TWI702660B - 黏晶裝置及半導體裝置的製造方法 - Google Patents
黏晶裝置及半導體裝置的製造方法 Download PDFInfo
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- TWI702660B TWI702660B TW108105393A TW108105393A TWI702660B TW I702660 B TWI702660 B TW I702660B TW 108105393 A TW108105393 A TW 108105393A TW 108105393 A TW108105393 A TW 108105393A TW I702660 B TWI702660 B TW I702660B
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- die
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- bonding head
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8312—Aligning
- H01L2224/83121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
- H01L2224/83122—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors by detecting inherent features of, or outside, the semiconductor or solid-state body
- H01L2224/83129—Shape or position of the other item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/832—Applying energy for connecting
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/10—Internal combustion engine [ICE] based vehicles
- Y02T10/12—Improving ICE efficiencies
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-059008 | 2018-03-26 | ||
JP2018059008A JP7018341B2 (ja) | 2018-03-26 | 2018-03-26 | ダイボンディング装置および半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201941315A TW201941315A (zh) | 2019-10-16 |
TWI702660B true TWI702660B (zh) | 2020-08-21 |
Family
ID=68167558
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108105393A TWI702660B (zh) | 2018-03-26 | 2019-02-19 | 黏晶裝置及半導體裝置的製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7018341B2 (ja) |
KR (2) | KR102215915B1 (ja) |
CN (1) | CN110364455B (ja) |
TW (1) | TWI702660B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI730506B (zh) * | 2019-11-21 | 2021-06-11 | 日商新川股份有限公司 | 電子零件封裝裝置 |
JP7465199B2 (ja) * | 2019-12-11 | 2024-04-10 | 芝浦メカトロニクス株式会社 | 実装装置 |
KR102350557B1 (ko) * | 2020-03-06 | 2022-01-14 | 세메스 주식회사 | 다이 본딩 방법 및 다이 본딩 장치 |
JP7373436B2 (ja) * | 2020-03-09 | 2023-11-02 | ファスフォードテクノロジ株式会社 | ダイボンディング装置および半導体装置の製造方法 |
JP7436251B2 (ja) * | 2020-03-16 | 2024-02-21 | ファスフォードテクノロジ株式会社 | ダイボンディング装置および半導体装置の製造方法 |
JP7437987B2 (ja) * | 2020-03-23 | 2024-02-26 | ファスフォードテクノロジ株式会社 | ダイボンディング装置および半導体装置の製造方法 |
KR102652796B1 (ko) * | 2020-07-20 | 2024-03-28 | 세메스 주식회사 | 반도체 소자 본딩 장치 및 반도체 소자 본딩 방법 |
DE102021111953A1 (de) * | 2021-05-07 | 2022-11-10 | Mühlbauer Gmbh & Co. Kg | Optische Bauteilinspektion |
CN114566445B (zh) * | 2022-01-22 | 2023-09-08 | 苏州艾科瑞思智能装备股份有限公司 | 一种面向晶圆三维集成的高精度微组装设备 |
CN115586191B (zh) * | 2022-11-11 | 2023-03-14 | 苏州恒视智能科技有限公司 | 新能源电池的极耳叠层自动调整检测机构 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200524074A (en) * | 2003-12-22 | 2005-07-16 | Unaxis Int Trading Ltd | Method for calibrating a bondhead |
TW201810457A (zh) * | 2016-03-17 | 2018-03-16 | 捷進科技有限公司 | 黏晶機(die bonder)及接合(bonding)方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2821972B2 (ja) * | 1993-03-25 | 1998-11-05 | ローム株式会社 | 発光ダイオードチップの吸着確認装置 |
JPH11214428A (ja) * | 1998-01-22 | 1999-08-06 | Kaijo Corp | ボンディング装置 |
JP2001185474A (ja) * | 1999-12-27 | 2001-07-06 | Nikon Corp | アライメント方法、アライメント装置、基板、マスク、及び露光装置 |
JP4167790B2 (ja) | 2000-03-10 | 2008-10-22 | 東レエンジニアリング株式会社 | チップ実装装置 |
CN101568891B (zh) * | 2006-12-22 | 2013-02-06 | K&S芯片键合设备有限公司 | 定位工具用x-y定位的校准方法及具有这种定位工具的装置 |
CH698334B1 (de) | 2007-10-09 | 2011-07-29 | Esec Ag | Verfahren für die Entnahme und Montage von auf einem Wafertisch bereitgestellten Halbleiterchips auf einem Substrat. |
US7810698B2 (en) * | 2008-11-20 | 2010-10-12 | Asm Assembly Automation Ltd. | Vision system for positioning a bonding tool |
CN102386118B (zh) * | 2010-09-02 | 2016-03-23 | 丽佳达普株式会社 | 基板粘合装置以及基板粘合方法 |
JP2012248728A (ja) * | 2011-05-30 | 2012-12-13 | Hitachi High-Tech Instruments Co Ltd | ダイボンダ及びボンディング方法 |
KR101897825B1 (ko) * | 2012-01-02 | 2018-09-12 | 세메스 주식회사 | 다이 본딩 장치 |
JP2014036068A (ja) | 2012-08-08 | 2014-02-24 | Shinkawa Ltd | ダイボンダおよびボンディングツールの位置検出方法 |
JP2014179561A (ja) * | 2013-03-15 | 2014-09-25 | Hitachi High-Tech Instruments Co Ltd | ボンディングヘッドとそれを備えたダイボンダ |
JP6276545B2 (ja) * | 2013-09-18 | 2018-02-07 | ファスフォードテクノロジ株式会社 | ダイボンダ |
JP6510838B2 (ja) | 2015-03-11 | 2019-05-08 | ファスフォードテクノロジ株式会社 | ボンディング装置及びボンディング方法 |
JP6510837B2 (ja) * | 2015-03-11 | 2019-05-08 | ファスフォードテクノロジ株式会社 | ボンディング装置及びボンディング方法 |
JP6470088B2 (ja) | 2015-04-02 | 2019-02-13 | ファスフォードテクノロジ株式会社 | ボンディング装置及びボンディング方法 |
JP6438826B2 (ja) | 2015-04-02 | 2018-12-19 | ファスフォードテクノロジ株式会社 | ボンディング装置及びボンディング方法 |
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2018
- 2018-03-26 JP JP2018059008A patent/JP7018341B2/ja active Active
-
2019
- 2019-02-19 TW TW108105393A patent/TWI702660B/zh active
- 2019-03-04 KR KR1020190024614A patent/KR102215915B1/ko active IP Right Grant
- 2019-03-13 CN CN201910188130.5A patent/CN110364455B/zh active Active
-
2020
- 2020-11-23 KR KR1020200157894A patent/KR102399836B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200524074A (en) * | 2003-12-22 | 2005-07-16 | Unaxis Int Trading Ltd | Method for calibrating a bondhead |
TW201810457A (zh) * | 2016-03-17 | 2018-03-16 | 捷進科技有限公司 | 黏晶機(die bonder)及接合(bonding)方法 |
Also Published As
Publication number | Publication date |
---|---|
CN110364455A (zh) | 2019-10-22 |
KR20190112641A (ko) | 2019-10-07 |
JP2019175888A (ja) | 2019-10-10 |
CN110364455B (zh) | 2023-04-07 |
KR20200135260A (ko) | 2020-12-02 |
KR102399836B1 (ko) | 2022-05-20 |
JP7018341B2 (ja) | 2022-02-10 |
TW201941315A (zh) | 2019-10-16 |
KR102215915B1 (ko) | 2021-02-16 |
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