KR102214641B1 - 인쇄회로기판 - Google Patents

인쇄회로기판 Download PDF

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Publication number
KR102214641B1
KR102214641B1 KR1020180082454A KR20180082454A KR102214641B1 KR 102214641 B1 KR102214641 B1 KR 102214641B1 KR 1020180082454 A KR1020180082454 A KR 1020180082454A KR 20180082454 A KR20180082454 A KR 20180082454A KR 102214641 B1 KR102214641 B1 KR 102214641B1
Authority
KR
South Korea
Prior art keywords
resin layer
circuit board
printed circuit
roughness
rough surface
Prior art date
Application number
KR1020180082454A
Other languages
English (en)
Korean (ko)
Other versions
KR20200008389A (ko
Inventor
민태홍
최정우
송요한
장준형
오구라 이치로
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020180082454A priority Critical patent/KR102214641B1/ko
Priority to JP2019010630A priority patent/JP6938825B2/ja
Priority to TW108103192A priority patent/TWI731298B/zh
Publication of KR20200008389A publication Critical patent/KR20200008389A/ko
Application granted granted Critical
Publication of KR102214641B1 publication Critical patent/KR102214641B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020180082454A 2018-07-16 2018-07-16 인쇄회로기판 KR102214641B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020180082454A KR102214641B1 (ko) 2018-07-16 2018-07-16 인쇄회로기판
JP2019010630A JP6938825B2 (ja) 2018-07-16 2019-01-24 プリント回路基板
TW108103192A TWI731298B (zh) 2018-07-16 2019-01-29 印刷電路板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020180082454A KR102214641B1 (ko) 2018-07-16 2018-07-16 인쇄회로기판

Publications (2)

Publication Number Publication Date
KR20200008389A KR20200008389A (ko) 2020-01-28
KR102214641B1 true KR102214641B1 (ko) 2021-02-10

Family

ID=69170027

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180082454A KR102214641B1 (ko) 2018-07-16 2018-07-16 인쇄회로기판

Country Status (3)

Country Link
JP (1) JP6938825B2 (zh)
KR (1) KR102214641B1 (zh)
TW (1) TWI731298B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210110943A (ko) 2020-03-02 2021-09-10 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 모듈

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100752025B1 (ko) 2006-07-10 2007-08-28 삼성전기주식회사 인쇄회로기판의 제조 방법

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080043408A (ko) * 1998-12-16 2008-05-16 이비덴 가부시키가이샤 도전성접속핀 및 패키지기판
JP2003258435A (ja) * 2002-03-07 2003-09-12 Shinko Electric Ind Co Ltd 配線基板用シート材料及び多層配線基板
CA2773076A1 (en) 2003-04-15 2004-10-28 Denki Kagaku Kogyo Kabushiki Kaisha Metal base circuit board and its production process
JP2006191145A (ja) * 2006-03-20 2006-07-20 Kyocera Corp 多層配線基板
KR100815319B1 (ko) * 2006-08-30 2008-03-19 삼성전기주식회사 고밀도 인쇄회로기판 및 그 제조 방법
JP5855905B2 (ja) * 2010-12-16 2016-02-09 日本特殊陶業株式会社 多層配線基板及びその製造方法
KR101180366B1 (ko) * 2011-02-25 2012-09-10 주식회사 심텍 회로기판 및 그 제조방법
JP6004078B2 (ja) * 2013-02-15 2016-10-05 株式会社村田製作所 積層回路基板、積層回路基板の製造方法
JP5885791B2 (ja) * 2013-08-20 2016-03-15 Ｊｘ金属株式会社 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、銅箔、プリント配線板、電子機器、電子機器の製造方法、並びに、プリント配線板の製造方法
JP5658399B1 (ja) * 2014-05-21 2015-01-21 株式会社フジクラ プリント配線板
JP6653466B2 (ja) * 2014-06-05 2020-02-26 パナソニックＩｐマネジメント株式会社 金属箔付き液晶ポリマーフィルムの製造方法、金属箔付き液晶ポリマーフィルム、多層プリント配線板の製造方法
KR102473405B1 (ko) * 2015-10-30 2022-12-02 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR20170079574A (ko) * 2015-12-30 2017-07-10 삼성전기주식회사 인쇄회로기판 및 그 제조방법
WO2017175649A1 (ja) * 2016-04-05 2017-10-12 株式会社村田製作所 液晶ポリマー片面積層板
JP7114214B2 (ja) * 2016-05-24 2022-08-08 味の素株式会社 接着フィルム
TWM543773U (zh) * 2017-01-26 2017-06-21 長興材料工業股份有限公司 感光型乾膜
KR102494341B1 (ko) * 2017-11-08 2023-02-01 삼성전기주식회사 인쇄회로기판

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100752025B1 (ko) 2006-07-10 2007-08-28 삼성전기주식회사 인쇄회로기판의 제조 방법

Also Published As

Publication number Publication date
TWI731298B (zh) 2021-06-21
TW202007239A (zh) 2020-02-01
JP6938825B2 (ja) 2021-09-22
JP2020013977A (ja) 2020-01-23
KR20200008389A (ko) 2020-01-28

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