968B1 (ko) 2021-05-03

Family

ID=60022604

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KR1020187034345A Active KR102247968B1 (ko) 2016-04-29 2017-05-01 전체 패드 커버리지 바운더리 스캔

Country Status (5)

Country Link
US (4) US9791505B1 (enExample)
JP (3) JP7004316B2 (enExample)
KR (1) KR102247968B1 (enExample)
CN (2) CN113484719B (enExample)
WO (1) WO2017190123A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
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US9791505B1 (en) * 2016-04-29 2017-10-17 Texas Instruments Incorporated Full pad coverage boundary scan
JP7385651B2 (ja) * 2018-08-31 2023-11-22 エヌビディア コーポレーション 自動車用途のための配置中にビルトイン・セルフテストを実行するためのテスト・システム
US11249134B1 (en) * 2020-10-06 2022-02-15 Qualcomm Incorporated Power-collapsible boundary scan
CN112526327B (zh) * 2020-10-28 2022-07-08 深圳市紫光同创电子有限公司 边界扫描测试方法及存储介质
CN113589154B (zh) * 2021-08-31 2025-07-08 成都海光集成电路设计有限公司 一种边界扫描电路
CN113655376B (zh) * 2021-09-13 2025-04-04 成都海光集成电路设计有限公司 一种扫描测试交换网络和扫描测试方法
CN113938125B (zh) * 2021-10-19 2023-02-24 浙江大学 多通道可配置可测试与修调的数字信号隔离器

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JP2001267506A (ja) 2000-03-17 2001-09-28 Kawasaki Steel Corp 半導体集積回路
JP2002033455A (ja) 2000-07-18 2002-01-31 Oki Electric Ind Co Ltd 半導体装置
JP2003187600A (ja) 2001-12-20 2003-07-04 Mitsubishi Electric Corp 半導体集積回路装置
JP2003228999A (ja) 2002-02-01 2003-08-15 Rohm Co Ltd 半導体記憶装置

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JP2000011698A (ja) 1998-04-22 2000-01-14 Toshiba Microelectronics Corp 半導体装置及びその内部信号モニタ方法
JP2001267506A (ja) 2000-03-17 2001-09-28 Kawasaki Steel Corp 半導体集積回路
JP2002033455A (ja) 2000-07-18 2002-01-31 Oki Electric Ind Co Ltd 半導体装置
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JP2003228999A (ja) 2002-02-01 2003-08-15 Rohm Co Ltd 半導体記憶装置

Also Published As

Publication number Publication date
CN109154633A (zh) 2019-01-04
US20210215757A1 (en) 2021-07-15
CN113484719B (zh) 2025-03-14
US20180045778A1 (en) 2018-02-15
US20190235020A1 (en) 2019-08-01
US10983161B2 (en) 2021-04-20
JP2022043194A (ja) 2022-03-15
US10274538B2 (en) 2019-04-30
JP7239913B2 (ja) 2023-03-15
JP7505845B2 (ja) 2024-06-25
CN113484719A (zh) 2021-10-08
WO2017190123A1 (en) 2017-11-02
JP2019515282A (ja) 2019-06-06
US9791505B1 (en) 2017-10-17
US11821945B2 (en) 2023-11-21
US20170315174A1 (en) 2017-11-02
CN109154633B (zh) 2021-08-24
KR20180133926A (ko) 2018-12-17
JP2023063323A (ja) 2023-05-09
JP7004316B2 (ja) 2022-02-04

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