WO2014171525A1 - 積層構造体、フレキシブルプリント配線板及びその製造方法 - Google Patents

積層構造体、フレキシブルプリント配線板及びその製造方法 Download PDF

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Publication number
WO2014171525A1
WO2014171525A1 PCT/JP2014/060986 JP2014060986W WO2014171525A1 WO 2014171525 A1 WO2014171525 A1 WO 2014171525A1 JP 2014060986 W JP2014060986 W JP 2014060986W WO 2014171525 A1 WO2014171525 A1 WO 2014171525A1
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WIPO (PCT)
Prior art keywords
printed wiring
flexible printed
wiring board
resin
layer
Prior art date
Application number
PCT/JP2014/060986
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
宮部　英和
亮 林
横山　裕
直之 小池
Original Assignee
太陽インキ製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2013087826A external-priority patent/JP5847754B2/ja
Priority claimed from JP2013107519A external-priority patent/JP6050180B2/ja
Priority claimed from JP2013107520A external-priority patent/JP6050181B2/ja
Application filed by 太陽インキ製造株式会社 filed Critical 太陽インキ製造株式会社
Priority to CN201480021937.5A priority Critical patent/CN105164585B/zh
Priority to KR1020157028866A priority patent/KR102229343B1/ko
Publication of WO2014171525A1 publication Critical patent/WO2014171525A1/ja

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Definitions

  • the present invention relates to a laminated structure, in particular, a photosensitive resin structure, a dry film using the same, and a flexible printed wiring board, and more particularly, a photosensitive resin structure capable of forming a fine pattern on the flexible printed wiring board.
  • a non-photosensitive resin structure obtained by applying a thermosetting adhesive to a film such as polyimide has been used as a protective film for a flexible printed wiring board.
  • a method for forming such a non-photosensitive resin structure on a flexible printed wiring board by patterning conventionally, a method of thermocompression bonding on the flexible printed wiring board after punching by punching has been used.
  • a method has been used in which a solvent-soluble thermosetting resin composition is directly pattern-printed on a flexible printed wiring board and thermally cured to form a pattern.
  • a polyimide film has been used as a suitable material for a flexible printed wiring board because it has flexibility and is excellent in heat resistance, mechanical properties, and electrical properties (see, for example, Patent Document 1).
  • the shape of the pattern edge part collapses due to resin oozing at the time of application or thermocompression bonding, so it is required for miniaturization of wiring and miniaturization of chip parts mounted on flexible printed wiring boards. It was difficult to form a fine pattern.
  • a cover based on polyimide with excellent mechanical properties such as heat resistance and flexibility is used for the bent part (bent part).
  • Lay is used (see, for example, Patent Documents 2 and 3), and the mounting part (non-bent part) uses a photosensitive resin composition that is excellent in electrical insulation and solder heat resistance and can be finely processed. Is widely adopted.
  • a polyimide-based coverlay with excellent mechanical properties such as heat resistance and flexibility is not suitable for fine wiring because it requires processing by die punching. Therefore, it is necessary to partially use an alkali developing type photosensitive resin composition (solder resist) that can be processed by photolithography in a chip mounting portion that requires fine wiring.
  • solvent resist alkali developing type photosensitive resin composition
  • an insulating film as a coverlay as a solder resist for a flexible printed wiring board.
  • a coverlay film requires a complicated process for pattern formation, and is not suitable for punching holes by punching. There is a problem that it is difficult to cope with the formation of a fine pattern due to low processing accuracy and oozing of the resin during thermocompression bonding.
  • an object of the present invention is to form a photosensitive resin structure that is capable of forming a fine pattern on a flexible printed wiring board and is excellent in insulation and flexibility, and a cured product thereof as a protective film, for example, a coverlay or a solder resist. It is in providing the flexible printed wiring board which has.
  • Another object of the present invention is to provide an insulating film for a flexible printed wiring board having excellent reliability and processing accuracy such as impact resistance, bendability, and low warpage, and excellent workability.
  • Part) and a laminated structure suitable for the batch formation process of the mounting part (non-bending part) and its cured product as a protective film, for example, coverlay or solder resist, for reliability such as impact resistance and flexibility The object is to provide an excellent flexible printed wiring board.
  • Still another object of the present invention is to provide an insulating film for a flexible printed wiring board excellent in reliability and processing accuracy such as impact resistance, bendability, and low warpage, particularly a bent portion (bend portion) and mounting.
  • An object of the present invention is to provide a flexible printed wiring board manufacturing method and a flexible printed wiring board capable of forming an insulating film, such as a cover lay and a solder resist, at a portion (non-bent portion) with good workability.
  • the present inventors have made the above object by forming a protective film for a flexible printed wiring board from a photosensitive resin structure in which a plurality of developable resin layers are laminated.
  • the present invention has been completed.
  • the photosensitive resin structure of the present invention comprises a developable adhesive layer (a) and a developable protective layer (b) laminated on the flexible printed wiring board via the developable adhesive layer (a).
  • a photosensitive resin structure having at least the developable protective layer (b) can be patterned by light irradiation, and the developable adhesive layer (a) and the developable protective layer (b) The pattern can be collectively formed by development.
  • both the developable adhesive layer (a) and the developable protective layer (b) can be patterned by light irradiation.
  • the developable adhesive layer (a) is thicker than the developable protective layer (b).
  • the photosensitive resin structure of the present invention can be used for at least one of a bent portion and a non-bent portion of the flexible printed wiring board, and among the cover lay and the solder resist of the flexible printed wiring board. Can be used to form at least one of the following.
  • the dry film of the present invention is characterized in that at least one surface of the photosensitive resin structure is supported or protected by a film.
  • the flexible printed wiring board of the present invention has a protective film formed by patterning the photosensitive resin structure formed on the flexible printed wiring board by light irradiation and forming the pattern collectively by development. It is a feature.
  • the developable adhesive layer (a) is formed by applying a photosensitive or non-photosensitive resin composition (a1) on a flexible printed wiring board.
  • the laminated structure of the present invention comprises a resin layer (A) made of an alkali developing resin composition, and a resin layer (B) laminated on a flexible printed wiring board via the resin layer (A).
  • the resin layer (B) is composed of a photosensitive thermosetting resin composition containing an alkali-soluble resin having an imide ring, a photobase generator, and a heat-reactive compound. To do.
  • both the resin layer (A) and the resin layer (B) can be patterned by light irradiation.
  • the laminated structure of the present invention can be used for at least one of a bent portion and a non-bent portion of the flexible printed wiring board.
  • the cover lay of the flexible printed wiring board, the solder resist, and the interlayer insulating material can be used as at least one of the applications.
  • the dry film of the present invention is characterized in that at least one surface of the laminated structure is supported or protected by a film.
  • the flexible printed wiring board of the present invention has an insulating film formed by forming a layer of the laminated structure on the flexible printed wiring board, patterning by light irradiation, and forming the pattern in a batch with a developer. It is a feature.
  • the flexible printed wiring board of the present invention is formed by sequentially forming the resin layer (A) and the resin layer (B) without using the laminated structure according to the present invention, and then patterning by light irradiation.
  • the pattern may be formed in a lump.
  • the “pattern” means a patterned cured product, that is, an insulating film.
  • the present inventors have completed the present invention having the following contents. That is, in the method for producing a flexible printed wiring board of the present invention, the step of forming at least one resin layer (A) made of an alkali-developable photosensitive resin composition (A1) on the flexible printed wiring board, the resin layer ( A) A step of forming at least one resin layer (B) composed of a photosensitive thermosetting resin composition (B1) containing an alkali-soluble resin having an imide ring, a photobase generator, and a heat-reactive compound.
  • the flexible printed wiring board of the present invention is manufactured by the above manufacturing method.
  • a fine pattern on a flexible printed wiring board it is possible to form a fine pattern on a flexible printed wiring board, and have a photosensitive resin structure excellent in insulation and flexibility, and a cured product thereof as a protective film, for example, a coverlay and a solder resist.
  • a printed wiring board can be provided.
  • the insulating film for flexible printed wiring boards which has excellent reliability and processing accuracy such as impact resistance, bendability, and low warpage, and excellent workability, particularly a bent portion (bent portion).
  • a laminated structure suitable for the batch formation process of the mounting part (non-bent part) and its cured product as an insulating film for example, coverlay, solder resist, interlayer insulating layer, and reliability such as impact resistance and flexibility
  • a flexible printed wiring board having excellent properties can be provided.
  • the manufacturing method of the flexible printed wiring board which can form the insulating film in a bending part) for example, a coverlay and a soldering resist, collectively with sufficient workability
  • the photosensitive resin structure of the present invention can be laminated on a flexible printed wiring board, and can be patterned by light irradiation on the flexible printed wiring board, and a pattern can be collectively formed by development.
  • the pattern means a patterned cured product, that is, a protective film.
  • the coverlay is pressure-bonded on the flexible printed wiring board.
  • the developable adhesive layer (a) and the development are applied on the flexible printed wiring board. After laminating the protective layer (b), it is possible to form a pattern all at once by light irradiation and development.
  • FIG. 1 shows a photosensitive resin structure according to an embodiment of the present invention.
  • the structure 1 shown in the figure has a developable adhesive layer (a) and a developable protective layer (b) in this order on a flexible printed wiring board in which a copper circuit 3 is formed on a flexible substrate 2, and at least developable protection.
  • the layer (b) can be patterned by light irradiation, and the developable adhesive layer (a) and the developable protective layer (b) can collectively form a pattern by development.
  • patterning means that a portion irradiated with light changes from a non-developable state to a developable state (positive type) or changes from a developable state to a non-developable state (negative type). To tell.
  • pattern formation means that a light irradiated part is developed and an unirradiated part remains in a pattern (positive type), or an unirradiated part is developed and a light irradiated part remains in a pattern (negative type). )
  • both the developable adhesive layer (a) and the developable protective layer (b) of the photosensitive resin structure of the present invention can be patterned by light irradiation because a fine pattern can be formed.
  • the developable adhesive layer (a) is formed of a photosensitive or non-photosensitive resin composition (a1), and the developable protective layer (b) is a photosensitive resin composition (b1) different from the resin composition (a1). ).
  • the photosensitive or non-photosensitive resin composition (a1) is appropriately selected from materials that can impart flexibility to the protective film. In order to form a fine pattern, the resin composition (a1) is preferably photosensitive.
  • the photosensitive resin composition (b1) is appropriately selected mainly from materials that can impart insulating properties.
  • the developing adhesive layer (a) is preferably thicker than the developing protective layer (b) from the viewpoint of followability of the protective film to the copper circuit and flexibility.
  • the photosensitive resin structure of the present invention can be used for at least one of a bent portion and a non-bent portion of a flexible printed wiring board. Specifically, the cover lay and the solder of the flexible printed wiring board are used. It can be used to form at least one of the resists. Examples of the non-bent part include a chip mounting part.
  • the development method may be development using an aqueous alkali solution (hereinafter also referred to as alkali development) or development using an organic solvent, but alkali development is preferred.
  • the photosensitive resin compositions (a1) and (b1) that can be used for the developable adhesive layer (a) and the developable protective layer (b) may be positive or negative.
  • As the positive photosensitive composition a publicly known and conventional one can be used as long as the light irradiation part (also referred to as an exposure part) is dissolved by the developer due to the change in polarity before and after the light irradiation.
  • a composition containing a diazonaphthoquinone compound and an alkali-soluble resin can be mentioned.
  • the negative photosensitive composition a known and commonly used one can be used as long as the light irradiation part is hardly soluble in the developer.
  • examples thereof include a composition containing a photoacid generator and an alkali-soluble resin, a composition containing a photobase generator and an alkali-soluble resin, and a composition containing a photopolymerization initiator and an alkali-soluble resin.
  • the photosensitive resin compositions (a1) and (b1) As a combination of the photosensitive resin compositions (a1) and (b1), the positive photosensitive resin composition (a1), the positive photosensitive resin composition (b1), and the negative photosensitive resin composition (a1) Any combination of negative photosensitive resin composition (b1) may be used.
  • composition (a1) containing a photobase generator and a composition (b1) containing a photobase generator A composition (a1) containing a photobase generator and a composition (b1) containing a photopolymerization initiator, A composition (a1) containing a photopolymerization initiator and a composition (b1) containing a photobase generator, A composition (a1) containing a photopolymerization initiator and a composition (b1) containing a photopolymerization initiator,
  • the combination can be selected according to the embodiment.
  • the photosensitive resin structure of the present invention is an application of a flexible printed wiring board, it is preferable to be able to reduce distortion and warpage during curing. Accordingly, a composition containing the photobase generator is preferred, and examples of such a composition include a composition containing a photobase generator and a thermosetting resin and cured by an addition reaction.
  • the photosensitive resin composition (a1) and the photosensitive resin composition (b1) has a photoacid generator, a photobase generator, or a photopolymerization initiator, and the other has a photoacid generator.
  • the structure which does not contain any of a generator, a photobase generator, and a photoinitiator may be sufficient.
  • the photoacid generator, photobase generator, or photopolymerization initiator contained in one photosensitive resin composition may cure the other photosensitive resin composition.
  • the combination of a non-photosensitive resin composition (a1) and a positive photosensitive resin composition (b1) may be sufficient, and a non-photosensitive resin composition (a1) and a negative photosensitive resin composition ( It may be a combination with b1).
  • the combination of positive photosensitive resin composition (a1) and non-photosensitive resin composition (b1) may be sufficient, and negative photosensitive resin composition (a1) and non-photosensitive resin composition (b1) A combination may be used.
  • the non-photosensitive resin composition (a1) include a composition containing a thermosetting resin.
  • the total film thickness of the laminated structure of the present invention is preferably 100 ⁇ m or less, and more preferably in the range of 4 to 80 ⁇ m.
  • the developable adhesive layer (a) is, for example, 3 to 60 ⁇ m, but is not limited thereto. By setting it as such thickness, a developable contact bonding layer (a) can closely_contact
  • the developable protective layer (b) may have a thickness of 1 to 20 ⁇ m, for example.
  • FIG. 2 is a cross-sectional view showing a state where a pattern is formed by irradiating the photosensitive resin structure 1 on the flexible printed wiring board shown in FIG. 1 with light and then developing with an alkaline developer.
  • the photosensitive resin composition (b1) is diluted with an organic solvent to have an appropriate viscosity, and is applied to the carrier film with a uniform thickness using a comma coater or the like.
  • the coating layer is dried to form a developable protective layer (b) on the carrier film.
  • a developable adhesive layer (a) can be formed on the developable protective layer (b) with a photosensitive or non-photosensitive resin composition (a1) to obtain the dry film of the present invention.
  • a plastic film is used as the carrier film.
  • the thickness of the carrier film is not particularly limited, but is generally appropriately selected within the range of 10 to 150 ⁇ m.
  • the flexible printed wiring board of the present invention has a protective film formed by patterning the photosensitive resin structure of the present invention on the flexible printed wiring board by light irradiation and forming the pattern in a lump with a developer.
  • the protective film is preferably at least one of a coverlay and a solder resist.
  • a dry film is bonded on the flexible printed wiring board by a laminator or the like so that the developable adhesive layer (a) is in contact with at least one of the bent portion and the non-bent portion of the flexible printed wiring board.
  • a photosensitive adhesive composition or a non-photosensitive resin composition (a1) and a photosensitive resin composition (b1) are sequentially applied and dried on a flexible printed wiring board by screen printing or the like, and then a developing adhesive layer. (A) and a developable protective layer (b) are formed.
  • the resin composition (a1) is applied to a flexible printed wiring board and dried to form a developable adhesive layer (a). From the photosensitive resin composition (b1) on the developable adhesive layer (a). The film which laminates may be formed and the method of forming a developable protective layer (b) may be used. Conversely, a developable adhesive layer (a) is formed by laminating a film made of the resin composition (a1) on a flexible printed wiring board, and a photosensitive resin composition (a) is formed on the developable adhesive layer (a). The developable protective layer (b) may be formed by applying and drying b1).
  • the manufacturing method of the flexible printed wiring board using the negative photosensitive resin structure containing a photoinitiator In the case of a negative laminated resin structure containing a photopolymerization initiator, it is sufficient that at least one of the resin composition (a1) and the resin composition (b1) contains a photopolymerization initiator. In this case, a photosensitive resin structure having a developable adhesive layer (a) and a developable protective layer (b) is formed on the flexible printed wiring board by the laminating method or the like. Thereafter, the negative photosensitive resin structure is irradiated with light in a pattern by a contact method or a non-contact method, and an unirradiated portion is developed to obtain a protective film having a negative pattern.
  • thermosetting component for example, by heating to a temperature of about 140 to 180 ° C. and thermosetting, heat resistance, chemical resistance, moisture absorption, adhesion, electrical characteristics, etc. A protective film having excellent characteristics can be formed. Since the negative photosensitive resin structure contains a photopolymerization initiator, the light irradiation part is cured by radical polymerization.
  • the manufacturing method of the flexible printed wiring board using the negative photosensitive resin structure containing a photobase generator also in the case of a negative laminated resin structure containing a photobase generator, at least one of the resin composition (a1) and the resin composition (b1) only needs to contain a photobase generator. Also in this case, first, a negative photosensitive resin structure having a developable adhesive layer (a) and a developable protective layer (b) is formed on the flexible printed wiring board by the laminating method or the like. Thereafter, the negative photosensitive resin structure is irradiated with light in a pattern, thereby generating a base from the photobase generator and curing the light irradiation portion.
  • the unirradiated portion is removed by development to obtain a protective film having a negative pattern.
  • ultraviolet rays may be irradiated after the development in order to further improve the insulation reliability of the protective film.
  • a heat curing (post-cure) step may be further included, and both ultraviolet irradiation and heat curing may be performed after development.
  • the heating temperature in the thermosetting process is, for example, 160 ° C. or higher.
  • At least one of the resin composition (a1) and the resin composition (b1) may be a positive type composition.
  • the positive photosensitive resin structure having the developable adhesive layer (a) and the developable protective layer (b) is formed on the flexible printed wiring board by the laminating method or the like. Then, the polarity is changed by irradiating the positive photosensitive resin structure with light in a pattern. Thereafter, the light irradiation part is developed to obtain a protective film having a positive pattern.
  • the exposure apparatus used for the light irradiation may be any apparatus that is equipped with a high-pressure mercury lamp lamp, an ultra-high pressure mercury lamp lamp, a metal halide lamp, a mercury short arc lamp, etc., and irradiates ultraviolet rays in the range of 350 to 450 nm.
  • a direct drawing apparatus for example, a laser direct imaging apparatus that directly draws an image with a laser using CAD data from a computer
  • a laser light source of the direct drawing apparatus either a gas laser or a solid laser may be used as long as laser light having a maximum wavelength in the range of 350 to 450 nm is used.
  • the exposure amount for image formation varies depending on the film thickness and the like, but can generally be in the range of 20 to 1500 mJ / cm 2 .
  • the developing method can be a dipping method, a shower method, a spray method, a brush method or the like, and as a developer, potassium hydroxide, sodium hydroxide, sodium carbonate, potassium carbonate, sodium phosphate, sodium silicate, Alkaline aqueous solutions such as ammonia and amines can be used.
  • the laminated structure of the present invention has a laminated structure having a resin layer (A) made of an alkali developing resin composition and a resin layer (B) laminated on a flexible printed wiring board via the resin layer (A).
  • the resin layer (B) is composed of a photosensitive thermosetting resin composition containing an alkali-soluble resin having an imide ring, a photobase generator, and a heat-reactive compound. is there.
  • Such a laminated structure of the present invention can be laminated on a flexible printed wiring board, and can be patterned by light irradiation on the flexible printed wiring board, and patterns can be collectively formed by development. It becomes.
  • a resin having an imide ring in the molecule is used as the resin layer (B), and (2) an alkali-soluble resin and a thermally reactive compound are used.
  • This layer functions as a reinforcing layer by using a composition utilizing the addition reaction, and even if a resin layer (A) made of a conventional solder resist composition or an interlayer insulating material is used, impact resistance and bending It is possible to provide an insulating film for a flexible printed wiring board that is excellent in reliability such as reliability and low warpage and processing accuracy and excellent in workability.
  • the laminated structure of the present invention has a resin layer (A) and a resin layer (B) in order on a flexible printed wiring board in which a copper circuit is formed on a flexible substrate, and at least the resin layer (B) is irradiated with light. Can be patterned, and the resin layer (A) and the resin layer (B) can collectively form a pattern by development.
  • the alkali-developable resin composition constituting the resin layer (A) is a composition containing a resin that contains one or more functional groups among phenolic hydroxyl groups, thiol groups, and carboxyl groups and that can be developed with an alkaline solution. Any photocurable resin composition or thermosetting resin composition may be used. Preferred examples include a resin composition containing a compound having two or more phenolic hydroxyl groups, a carboxyl group-containing resin, a compound having a phenolic hydroxyl group and a carboxyl group, and a compound having two or more thiol groups. It is done.
  • thermosetting resin composition For example, a light containing a carboxyl group-containing resin or a carboxyl group-containing photosensitive resin, a compound having an ethylenically unsaturated bond, a photopolymerization initiator, and a heat-reactive compound conventionally used as a solder resist composition
  • a curable thermosetting resin composition is mentioned.
  • carboxyl group-containing resin or a carboxyl group-containing photosensitive resin a compound having an ethylenically unsaturated bond, a photopolymerization initiator, and a heat-reactive compound, known and commonly used ones are used.
  • the photosensitive thermosetting resin composition constituting the resin layer (B) includes an alkali-soluble resin having an imide ring, a photobase generator, and a heat-reactive compound.
  • the alkali-soluble resin having an imide ring is one having an alkali-soluble group such as a carboxyl group or an acid anhydride group and an imide ring.
  • a known and usual method can be used for introducing the imide ring into the alkali-soluble resin.
  • the resin obtained by making a carboxylic anhydride component react with an amine component and / or an isocyanate component is mentioned.
  • the imidization may be performed by thermal imidization or chemical imidization, and these can be used in combination.
  • examples of the carboxylic acid anhydride component include tetracarboxylic acid anhydrides and tricarboxylic acid anhydrides, but are not limited to these acid anhydrides, and acid anhydrides that react with amino groups or isocyanate groups. Any compound having a physical group and a carboxyl group can be used, including derivatives thereof. These carboxylic anhydride components may be used alone or in combination.
  • tetracarboxylic acid anhydride examples include pyromellitic dianhydride, 3-fluoropyromellitic dianhydride, 3,6-difluoropyromellitic dianhydride, 3,6-bis (trifluoromethyl) pyro Merit acid dianhydride, 3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, 4,4′-oxydiphthalic acid Anhydride, 2,2'-difluoro-3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, 5,5'-difluoro-3,3', 4,4'-biphenyltetracarboxylic dianhydride Anhydride, 6,6′-difluoro-3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, 2,
  • tricarboxylic acid anhydride examples include trimellitic acid anhydride and nuclear hydrogenated trimellitic acid anhydride.
  • amine component diamines such as aliphatic diamines and aromatic diamines, and polyvalent amines such as aliphatic polyether amines can be used, but are not limited to these amines. These amine components may be used alone or in combination.
  • diamine examples include p-phenylenediamine (PPD), 1,3-diaminobenzene, 2,4-toluenediamine, 2,5-toluenediamine, 2,6-toluenediamine, 3,5-diaminobenzoic acid,
  • PPD p-phenylenediamine
  • 1,3-diaminobenzene 1,3-diaminobenzene
  • 2,4-toluenediamine 2,5-toluenediamine
  • 2,6-toluenediamine 3,5-diaminobenzoic acid
  • One diamine nucleus diamine such as 2,5-diaminobenzoic acid and 3,4-diaminobenzoic acid
  • diaminodiphenyl ether such as 4,4′-diaminodiphenyl ether, 3,3′-diaminodiphenyl ether, and 3,4′-diaminodiphenyl ether 4,4′-d
  • isocyanate component aromatic diisocyanates and their isomers and multimers, aliphatic diisocyanates, alicyclic diisocyanates and isomers thereof, and other general-purpose diisocyanates can be used. It is not limited. These isocyanate components may be used alone or in combination.
  • diisocyanates include aromatic diisocyanates such as 4,4′-diphenylmethane diisocyanate, tolylene diisocyanate, naphthalene diisocyanate, xylylene diisocyanate, biphenyl diisocyanate, diphenyl sulfone diisocyanate, diphenyl ether diisocyanate, and isomers, multimers, hexamethylene diisocyanate, and isophorone.
  • aromatic diisocyanates such as 4,4′-diphenylmethane diisocyanate, tolylene diisocyanate, naphthalene diisocyanate, xylylene diisocyanate, biphenyl diisocyanate, diphenyl sulfone diisocyanate, diphenyl ether diisocyanate, and isomers, multimers, hexamethylene diisocyanate, and isophorone.
  • Examples thereof include aliphatic diisocyanates such as diisocyanate, dicyclohexylmethane diisocyanate, and xylylene diisocyanate, alicyclic diisocyanates and isomers obtained by hydrogenation of the aromatic diisocyanate, and other general-purpose diisocyanates.
  • the alkali-soluble resin having an imide ring as described above may have an amide bond.
  • This may be an amide bond obtained by reacting an isocyanate and a carboxylic acid, or may be caused by other reaction.
  • you may have the coupling
  • a known and commonly used alkali-soluble polymer, oligomer or monomer having a carboxyl group and / or an acid anhydride group may be used. It may be a resin obtained by reacting an alkali-soluble resin alone or in combination with the above carboxylic anhydride component and reacting with the above amine / isocyanate.
  • an organic solvent is not particularly limited as long as it is a solvent that does not react with the carboxylic acid anhydrides, amines, and isocyanates that are raw materials and that dissolves these raw materials, and the structure is not particularly limited.
  • Specific examples include amide solvents such as N, N-dimethylformamide, N, N-dimethylacetamide, N-methylpyrrolidone, ⁇ -butyrolactone, ⁇ -valerolactone, ⁇ -valerolactone, ⁇ -caprolactone, ⁇ -caprolactone.
  • Cyclic ester solvents such as ⁇ -methyl- ⁇ -butyrolactone, carbonate solvents such as ethylene carbonate and propylene carbonate, lactam solvents such as caprolactam, ether solvents such as dioxane, glycol solvents such as triethylene glycol, m-cresol, phenolic solvents such as p-cresol, 3-chlorophenol, 4-chlorophenol, 4-methoxyphenol, 2,6-dimethylphenol, acetophenone, 1,3-dimethyl-2-imidazolidinone, sulfolane, dimethyl Sulfo Sid, such as tetramethylurea.
  • aprotic solvents such as N, N-dimethylformamide, N, N-dimethylacetamide, N-methyl-2-pyrrolidone, dimethyl sulfoxide, and ⁇ -butyrolactone are preferred because of the high solubility of the raw materials.
  • the alkali-soluble resin having an alkali-soluble group such as a carboxyl group or an acid anhydride group and an imide ring as described above has an acid value of 20 to 200 mgKOH / g in order to cope with the photolithography process. And more preferably 60 to 150 mgKOH / g.
  • the acid value is 20 mgKOH / g or more, the solubility in alkali increases, the developability becomes good, and further, the degree of crosslinking with the thermosetting component after light irradiation becomes high, so that sufficient development contrast is obtained. be able to.
  • the molecular weight of the alkali-soluble resin is preferably from 1,000 to 100,000, more preferably from 2,000 to 50,000, considering developability and cured coating film characteristics.
  • the molecular weight is 1,000 or more, sufficient development resistance and cured properties can be obtained after exposure and PEB.
  • the molecular weight is 100,000 or less, alkali solubility increases and developability improves.
  • the photobase generator used in the resin layer (B) is used as a catalyst for the polymerization reaction of a thermoreactive compound, which will be described later, when the molecular structure is changed by light irradiation such as ultraviolet light or visible light, or when the molecule is cleaved. It is a compound that produces one or more basic substances that can function. Examples of basic substances include secondary amines and tertiary amines. Examples of photobase generators include ⁇ -aminoacetophenone compounds, oxime ester compounds, acyloxyimino groups, N-formylated aromatic amino groups, N-acylated aromatic amino groups, nitrobenzyl carbamate groups, alkoxybenzyl carbamates.
  • oxime ester compounds and ⁇ -aminoacetophenone compounds are preferred.
  • ⁇ -aminoacetophenone compound those having two or more nitrogen atoms are particularly preferable.
  • WPBG-018 (trade name: 9-anthrylmethylN, N′-diethylcarbamate)
  • WPBG-027 trade name: (E) -1- [3- (2-hydroxyphenyl) -2-propenoyl Piperidine
  • WPBG-082 (trade name: guanidinium2- (3-benzoylphenyl) propionate
  • WPBG-140 (trade name: 1- (anthraquinon-2-yl) ethyl imidazole carbonate).
  • the ⁇ -aminoacetophenone compound has a benzoin ether bond in the molecule, and when irradiated with light, cleavage occurs in the molecule to produce a basic substance (amine) that exhibits a curing catalytic action.
  • ⁇ -aminoacetophenone compounds include (4-morpholinobenzoyl) -1-benzyl-1-dimethylaminopropane (Irgacure 369, trade name, manufactured by BASF Japan Ltd.) and 4- (methylthiobenzoyl) -1-methyl.
  • -1-morpholinoethane (Irgacure 907, trade name, manufactured by BASF Japan Ltd.), 2- (dimethylamino) -2-[(4-methylphenyl) methyl] -1- [4- (4-morpholinyl)
  • a commercially available compound such as phenyl] -1-butanone (Irgacure 379, trade name, manufactured by BASF Japan Ltd.) or a solution thereof can be used.
  • any compound that generates a basic substance by light irradiation can be used.
  • examples of such oxime ester compounds include CGI-325, Irgacure OXE01, Irgacure OXE02 manufactured by BASF Japan Ltd., N-1919, NCI-831 manufactured by Adeka Corp., and the like.
  • numerator described in the patent 4344400 gazette can also be used suitably.
  • Such photobase generators may be used alone or in combination of two or more.
  • the blending amount of the photobase generator in the thermosetting resin composition is preferably 0.1 to 40 parts by mass, more preferably 0.1 to 30 parts by mass with respect to 100 parts by mass of the thermoreactive compound. It is. In the case of 0.1 parts by mass or more, the development resistance contrast of the light irradiated part / non-irradiated part can be favorably obtained. Moreover, in 40 mass parts or less, hardened
  • the heat-reactive compound used in the resin layer (B) is a resin having a functional group capable of undergoing a curing reaction by heat, preferably a resin having a cyclic (thio) ether group, more preferably an epoxy resin, Examples include polyfunctional oxetane compounds.
  • the cyclic (thio) ether group means at least one of a cyclic ether group and a cyclic thioether group.
  • the epoxy resin is a resin having an epoxy group, and any known one can be used. Examples thereof include a bifunctional epoxy resin having two epoxy groups in the molecule, and a polyfunctional epoxy resin having many epoxy groups in the molecule. In addition, a hydrogenated bifunctional epoxy compound may be used.
  • Polyfunctional epoxy compounds include bisphenol A type epoxy resin, brominated epoxy resin, novolac type epoxy resin, bisphenol F type epoxy resin, hydrogenated bisphenol A type epoxy resin, glycidylamine type epoxy resin, hydantoin type epoxy resin, alicyclic ring Epoxy resin, trihydroxyphenylmethane type epoxy resin, bixylenol type or biphenol type epoxy resin or a mixture thereof; bisphenol S type epoxy resin, bisphenol A novolak type epoxy resin, tetraphenylolethane type epoxy resin, heterocyclic epoxy Resin, diglycidyl phthalate resin, tetraglycidyl xylenoyl ethane resin, naphthalene group-containing epoxy resin, epoxy resin having dicyclopentadiene skeleton, glycidyl methacrylate Acrylate copolymer epoxy resins, copolymerized epoxy resins of cyclohexylmaleimide and glycidyl methacrylate, and
  • liquid bifunctional epoxy resins include vinylcyclohexene diepoxide, (3 ′, 4′-epoxycyclohexylmethyl) -3,4-epoxycyclohexanecarboxylate, (3 ′, 4′-epoxy-6′-methyl) And alicyclic epoxy resins such as (cyclohexylmethyl) -3,4-epoxy-6-methylcyclohexanecarboxylate. These epoxy resins may be used individually by 1 type, and may use 2 or more types together.
  • polyfunctional oxetane compound examples include bis [(3-methyl-3-oxetanylmethoxy) methyl] ether, bis [(3-ethyl-3-oxetanylmethoxy) methyl] ether, 1,4-bis [(3-methyl -3-Oxetanylmethoxy) methyl] benzene, 1,4-bis [(3-ethyl-3-oxetanylmethoxy) methyl] benzene, (3-methyl-3-oxetanyl) methyl acrylate, (3-ethyl-3-oxetanyl)
  • polyfunctional oxetanes such as methyl acrylate, (3-methyl-3-oxetanyl) methyl methacrylate, (3-ethyl-3-oxetanyl) methyl methacrylate and oligomers or copolymers thereof, oxetane alcohol and novolak resin, Poly (p-hydroxystyrene
  • the amount of the heat-reactive compound is such that the equivalent ratio with the alkali-soluble resin (alkali-soluble group such as carboxyl group: heat-reactive group such as epoxy group) is 1: 0.1 to 1:10. It is preferable. By setting the blending ratio in such a range, development becomes favorable and a fine pattern can be easily formed.
  • the equivalent ratio is more preferably 1: 0.2 to 1: 5.
  • Polymer resin The resin composition used in the resin layer (A) and the resin layer (B) as described above is blended with a known and commonly used polymer resin for the purpose of improving the flexibility and dryness of the cured product obtained. can do.
  • polymer resins include cellulose-based, polyester-based, phenoxy-resin-based polymers, polyvinyl acetal-based, polyvinyl butyral-based, polyamide-based, polyamide-imide-based binder polymers, block copolymers, and elastomers. This polymer resin may be used individually by 1 type, and may use 2 or more types together.
  • the resin composition used in the resin layer (A) and the resin layer (B) is blended with an inorganic filler in order to suppress curing shrinkage of the cured product and improve properties such as adhesion and hardness.
  • an inorganic filler examples include barium sulfate, amorphous silica, fused silica, spherical silica, talc, clay, magnesium carbonate, calcium carbonate, aluminum oxide, aluminum hydroxide, silicon nitride, aluminum nitride, boron nitride, Neuburg Sicilius Earth etc. are mentioned.
  • the base in the resin composition used in the present invention, can be sufficiently cured to the deep part of the resin layer by the chemical growth of the base to the deep part. Therefore, according to the resin composition used in the present invention, even when a colorant is contained, a pattern layer having excellent copper circuit concealing property and excellent adhesion can be formed.
  • organic solvent For the resin composition used in the resin layer (A) and the resin layer (B), an organic solvent should be used for preparing the resin composition and adjusting the viscosity for application to a substrate or carrier film. Can do. Examples of such organic solvents include ketones, aromatic hydrocarbons, glycol ethers, glycol ether acetates, esters, alcohols, aliphatic hydrocarbons, petroleum solvents, and the like. Such an organic solvent may be used individually by 1 type, and may be used as a 2 or more types of mixture.
  • the resin composition used in the resin layer (A) and the resin layer (B) can further contain components such as a mercapto compound, an adhesion promoter, an antioxidant, and an ultraviolet absorber as necessary.
  • a mercapto compound such as finely divided silica, hydrotalcite, organic bentonite, montmorillonite, defoamers and / or leveling agents such as silicones, fluorines and polymers, silane coupling agents, rust inhibitors
  • Known and conventional additives such as can be blended.
  • the method for producing a flexible printed wiring board of the present invention includes a step of forming at least one resin layer (A) made of an alkali-developable photosensitive resin composition (A1) on the flexible printed wiring board, the resin layer (A) A step of forming at least one resin layer (B) comprising a photosensitive thermosetting resin composition (B1) containing an alkali-soluble resin having an imide ring, a photobase generator, and a thermoreactive compound; A step of irradiating the resin layers (A) and (B) formed in the step with light in a pattern, a step of heating the resin layers (A) and (B) irradiated with the light in the step, and the light A step of alkali-developing the irradiated resin layers (A) and (B) to form at least one of a coverlay and a solder resist.
  • the resin layer (B) in the present invention, (1) a resin having an imide ring in the molecule is used, and (2) a composition that causes an addition reaction between an alkali-soluble resin and a thermally reactive compound is used.
  • the resin layer (B) can function as a reinforcing layer. That is, by forming a resin layer (A) made of a conventional solder resist composition and laminating the resin layer (B) on the resin layer (A), impact resistance, flexibility, low warpage, etc. A cover lay and a solder resist having excellent reliability and processing accuracy can be collectively formed on a flexible printed wiring board. Note that an interlayer insulating film may be formed as the insulating film.
  • at least one resin layer (A) made of the alkali development type photosensitive resin composition (A1) is formed on the flexible printed wiring board. Since the resin layer (A) can be alkali-developed, a pattern can be formed. Further, by laminating the resin layer (A), the circuit followability and the adhesion to the substrate can be improved.
  • the flexible printed wiring board is obtained by forming a copper circuit 2 on a flexible substrate 1.
  • the position where the resin layer (A) is formed may be one of a bent portion and a non-bent portion, but is preferably both a bent portion and a non-bent portion.
  • the bent portion is a portion that is repeatedly bent and requires flexibility
  • the non-bent portion is a portion that is not bent, such as a chip mounting portion.
  • Examples of the method for forming the resin layer (A) include a coating method and a laminating method.
  • the coating method the alkali-developable photosensitive resin composition (A1) is coated on the flexible printed wiring board by a screen printing method, a curtain coating method, a spray coating method, a roll coating method or the like, and 50 to 130 ° C.
  • the resin layer (A) is formed by heating at about a temperature for about 15 to 60 minutes.
  • the laminating method first, the alkali developing type photosensitive resin composition (A1) is diluted with an organic solvent to adjust to an appropriate viscosity, applied onto a carrier film and dried to have a resin layer (A). Create Next, after bonding together so that a resin layer (A) may contact a flexible printed wiring board with a laminator etc., a carrier film is peeled.
  • a resin layer (B) comprising a photosensitive thermosetting resin composition (B1) containing an alkali-soluble resin having an imide ring, a photobase generator, and a heat-reactive compound on the resin layer (A).
  • a resin layer (B) comprising a photosensitive thermosetting resin composition (B1) containing an alkali-soluble resin having an imide ring, a photobase generator, and a heat-reactive compound on the resin layer (A).
  • At least one layer Since the resin layer (B) can be alkali-developed, a fine pattern can be formed and the processing accuracy is excellent. Further, by laminating the resin layer (B), it is possible to improve impact resistance, flexibility and low warpage.
  • the position where the resin layer (B) is formed is preferably both a bent portion and a non-bent portion on the resin layer (A).
  • the resin layer (B) may be formed only on the bent portion or only on the non-bent portion of the resin layer (A). Further, a further layer may be interposed between the resin layer (B) and the resin layer (A).
  • the resin layer (B) can be formed by the same method as the method for forming the resin layer (A).
  • the resin layers (A) and (B) may be formed by laminating the laminated dry film on a flexible printed wiring board after making them into one laminated dry film.
  • the resin layer (A) is preferably formed thicker than the resin layer (B) from the viewpoint of followability to the copper circuit.
  • the resin layers (A) and (B) are irradiated with light in a negative pattern.
  • the photobase generator contained in the photosensitive thermosetting resin composition can be activated to cure the light irradiation part.
  • this base acts as a catalyst for the addition reaction between the alkali-developable resin and the heat-reactive compound, and the addition reaction proceeds. Therefore, in the light irradiation part, the resin layer is sufficiently deep. To harden.
  • a light irradiation device for example, a laser direct imaging device that directly draws an image with a laser using CAD data from a computer
  • a light irradiation device equipped with a metal halide lamp or a light irradiation device equipped with a (ultra) high pressure mercury lamp
  • a light irradiator equipped with a mercury short arc lamp or a direct drawing apparatus using an ultraviolet lamp such as a (super) high pressure mercury lamp can be used.
  • the active energy ray used for light irradiation it is preferable to use laser light or scattered light having a maximum wavelength in the range of 350 to 450 nm.
  • the amount of light irradiation varies depending on the film thickness and the like, but can generally be in the range of 50 to 1500 mJ / cm 2 , preferably 100 to 1000 mJ / cm 2 .
  • the resin layers (A) and (B) are heated. Thereby, it can fully harden
  • This process is a so-called PEB (POST EXPOSURE BAKE) process.
  • the heating temperature is preferably a temperature at which the light-irradiated portion of the thermosetting resin composition is thermally cured, but the non-irradiated portion is not thermally cured.
  • the heating step is a temperature lower than the heat generation start temperature or the heat generation peak temperature of the unirradiated thermosetting resin composition and higher than the heat generation start temperature or the heat generation peak temperature of the light irradiated thermosetting resin composition. It is preferable to heat with.
  • the heating temperature is, for example, 80 to 140 ° C. By setting the heating temperature to 80 ° C. or higher, the light irradiation part can be sufficiently cured. On the other hand, by setting the heating temperature to 140 ° C. or lower, only the light irradiation part can be selectively cured.
  • the heating time is, for example, 10 to 100 minutes. In the unirradiated portion, no base is generated from the photobase generator, so that thermosetting is suppressed.
  • the development method is alkali development, and can be performed by a known method such as a dipping method, a shower method, a spray method, or a brush method.
  • the alkaline developer include potassium hydroxide, sodium hydroxide, sodium carbonate, potassium carbonate, sodium phosphate, sodium silicate, ammonia, ethanolamine, amines such as imidazole, tetramethylammonium hydroxide aqueous solution (TMAH), etc.
  • TMAH tetramethylammonium hydroxide aqueous solution
  • An alkaline aqueous solution or a mixed solution thereof can be used.
  • the following steps may be added as necessary.
  • the resin layers (A) and (B) may be irradiated with light.
  • the photobase generator remaining without being activated in the resin layer (B) in the previous light irradiation step is activated to sufficiently generate a base.
  • the wavelength of ultraviolet rays and the light irradiation amount (exposure amount) in this light irradiation may be the same as or different from those in the light irradiation step.
  • the light irradiation amount is, for example, 150 to 2000 mJ / cm 2 .
  • the resin layers (A) and (B) may be further thermally cured (post-cured) by heating.
  • the pattern layer is sufficiently thermoset by the light irradiation step or the base generated from the photobase generator in the light irradiation step and the second light irradiation step. Since the unirradiated part has already been removed at the time of the thermosetting process, the thermosetting process can be performed at a temperature equal to or higher than the curing reaction start temperature of the unirradiated thermosetting resin composition.
  • the heating temperature is, for example, 150 ° C. or higher.
  • Example 1 and 2 Comparative Examples 1 and 2
  • Various components shown in Table 1 below were blended in the proportions (parts by mass) shown in Table 1, premixed with a stirrer, and then kneaded with a three-roll mill to prepare a photosensitive resin composition.
  • Example 1 For Example 1, the laminating method was used. In Example 1, after the photosensitive resin composition for (b) layer was applied to a carrier film and dried to form a developable protective layer, the photosensitive resin composition for (a) layer was formed on the surface. Was applied and dried to obtain a dry film. The dry film was pressure-bonded to a flexible printed wiring board at 120 ° C. to form a photosensitive resin structure. Table 1 shows the film thickness. (Example 2) For Example 2, the whole surface printing method was used, and after the photosensitive resin composition for layer (a) was applied on a flexible printed wiring board and dried, the photosensitive resin composition for layer (b) was applied to the surface. Application and drying were performed to form a photosensitive resin structure. Each film thickness is shown in Table 1.
  • Comparative Example 1 About the comparative example 1, the whole surface printing method was used, the photosensitive resin composition for (b) layer was apply
  • Comparative Example 2 For Comparative Example 2, the whole surface printing method was used, and the photosensitive resin composition for (a) layer was applied onto the flexible printed wiring board and dried to obtain a flexible printed wiring board having only the (a) layer. Table 1 shows the film thickness.
  • Comparative Example 3 For Comparative Example 3, the laminating method was used.
  • Comparative Example 3 the resin for (a) layer was applied to a polyimide film having an opening pattern of 5 mm ⁇ 5 mm formed by punching, dried, and then pressed onto a flexible printed wiring board at 120 ° C. Thereby, the flexible printed wiring board which has a pattern was obtained.
  • the film thickness is shown in Table 1.
  • Comparative Example 4 a pattern printing method is used, and a resin for layer (b) is applied and dried on a flexible printed wiring board by pattern printing with an opening of 5 mm ⁇ 5 mm, and (b) a flexible printed wiring board having a pattern of only the layer Got. Table 1 shows the film thickness.
  • ⁇ Formation of resin layer (A)> A flexible printed wiring substrate on which a circuit having a copper thickness of 18 ⁇ m was formed was prepared, and pre-treatment was performed using MEC CZ-8100. Thereafter, the pre-treated flexible printed wiring board was coated with the resin compositions of Examples 3 and 4 and Comparative Example 5 by a coating method shown in Table 3 so that the film thickness was 25 ⁇ m after drying. Went. Then, it dried at 90 degreeC / 30 minutes with the hot-air circulation type drying furnace, and formed the resin layer (A) which consists of a resin composition.
  • the flexible printed wiring boards of Examples 3 and 4 can be developed in the same manner as the flexible printed wiring board of Comparative Example 5, and the flexibility and surface hardness are greatly increased. It turns out that it is excellent.

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016060137A1 (ja) * 2014-10-14 2016-04-21 太陽インキ製造株式会社 積層構造体
WO2016060237A1 (ja) * 2014-10-16 2016-04-21 太陽インキ製造株式会社 積層構造体、ドライフィルムおよびフレキシブルプリント配線板
CN107850847A (zh) * 2015-08-05 2018-03-27 太阳油墨制造株式会社 层叠结构体、干膜和柔性印刷电路板
US11140768B2 (en) 2019-04-10 2021-10-05 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with high passive intermodulation performance

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180102622A (ko) * 2016-01-13 2018-09-17 다이요 홀딩스 가부시키가이샤 감광성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판
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JP2019056824A (ja) * 2017-09-21 2019-04-11 株式会社タムラ製作所 感光性樹脂組成物の光硬化膜及び感光性樹脂組成物の光硬化膜を有するプリント配線板
WO2019194208A1 (ja) * 2018-04-04 2019-10-10 住友電工プリントサーキット株式会社 フレキシブルプリント配線板用カバーフィルム及びフレキシブルプリント配線板
CN110519936A (zh) * 2019-08-01 2019-11-29 中国电子科技集团公司第二十九研究所 一种ltcc基板表面的高精密超薄阻焊膜层及其制作工艺方法
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KR20230126600A (ko) 2022-02-23 2023-08-30 정지훈 무선 블루투스 보조배터리

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003255534A (ja) * 2002-02-28 2003-09-10 Mitsui Chemicals Inc 多層感光性樹脂フィルム及びそれからなる絶縁膜
JP2005300857A (ja) * 2004-04-09 2005-10-27 Fuji Photo Film Co Ltd 感光性転写シート、感光性積層体、画像パターン形成方法、及び配線パターン形成方法
JP2009025699A (ja) * 2007-07-23 2009-02-05 Kaneka Corp 感光性ドライフィルムレジスト、これを用いたプリント配線板、および、プリント配線板の製造方法
JP2009048170A (ja) * 2007-07-24 2009-03-05 Kaneka Corp 感光性ドライフィルムレジスト、これを用いたプリント配線板、及び、プリント配線板の製造方法
JP2010204174A (ja) * 2009-02-27 2010-09-16 Fujifilm Corp 感光性積層体及び感光性フィルム、並びに、プリント基板の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62263692A (ja) 1986-05-12 1987-11-16 ニツポン高度紙工業株式会社 耐熱性フレキシブルプリント配線板
JPS63110224A (ja) 1986-10-27 1988-05-14 Dainippon Printing Co Ltd フレキシブルオ−バ−レイフイルム
JP2007071966A (ja) * 2005-09-05 2007-03-22 Hitachi Chem Co Ltd 永久レジストの製造方法及びプリント配線板の製造方法
JP5567290B2 (ja) * 2009-05-12 2014-08-06 太陽ホールディングス株式会社 感光性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5740915B2 (ja) * 2010-10-28 2015-07-01 東レ株式会社 フィルム積層体
JP5796628B2 (ja) 2011-03-30 2015-10-21 宇部興産株式会社 ポリイミドフィルム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003255534A (ja) * 2002-02-28 2003-09-10 Mitsui Chemicals Inc 多層感光性樹脂フィルム及びそれからなる絶縁膜
JP2005300857A (ja) * 2004-04-09 2005-10-27 Fuji Photo Film Co Ltd 感光性転写シート、感光性積層体、画像パターン形成方法、及び配線パターン形成方法
JP2009025699A (ja) * 2007-07-23 2009-02-05 Kaneka Corp 感光性ドライフィルムレジスト、これを用いたプリント配線板、および、プリント配線板の製造方法
JP2009048170A (ja) * 2007-07-24 2009-03-05 Kaneka Corp 感光性ドライフィルムレジスト、これを用いたプリント配線板、及び、プリント配線板の製造方法
JP2010204174A (ja) * 2009-02-27 2010-09-16 Fujifilm Corp 感光性積層体及び感光性フィルム、並びに、プリント基板の製造方法

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WO2016060137A1 (ja) * 2014-10-14 2016-04-21 太陽インキ製造株式会社 積層構造体
WO2016060237A1 (ja) * 2014-10-16 2016-04-21 太陽インキ製造株式会社 積層構造体、ドライフィルムおよびフレキシブルプリント配線板
CN107850847A (zh) * 2015-08-05 2018-03-27 太阳油墨制造株式会社 层叠结构体、干膜和柔性印刷电路板
CN107850847B (zh) * 2015-08-05 2021-04-13 太阳油墨制造株式会社 层叠结构体、干膜和柔性印刷电路板
US11140768B2 (en) 2019-04-10 2021-10-05 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with high passive intermodulation performance

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