CN104858736B - 双头平面磨削方法 - Google Patents

双头平面磨削方法 Download PDF

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Publication number
CN104858736B
CN104858736B CN201510083693.XA CN201510083693A CN104858736B CN 104858736 B CN104858736 B CN 104858736B CN 201510083693 A CN201510083693 A CN 201510083693A CN 104858736 B CN104858736 B CN 104858736B
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CN
China
Prior art keywords
workpiece
mentioned
hydrostatic cushion
cushion
hydrostatic
Prior art date
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CN201510083693.XA
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English (en)
Chinese (zh)
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CN104858736A (zh
Inventor
芝中笃志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JTEKT Machine Systems Corp
Original Assignee
Koyo Machine Industries Co Ltd
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Application filed by Koyo Machine Industries Co Ltd filed Critical Koyo Machine Industries Co Ltd
Publication of CN104858736A publication Critical patent/CN104858736A/zh
Application granted granted Critical
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/08—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving liquid or pneumatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
CN201510083693.XA 2014-02-26 2015-02-16 双头平面磨削方法 Active CN104858736B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014034825A JP6250435B2 (ja) 2014-02-26 2014-02-26 両頭平面研削法
JP2014-034825 2014-02-26

Publications (2)

Publication Number Publication Date
CN104858736A CN104858736A (zh) 2015-08-26
CN104858736B true CN104858736B (zh) 2019-04-23

Family

ID=53905124

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510083693.XA Active CN104858736B (zh) 2014-02-26 2015-02-16 双头平面磨削方法

Country Status (4)

Country Link
JP (1) JP6250435B2 (enrdf_load_stackoverflow)
KR (1) KR102241071B1 (enrdf_load_stackoverflow)
CN (1) CN104858736B (enrdf_load_stackoverflow)
TW (1) TWI641449B (enrdf_load_stackoverflow)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5969720B1 (ja) 2016-02-17 2016-08-17 日本精工株式会社 研削装置
CN106271980B (zh) * 2016-08-01 2018-10-26 湘潭大学 一种高静液压磨削设备及磨削方法
JP6814009B2 (ja) * 2016-10-04 2021-01-13 株式会社ディスコ 搬送パッド及びウエーハの搬送方法
CN109227667B (zh) * 2018-08-30 2020-12-29 重庆水利电力职业技术学院 装饰板施工用切割打磨装置
CN109352445B (zh) * 2018-12-05 2019-11-12 江苏博克斯科技股份有限公司 一种用于电子产品内部板件的打磨装置及其工作方法
CN110509134B (zh) * 2019-09-12 2021-04-09 西安奕斯伟硅片技术有限公司 一种晶圆研磨装置
CN114274041B (zh) * 2021-12-24 2023-03-14 西安奕斯伟材料科技有限公司 双面研磨装置和双面研磨方法
CN114770366B (zh) * 2022-05-17 2023-11-17 西安奕斯伟材料科技股份有限公司 一种硅片双面研磨装置的静压板及硅片双面研磨装置
CN115070604B (zh) * 2022-06-09 2023-09-29 西安奕斯伟材料科技股份有限公司 双面研磨装置和双面研磨方法
CN114986381B (zh) * 2022-06-16 2023-08-22 西安奕斯伟材料科技股份有限公司 双面研磨装置和双面研磨方法
CN115256081A (zh) * 2022-10-08 2022-11-01 徐州晨晓精密机械制造有限公司 一种五金件打磨装置
CN115781477B (zh) * 2022-12-29 2024-10-08 苏州市豪致达精密机械有限公司 一种用于金属连接件的精加工成型设备及其成型工艺
CN116117682B (zh) * 2023-03-31 2024-04-12 西安奕斯伟材料科技股份有限公司 静压垫、研磨设备及硅片
CN116160356B (zh) * 2023-04-18 2023-08-22 西安奕斯伟材料科技股份有限公司 静压支撑件、双面研磨装置和双面研磨方法
CN117359488A (zh) * 2023-10-17 2024-01-09 广东豪特曼机床股份有限公司 一种用于周边磨床的装夹行程控制装置及控制方法
CN119282911A (zh) * 2024-11-19 2025-01-10 西安奕斯伟材料科技股份有限公司 一种硅片定位组件及硅片研磨设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1959483A1 (en) * 2005-12-08 2008-08-20 Shin-Etsu Handotai Co., Ltd. Double side grinding machine for semiconductor wafer, static pressure pad, and double side grinding method using such static pressure pad
CN101939136A (zh) * 2008-02-14 2011-01-05 信越半导体股份有限公司 工件的双面磨削装置及工件的双面磨削方法
TW201402271A (zh) * 2012-04-05 2014-01-16 Koyo Machine Ind Co Ltd 在兩頭平面研磨的工件搬入出方法及兩頭平面研磨盤

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3571310B2 (ja) * 2001-06-12 2004-09-29 コマツ電子金属株式会社 半導体ウェーハ剥し装置および半導体ウェーハの製造方法
DE102004005702A1 (de) * 2004-02-05 2005-09-01 Siltronic Ag Halbleiterscheibe, Vorrichtung und Verfahren zur Herstellung der Halbleiterscheibe
JP4541824B2 (ja) * 2004-10-14 2010-09-08 リンテック株式会社 非接触型吸着保持装置
JP3136316U (ja) * 2007-07-03 2007-10-25 博 明石 ディスク非接触脱着器
JP5463570B2 (ja) * 2008-10-31 2014-04-09 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 ウェハ用両頭研削装置および両頭研削方法
JP5437680B2 (ja) * 2009-03-30 2014-03-12 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェーハの両面研削装置及び両面研削方法
JP5777549B2 (ja) * 2012-03-23 2015-09-09 東京エレクトロン株式会社 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP5820329B2 (ja) * 2012-04-24 2015-11-24 光洋機械工業株式会社 両頭平面研削法及び両頭平面研削盤

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1959483A1 (en) * 2005-12-08 2008-08-20 Shin-Etsu Handotai Co., Ltd. Double side grinding machine for semiconductor wafer, static pressure pad, and double side grinding method using such static pressure pad
CN101939136A (zh) * 2008-02-14 2011-01-05 信越半导体股份有限公司 工件的双面磨削装置及工件的双面磨削方法
TW201402271A (zh) * 2012-04-05 2014-01-16 Koyo Machine Ind Co Ltd 在兩頭平面研磨的工件搬入出方法及兩頭平面研磨盤

Also Published As

Publication number Publication date
JP6250435B2 (ja) 2017-12-20
KR20150101421A (ko) 2015-09-03
CN104858736A (zh) 2015-08-26
KR102241071B1 (ko) 2021-04-16
TWI641449B (zh) 2018-11-21
JP2015160250A (ja) 2015-09-07
TW201544246A (zh) 2015-12-01

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Address after: Japan Osaka

Patentee after: JTEKT Mechanical System Co.,Ltd.

Address before: Japan Osaka

Patentee before: KOYO MACHINE INDUSTRIES CO.,LTD.

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Address after: Osaka, Japan

Patentee after: JTEKT Mechanical System Co.,Ltd.

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