KR102241071B1 - 양두 평면 연삭법 - Google Patents

양두 평면 연삭법 Download PDF

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Publication number
KR102241071B1
KR102241071B1 KR1020150026513A KR20150026513A KR102241071B1 KR 102241071 B1 KR102241071 B1 KR 102241071B1 KR 1020150026513 A KR1020150026513 A KR 1020150026513A KR 20150026513 A KR20150026513 A KR 20150026513A KR 102241071 B1 KR102241071 B1 KR 102241071B1
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South Korea
Prior art keywords
work
positive pressure
pressure pad
workpiece
static pressure
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KR1020150026513A
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English (en)
Korean (ko)
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KR20150101421A (ko
Inventor
아츠시 시바나카
Original Assignee
고요 기카이 고교 가부시키가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/08—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving liquid or pneumatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/03—Manufacturing methods
    • H01L2224/036—Manufacturing methods by patterning a pre-deposited material
    • H01L2224/03602—Mechanical treatment, e.g. polishing, grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
KR1020150026513A 2014-02-26 2015-02-25 양두 평면 연삭법 Active KR102241071B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-034825 2014-02-26
JP2014034825A JP6250435B2 (ja) 2014-02-26 2014-02-26 両頭平面研削法

Publications (2)

Publication Number Publication Date
KR20150101421A KR20150101421A (ko) 2015-09-03
KR102241071B1 true KR102241071B1 (ko) 2021-04-16

Family

ID=53905124

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150026513A Active KR102241071B1 (ko) 2014-02-26 2015-02-25 양두 평면 연삭법

Country Status (4)

Country Link
JP (1) JP6250435B2 (enrdf_load_stackoverflow)
KR (1) KR102241071B1 (enrdf_load_stackoverflow)
CN (1) CN104858736B (enrdf_load_stackoverflow)
TW (1) TWI641449B (enrdf_load_stackoverflow)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5969720B1 (ja) 2016-02-17 2016-08-17 日本精工株式会社 研削装置
CN106271980B (zh) * 2016-08-01 2018-10-26 湘潭大学 一种高静液压磨削设备及磨削方法
JP6814009B2 (ja) * 2016-10-04 2021-01-13 株式会社ディスコ 搬送パッド及びウエーハの搬送方法
CN109227667B (zh) * 2018-08-30 2020-12-29 重庆水利电力职业技术学院 装饰板施工用切割打磨装置
CN109352445B (zh) * 2018-12-05 2019-11-12 江苏博克斯科技股份有限公司 一种用于电子产品内部板件的打磨装置及其工作方法
CN110509134B (zh) * 2019-09-12 2021-04-09 西安奕斯伟硅片技术有限公司 一种晶圆研磨装置
CN114274041B (zh) * 2021-12-24 2023-03-14 西安奕斯伟材料科技有限公司 双面研磨装置和双面研磨方法
CN114770366B (zh) * 2022-05-17 2023-11-17 西安奕斯伟材料科技股份有限公司 一种硅片双面研磨装置的静压板及硅片双面研磨装置
CN115070604B (zh) * 2022-06-09 2023-09-29 西安奕斯伟材料科技股份有限公司 双面研磨装置和双面研磨方法
CN114986381B (zh) * 2022-06-16 2023-08-22 西安奕斯伟材料科技股份有限公司 双面研磨装置和双面研磨方法
CN115256081A (zh) * 2022-10-08 2022-11-01 徐州晨晓精密机械制造有限公司 一种五金件打磨装置
CN115781477B (zh) * 2022-12-29 2024-10-08 苏州市豪致达精密机械有限公司 一种用于金属连接件的精加工成型设备及其成型工艺
CN116117682B (zh) * 2023-03-31 2024-04-12 西安奕斯伟材料科技股份有限公司 静压垫、研磨设备及硅片
CN116160356B (zh) * 2023-04-18 2023-08-22 西安奕斯伟材料科技股份有限公司 静压支撑件、双面研磨装置和双面研磨方法
CN117359488A (zh) * 2023-10-17 2024-01-09 广东豪特曼机床股份有限公司 一种用于周边磨床的装夹行程控制装置及控制方法
CN119282911A (zh) * 2024-11-19 2025-01-10 西安奕斯伟材料科技股份有限公司 一种硅片定位组件及硅片研磨设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002064073A (ja) * 2001-06-12 2002-02-28 Komatsu Electronic Metals Co Ltd 半導体ウェーハ剥し装置および半導体ウェーハの製造方法
JP2006114640A (ja) * 2004-10-14 2006-04-27 Lintec Corp 非接触型吸着保持装置
JP2013201196A (ja) * 2012-03-23 2013-10-03 Tokyo Electron Ltd 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP2013215813A (ja) * 2012-04-05 2013-10-24 Koyo Mach Ind Co Ltd 両頭平面研削におけるワーク搬入出方法及び両頭平面研削盤

Family Cites Families (7)

* Cited by examiner, † Cited by third party
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DE102004005702A1 (de) * 2004-02-05 2005-09-01 Siltronic Ag Halbleiterscheibe, Vorrichtung und Verfahren zur Herstellung der Halbleiterscheibe
JP4752475B2 (ja) * 2005-12-08 2011-08-17 信越半導体株式会社 半導体ウェーハの両頭研削装置、静圧パッドおよびこれを用いた両頭研削方法
JP3136316U (ja) * 2007-07-03 2007-10-25 博 明石 ディスク非接触脱着器
JP4985451B2 (ja) * 2008-02-14 2012-07-25 信越半導体株式会社 ワークの両頭研削装置およびワークの両頭研削方法
JP5463570B2 (ja) * 2008-10-31 2014-04-09 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 ウェハ用両頭研削装置および両頭研削方法
JP5437680B2 (ja) * 2009-03-30 2014-03-12 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェーハの両面研削装置及び両面研削方法
JP5820329B2 (ja) * 2012-04-24 2015-11-24 光洋機械工業株式会社 両頭平面研削法及び両頭平面研削盤

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002064073A (ja) * 2001-06-12 2002-02-28 Komatsu Electronic Metals Co Ltd 半導体ウェーハ剥し装置および半導体ウェーハの製造方法
JP2006114640A (ja) * 2004-10-14 2006-04-27 Lintec Corp 非接触型吸着保持装置
JP2013201196A (ja) * 2012-03-23 2013-10-03 Tokyo Electron Ltd 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP2013215813A (ja) * 2012-04-05 2013-10-24 Koyo Mach Ind Co Ltd 両頭平面研削におけるワーク搬入出方法及び両頭平面研削盤

Also Published As

Publication number Publication date
JP6250435B2 (ja) 2017-12-20
KR20150101421A (ko) 2015-09-03
CN104858736A (zh) 2015-08-26
CN104858736B (zh) 2019-04-23
TWI641449B (zh) 2018-11-21
JP2015160250A (ja) 2015-09-07
TW201544246A (zh) 2015-12-01

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