KR102227814B1 - 형광체 시트로 라미네이팅된 발광 다이오드와 그 제조 방법 - Google Patents

형광체 시트로 라미네이팅된 발광 다이오드와 그 제조 방법 Download PDF

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KR102227814B1
KR102227814B1 KR1020167000141A KR20167000141A KR102227814B1 KR 102227814 B1 KR102227814 B1 KR 102227814B1 KR 1020167000141 A KR1020167000141 A KR 1020167000141A KR 20167000141 A KR20167000141 A KR 20167000141A KR 102227814 B1 KR102227814 B1 KR 102227814B1
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film
leds
led
temperature
wavelength converting
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Korean (ko)
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KR20160018662A (ko
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피터 마호발트
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루미리즈 홀딩 비.브이.
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H01L33/005—
    • H01L25/0753—
    • H01L33/44—
    • H01L33/501—
    • H01L33/502—
    • H01L33/505—
    • H01L2224/16225—
    • H01L2924/12041—
    • H01L2933/0041—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Led Device Packages (AREA)
KR1020167000141A 2013-06-06 2014-05-22 형광체 시트로 라미네이팅된 발광 다이오드와 그 제조 방법 Active KR102227814B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361831750P 2013-06-06 2013-06-06
US61/831,750 2013-06-06
PCT/IB2014/061622 WO2014195819A1 (en) 2013-06-06 2014-05-22 Light emitting diode laminated with a phosphor sheet and manufacturing method thereof

Publications (2)

Publication Number Publication Date
KR20160018662A KR20160018662A (ko) 2016-02-17
KR102227814B1 true KR102227814B1 (ko) 2021-03-16

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KR1020167000141A Active KR102227814B1 (ko) 2013-06-06 2014-05-22 형광체 시트로 라미네이팅된 발광 다이오드와 그 제조 방법

Country Status (7)

Country Link
US (1) US9985186B2 (https=)
EP (1) EP3005427B1 (https=)
JP (1) JP6370892B2 (https=)
KR (1) KR102227814B1 (https=)
CN (1) CN105264675B (https=)
TW (1) TWI691100B (https=)
WO (1) WO2014195819A1 (https=)

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US9911907B2 (en) * 2014-07-28 2018-03-06 Epistar Corporation Light-emitting apparatus
EP3210245B1 (en) * 2014-10-24 2019-04-24 Dow Silicones Corporation Vacuum lamination method for forming a conformally coated article
CN105990496B (zh) * 2015-03-04 2018-11-16 光宝光电(常州)有限公司 Led封装结构及其制造方法
DE102015105474A1 (de) * 2015-04-10 2016-10-13 Osram Opto Semiconductors Gmbh Konverterbauteil für eine optoelektronische Leuchtvorrichtung
DE102015109413A1 (de) * 2015-06-12 2016-12-15 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von optoelektronischen Konversions-Halbleiterchips und Verbund von Konversions-Halbleiterchips
JP2017092092A (ja) * 2015-11-04 2017-05-25 豊田合成株式会社 発光装置の製造方法
WO2018139687A1 (ko) * 2017-01-25 2018-08-02 주식회사 에스엘네트웍스 Led 모듈
JP2018152463A (ja) * 2017-03-13 2018-09-27 スタンレー電気株式会社 半導体発光装置
KR102423549B1 (ko) * 2017-07-28 2022-07-22 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 실리콘 필름 제조 방법, 반도체소자 제조방법 및 반도체소자
TWI665797B (zh) * 2018-02-14 2019-07-11 Uniflex Technology Inc. 微發光二極體模組及其製法
CN110446383B (zh) * 2018-05-02 2021-03-05 毅力科技有限公司 在至少一电子模块上形成保护膜的方法
US11552228B2 (en) 2018-08-17 2023-01-10 Osram Opto Semiconductors Gmbh Optoelectronic component and method for producing an optoelectronic component
JP7243330B2 (ja) * 2019-03-15 2023-03-22 市光工業株式会社 発光素子及び車両用灯具、並びに発光素子の製造方法
CN118630121B (zh) * 2024-08-10 2024-11-08 南通东升灯饰有限公司 一种led封装体

Citations (1)

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JP2007123915A (ja) 2005-10-28 2007-05-17 Philips Lumileds Lightng Co Llc Ｌｅｄを覆う蛍光体を含んだカプセル封入ラミネート膜

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US5866952A (en) * 1995-11-30 1999-02-02 Lockheed Martin Corporation High density interconnected circuit module with a compliant layer as part of a stress-reducing molded substrate
JP4122737B2 (ja) * 2001-07-26 2008-07-23 松下電工株式会社 発光装置の製造方法
JP2005294733A (ja) * 2004-04-05 2005-10-20 Nitto Denko Corp 光半導体素子封止用シートおよび該シートを用いた光半導体装置の製造方法
JP2006302965A (ja) * 2005-04-15 2006-11-02 Sharp Corp 半導体発光装置およびその製造方法
JP5463646B2 (ja) * 2008-10-08 2014-04-09 日立化成株式会社 光モジュール
JP5310536B2 (ja) * 2009-12-25 2013-10-09 豊田合成株式会社 発光装置の製造方法
TWI476959B (zh) * 2010-04-11 2015-03-11 邱羅利士公司 轉移均勻螢光層至一物件上之方法及所製得之發光結構
TW201216526A (en) * 2010-08-20 2012-04-16 Koninkl Philips Electronics Nv Lamination process for LEDs
JP5349432B2 (ja) * 2010-09-06 2013-11-20 日東電工株式会社 電子部品装置の製法およびそれに用いる電子部品封止用樹脂組成物シート
KR101135093B1 (ko) * 2011-02-22 2012-04-16 서울대학교산학협력단 발광 다이오드의 균일 코팅 방법
US9349927B2 (en) * 2011-10-18 2016-05-24 Nitto Denko Corporation Encapsulating sheet and optical semiconductor element device
JP2013140848A (ja) * 2011-12-28 2013-07-18 Nitto Denko Corp 封止用シートおよび光半導体素子装置

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2007123915A (ja) 2005-10-28 2007-05-17 Philips Lumileds Lightng Co Llc Ｌｅｄを覆う蛍光体を含んだカプセル封入ラミネート膜

Also Published As

Publication number Publication date
EP3005427A1 (en) 2016-04-13
TW201511356A (zh) 2015-03-16
CN105264675B (zh) 2019-03-08
US20160126429A1 (en) 2016-05-05
US9985186B2 (en) 2018-05-29
JP6370892B2 (ja) 2018-08-08
KR20160018662A (ko) 2016-02-17
EP3005427B1 (en) 2019-01-16
JP2016521013A (ja) 2016-07-14
CN105264675A (zh) 2016-01-20
TWI691100B (zh) 2020-04-11
WO2014195819A1 (en) 2014-12-11

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