KR102229343B1 - 적층 구조체, 플렉시블 프린트 배선판 및 그의 제조 방법 - Google Patents

적층 구조체, 플렉시블 프린트 배선판 및 그의 제조 방법 Download PDF

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Publication number
KR102229343B1
KR102229343B1 KR1020157028866A KR20157028866A KR102229343B1 KR 102229343 B1 KR102229343 B1 KR 102229343B1 KR 1020157028866 A KR1020157028866 A KR 1020157028866A KR 20157028866 A KR20157028866 A KR 20157028866A KR 102229343 B1 KR102229343 B1 KR 102229343B1
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KR
South Korea
Prior art keywords
printed wiring
flexible printed
wiring board
resin
layer
Prior art date
Application number
KR1020157028866A
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English (en)
Korean (ko)
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KR20150143480A (ko
Inventor
히데카즈 미야베
마코토 하야시
유타카 요코야마
나오유키 코이케
Original Assignee
다이요 잉키 세이조 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority claimed from JP2013087826A external-priority patent/JP5847754B2/ja
Priority claimed from JP2013107519A external-priority patent/JP6050180B2/ja
Priority claimed from JP2013107520A external-priority patent/JP6050181B2/ja
Application filed by 다이요 잉키 세이조 가부시키가이샤 filed Critical 다이요 잉키 세이조 가부시키가이샤
Publication of KR20150143480A publication Critical patent/KR20150143480A/ko
Application granted granted Critical
Publication of KR102229343B1 publication Critical patent/KR102229343B1/ko

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
KR1020157028866A 2013-04-18 2014-04-17 적층 구조체, 플렉시블 프린트 배선판 및 그의 제조 방법 KR102229343B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2013087826A JP5847754B2 (ja) 2013-04-18 2013-04-18 感光性樹脂構造体、ドライフィルム、及びフレキシブルプリント配線板
JPJP-P-2013-087826 2013-04-18
JPJP-P-2013-107519 2013-05-21
JP2013107519A JP6050180B2 (ja) 2013-05-21 2013-05-21 積層構造体およびフレキシブルプリント配線板
JPJP-P-2013-107520 2013-05-21
JP2013107520A JP6050181B2 (ja) 2013-05-21 2013-05-21 フレキシブルプリント配線板の製造方法及びフレキシブルプリント配線板
PCT/JP2014/060986 WO2014171525A1 (ja) 2013-04-18 2014-04-17 積層構造体、フレキシブルプリント配線板及びその製造方法

Publications (2)

Publication Number Publication Date
KR20150143480A KR20150143480A (ko) 2015-12-23
KR102229343B1 true KR102229343B1 (ko) 2021-03-19

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157028866A KR102229343B1 (ko) 2013-04-18 2014-04-17 적층 구조체, 플렉시블 프린트 배선판 및 그의 제조 방법

Country Status (4)

Country Link
KR (1) KR102229343B1 (zh)
CN (1) CN105164585B (zh)
TW (1) TWI614571B (zh)
WO (1) WO2014171525A1 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106796400B (zh) * 2014-10-14 2020-11-03 太阳油墨制造株式会社 层叠结构体
TWI688475B (zh) * 2014-10-16 2020-03-21 日商太陽油墨製造股份有限公司 層合結構體、乾薄膜及可撓性印刷配線板
WO2017022547A1 (ja) * 2015-08-05 2017-02-09 太陽インキ製造株式会社 積層構造体、ドライフィルムおよびフレキシブルプリント配線板
KR20180102622A (ko) * 2016-01-13 2018-09-17 다이요 홀딩스 가부시키가이샤 감광성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판
CN105977170B (zh) 2016-07-01 2018-06-05 京东方科技集团股份有限公司 布线保护膜层的贴附方法及布线结构、显示面板
KR101947150B1 (ko) * 2016-08-09 2019-02-12 주식회사 엘지화학 절연층 제조방법 및 다층인쇄회로기판 제조방법
JP2019056824A (ja) * 2017-09-21 2019-04-11 株式会社タムラ製作所 感光性樹脂組成物の光硬化膜及び感光性樹脂組成物の光硬化膜を有するプリント配線板
WO2019194208A1 (ja) * 2018-04-04 2019-10-10 住友電工プリントサーキット株式会社 フレキシブルプリント配線板用カバーフィルム及びフレキシブルプリント配線板
EP3723459A1 (en) 2019-04-10 2020-10-14 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with high passive intermodulation (pim) performance
CN110519936A (zh) * 2019-08-01 2019-11-29 中国电子科技集团公司第二十九研究所 一种ltcc基板表面的高精密超薄阻焊膜层及其制作工艺方法
CN110673441B (zh) * 2019-11-11 2023-05-26 新东方油墨有限公司 一种感光阻焊树脂及其制备方法
KR20230126600A (ko) 2022-02-23 2023-08-30 정지훈 무선 블루투스 보조배터리

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009048170A (ja) * 2007-07-24 2009-03-05 Kaneka Corp 感光性ドライフィルムレジスト、これを用いたプリント配線板、及び、プリント配線板の製造方法
JP2012091430A (ja) * 2010-10-28 2012-05-17 Toray Ind Inc フィルム積層体
WO2012133665A1 (ja) 2011-03-30 2012-10-04 宇部興産株式会社 ポリイミドフィルム

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JPS62263692A (ja) 1986-05-12 1987-11-16 ニツポン高度紙工業株式会社 耐熱性フレキシブルプリント配線板
JPS63110224A (ja) 1986-10-27 1988-05-14 Dainippon Printing Co Ltd フレキシブルオ−バ−レイフイルム
JP3966743B2 (ja) * 2002-02-28 2007-08-29 三井化学株式会社 多層感光性樹脂フィルム及びそれからなる絶縁膜
JP2005300857A (ja) * 2004-04-09 2005-10-27 Fuji Photo Film Co Ltd 感光性転写シート、感光性積層体、画像パターン形成方法、及び配線パターン形成方法
JP2007071966A (ja) * 2005-09-05 2007-03-22 Hitachi Chem Co Ltd 永久レジストの製造方法及びプリント配線板の製造方法
JP2009025699A (ja) * 2007-07-23 2009-02-05 Kaneka Corp 感光性ドライフィルムレジスト、これを用いたプリント配線板、および、プリント配線板の製造方法
JP2010204174A (ja) * 2009-02-27 2010-09-16 Fujifilm Corp 感光性積層体及び感光性フィルム、並びに、プリント基板の製造方法
JP5567290B2 (ja) * 2009-05-12 2014-08-06 太陽ホールディングス株式会社 感光性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009048170A (ja) * 2007-07-24 2009-03-05 Kaneka Corp 感光性ドライフィルムレジスト、これを用いたプリント配線板、及び、プリント配線板の製造方法
JP2012091430A (ja) * 2010-10-28 2012-05-17 Toray Ind Inc フィルム積層体
WO2012133665A1 (ja) 2011-03-30 2012-10-04 宇部興産株式会社 ポリイミドフィルム

Also Published As

Publication number Publication date
TW201510643A (zh) 2015-03-16
WO2014171525A1 (ja) 2014-10-23
CN105164585B (zh) 2020-02-21
KR20150143480A (ko) 2015-12-23
TWI614571B (zh) 2018-02-11
CN105164585A (zh) 2015-12-16

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