KR102205577B1 - 접합 기판의 브레이크 방법 - Google Patents

접합 기판의 브레이크 방법 Download PDF

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Publication number
KR102205577B1
KR102205577B1 KR1020140041424A KR20140041424A KR102205577B1 KR 102205577 B1 KR102205577 B1 KR 102205577B1 KR 1020140041424 A KR1020140041424 A KR 1020140041424A KR 20140041424 A KR20140041424 A KR 20140041424A KR 102205577 B1 KR102205577 B1 KR 102205577B1
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KR
South Korea
Prior art keywords
substrate
scribe line
brake
scribe
bonded
Prior art date
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KR1020140041424A
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English (en)
Korean (ko)
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KR20150006337A (ko
Inventor
케이스케 토미나가
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
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Application filed by 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 미쓰보시 다이야몬도 고교 가부시키가이샤
Publication of KR20150006337A publication Critical patent/KR20150006337A/ko
Application granted granted Critical
Publication of KR102205577B1 publication Critical patent/KR102205577B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates
KR1020140041424A 2013-07-08 2014-04-07 접합 기판의 브레이크 방법 KR102205577B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2013-142720 2013-07-08
JP2013142720A JP6140012B2 (ja) 2013-07-08 2013-07-08 貼り合わせ基板のブレイク方法

Publications (2)

Publication Number Publication Date
KR20150006337A KR20150006337A (ko) 2015-01-16
KR102205577B1 true KR102205577B1 (ko) 2021-01-20

Family

ID=52252165

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140041424A KR102205577B1 (ko) 2013-07-08 2014-04-07 접합 기판의 브레이크 방법

Country Status (4)

Country Link
JP (1) JP6140012B2 (zh)
KR (1) KR102205577B1 (zh)
CN (1) CN104276750B (zh)
TW (2) TWI610893B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9899546B2 (en) 2014-12-05 2018-02-20 Tesla, Inc. Photovoltaic cells with electrodes adapted to house conductive paste
US9685579B2 (en) 2014-12-05 2017-06-20 Solarcity Corporation Photovoltaic structure cleaving system
JP6540272B2 (ja) * 2015-06-26 2019-07-10 三星ダイヤモンド工業株式会社 ブレイク装置及びブレイク方法
JP2017095294A (ja) * 2015-11-20 2017-06-01 三星ダイヤモンド工業株式会社 基板分断装置
JP6716900B2 (ja) * 2015-12-04 2020-07-01 三星ダイヤモンド工業株式会社 分断装置
JP2018069614A (ja) * 2016-10-31 2018-05-10 三星ダイヤモンド工業株式会社 基板分断装置
JP6891561B2 (ja) * 2017-03-16 2021-06-18 日本電気硝子株式会社 ガラス板の製造方法および製造装置
KR102267730B1 (ko) * 2019-05-14 2021-06-23 주식회사 탑 엔지니어링 스크라이브 장치의 제어 방법
KR102486357B1 (ko) * 2022-08-02 2023-01-09 최호림 유리 절단 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006289625A (ja) 2005-04-05 2006-10-26 Sony Corp 貼り合わせ基板の基板ブレイク装置及びその基板ブレイク方法
KR100671215B1 (ko) * 2001-07-12 2007-01-18 미쓰보시 다이야몬도 고교 가부시키가이샤 플랫 디스플레이 패널 및 그 절단방법
JP2009101692A (ja) 2001-06-28 2009-05-14 Mitsuboshi Diamond Industrial Co Ltd ブレイク装置、ブレイク方法及びマザー貼合基板の分断システム
JP2011141144A (ja) * 2010-01-06 2011-07-21 Sony Corp 電子機器、測位デバイス、情報処理方法およびプログラム

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54137358A (en) * 1978-04-18 1979-10-25 Seikosha Kk Method of cutting glass
JPH0725633A (ja) * 1993-07-09 1995-01-27 Kanegafuchi Chem Ind Co Ltd ガラス基板の折割り方法及びその装置
JP4058542B2 (ja) * 1997-05-30 2008-03-12 三星ダイヤモンド工業株式会社 基板ブレイク装置、基板ブレイク方法、基板分断装置および基板分断システム
JP3787489B2 (ja) 2000-10-02 2006-06-21 三星ダイヤモンド工業株式会社 脆性基板のブレイク方法及び装置
JP2003131185A (ja) 2001-10-23 2003-05-08 Matsushita Electric Ind Co Ltd 液晶表示装置の製造方法
KR100817129B1 (ko) * 2002-02-07 2008-03-27 엘지.필립스 엘시디 주식회사 액정 패널의 절단 장치 및 그 방법
WO2004096721A1 (ja) * 2003-04-28 2004-11-11 Mitsuboshi Diamond Industrial Co., Ltd. 脆性基板分断システムおよび脆性基板分断方法
TWI409232B (zh) * 2005-07-06 2013-09-21 Mitsuboshi Diamond Ind Co Ltd Method for manufacturing scratches for brittle materials
JP4251203B2 (ja) * 2006-08-29 2009-04-08 セイコーエプソン株式会社 貼合せマザー基板のスクライブ方法および貼合せマザー基板の分割方法
JP2009083079A (ja) * 2007-10-03 2009-04-23 Seiko Epson Corp 貼合せ基板の分断装置および貼合せ基板の分断方法
JP2009262520A (ja) * 2008-04-28 2009-11-12 Mitsuboshi Diamond Industrial Co Ltd 脆性材料ブレーク装置及び脆性材料ブレーク方法
JP5330845B2 (ja) * 2009-01-30 2013-10-30 三星ダイヤモンド工業株式会社 基板ブレーク装置
JP5216040B2 (ja) * 2010-03-31 2013-06-19 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法
JP5831119B2 (ja) * 2011-10-17 2015-12-09 日本電気硝子株式会社 ガラス基板割断装置、ガラス基板割断方法及びガラス基板作製方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009101692A (ja) 2001-06-28 2009-05-14 Mitsuboshi Diamond Industrial Co Ltd ブレイク装置、ブレイク方法及びマザー貼合基板の分断システム
KR100671215B1 (ko) * 2001-07-12 2007-01-18 미쓰보시 다이야몬도 고교 가부시키가이샤 플랫 디스플레이 패널 및 그 절단방법
JP2006289625A (ja) 2005-04-05 2006-10-26 Sony Corp 貼り合わせ基板の基板ブレイク装置及びその基板ブレイク方法
JP2011141144A (ja) * 2010-01-06 2011-07-21 Sony Corp 電子機器、測位デバイス、情報処理方法およびプログラム

Also Published As

Publication number Publication date
KR20150006337A (ko) 2015-01-16
TWI610893B (zh) 2018-01-11
JP2015013782A (ja) 2015-01-22
TW201502095A (zh) 2015-01-16
CN104276750A (zh) 2015-01-14
CN104276750B (zh) 2018-11-02
TW201805253A (zh) 2018-02-16
TWI694975B (zh) 2020-06-01
JP6140012B2 (ja) 2017-05-31

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