KR102215915B1 - 다이 본딩 장치 및 반도체 장치의 제조 방법 - Google Patents

다이 본딩 장치 및 반도체 장치의 제조 방법 Download PDF

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KR102215915B1
KR102215915B1 KR1020190024614A KR20190024614A KR102215915B1 KR 102215915 B1 KR102215915 B1 KR 102215915B1 KR 1020190024614 A KR1020190024614 A KR 1020190024614A KR 20190024614 A KR20190024614 A KR 20190024614A KR 102215915 B1 KR102215915 B1 KR 102215915B1
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South Korea
Prior art keywords
die
bonding head
bonding
substrate
target
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KR1020190024614A
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English (en)
Korean (ko)
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KR20190112641A (ko
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히데하루 고바시
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파스포드 테크놀로지 주식회사
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Publication of KR20190112641A publication Critical patent/KR20190112641A/ko
Priority to KR1020200157894A priority Critical patent/KR102399836B1/ko
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Publication of KR102215915B1 publication Critical patent/KR102215915B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67282—Marking devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/83122—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors by detecting inherent features of, or outside, the semiconductor or solid-state body
    • H01L2224/83129—Shape or position of the other item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/832—Applying energy for connecting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/10—Internal combustion engine [ICE] based vehicles
    • Y02T10/12—Improving ICE efficiencies

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR1020190024614A 2018-03-26 2019-03-04 다이 본딩 장치 및 반도체 장치의 제조 방법 KR102215915B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020200157894A KR102399836B1 (ko) 2018-03-26 2020-11-23 다이 본딩 장치 및 반도체 장치의 제조 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2018-059008 2018-03-26
JP2018059008A JP7018341B2 (ja) 2018-03-26 2018-03-26 ダイボンディング装置および半導体装置の製造方法

Related Child Applications (1)

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KR1020200157894A Division KR102399836B1 (ko) 2018-03-26 2020-11-23 다이 본딩 장치 및 반도체 장치의 제조 방법

Publications (2)

Publication Number Publication Date
KR20190112641A KR20190112641A (ko) 2019-10-07
KR102215915B1 true KR102215915B1 (ko) 2021-02-16

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KR1020190024614A KR102215915B1 (ko) 2018-03-26 2019-03-04 다이 본딩 장치 및 반도체 장치의 제조 방법
KR1020200157894A KR102399836B1 (ko) 2018-03-26 2020-11-23 다이 본딩 장치 및 반도체 장치의 제조 방법

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Country Status (4)

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JP (1) JP7018341B2 (ja)
KR (2) KR102215915B1 (ja)
CN (1) CN110364455B (ja)
TW (1) TWI702660B (ja)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI730506B (zh) * 2019-11-21 2021-06-11 日商新川股份有限公司 電子零件封裝裝置
JP7465199B2 (ja) * 2019-12-11 2024-04-10 芝浦メカトロニクス株式会社 実装装置
KR102350557B1 (ko) * 2020-03-06 2022-01-14 세메스 주식회사 다이 본딩 방법 및 다이 본딩 장치
JP7373436B2 (ja) * 2020-03-09 2023-11-02 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
JP7436251B2 (ja) * 2020-03-16 2024-02-21 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
JP7437987B2 (ja) * 2020-03-23 2024-02-26 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
KR102652796B1 (ko) * 2020-07-20 2024-03-28 세메스 주식회사 반도체 소자 본딩 장치 및 반도체 소자 본딩 방법
CN112070834B (zh) * 2020-08-11 2024-05-10 深圳市大族半导体装备科技有限公司 兼容多芯片定位方法、装置、设备和介质
DE102021111953A1 (de) * 2021-05-07 2022-11-10 Mühlbauer Gmbh & Co. Kg Optische Bauteilinspektion
CN114566445B (zh) * 2022-01-22 2023-09-08 苏州艾科瑞思智能装备股份有限公司 一种面向晶圆三维集成的高精度微组装设备
CN115586191B (zh) * 2022-11-11 2023-03-14 苏州恒视智能科技有限公司 新能源电池的极耳叠层自动调整检测机构

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JP2012248728A (ja) 2011-05-30 2012-12-13 Hitachi High-Tech Instruments Co Ltd ダイボンダ及びボンディング方法
JP2014179561A (ja) 2013-03-15 2014-09-25 Hitachi High-Tech Instruments Co Ltd ボンディングヘッドとそれを備えたダイボンダ
JP2016171107A (ja) 2015-03-11 2016-09-23 ファスフォードテクノロジ株式会社 ボンディング装置及びボンディング方法
JP2016197630A (ja) 2015-04-02 2016-11-24 ファスフォードテクノロジ株式会社 ボンディング装置及びボンディング方法
JP2016197629A (ja) 2015-04-02 2016-11-24 ファスフォードテクノロジ株式会社 ボンディング装置及びボンディング方法

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JP2014036068A (ja) 2012-08-08 2014-02-24 Shinkawa Ltd ダイボンダおよびボンディングツールの位置検出方法
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JP6510837B2 (ja) * 2015-03-11 2019-05-08 ファスフォードテクノロジ株式会社 ボンディング装置及びボンディング方法
JP6667326B2 (ja) * 2016-03-17 2020-03-18 ファスフォードテクノロジ株式会社 ダイボンダおよびボンディング方法

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Publication number Priority date Publication date Assignee Title
JP2012248728A (ja) 2011-05-30 2012-12-13 Hitachi High-Tech Instruments Co Ltd ダイボンダ及びボンディング方法
JP2014179561A (ja) 2013-03-15 2014-09-25 Hitachi High-Tech Instruments Co Ltd ボンディングヘッドとそれを備えたダイボンダ
JP2016171107A (ja) 2015-03-11 2016-09-23 ファスフォードテクノロジ株式会社 ボンディング装置及びボンディング方法
JP2016197630A (ja) 2015-04-02 2016-11-24 ファスフォードテクノロジ株式会社 ボンディング装置及びボンディング方法
JP2016197629A (ja) 2015-04-02 2016-11-24 ファスフォードテクノロジ株式会社 ボンディング装置及びボンディング方法

Also Published As

Publication number Publication date
CN110364455A (zh) 2019-10-22
CN110364455B (zh) 2023-04-07
KR20190112641A (ko) 2019-10-07
KR102399836B1 (ko) 2022-05-20
TW201941315A (zh) 2019-10-16
JP7018341B2 (ja) 2022-02-10
JP2019175888A (ja) 2019-10-10
KR20200135260A (ko) 2020-12-02
TWI702660B (zh) 2020-08-21

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