KR102173287B1 - 감방사선성 수지 조성물, 절연막 및 그의 형성 방법 그리고 유기 ｅｌ 소자 - Google Patents

감방사선성 수지 조성물, 절연막 및 그의 형성 방법 그리고 유기 ｅｌ 소자 Download PDF

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KR102173287B1
KR102173287B1 KR1020140083011A KR20140083011A KR102173287B1 KR 102173287 B1 KR102173287 B1 KR 102173287B1 KR 1020140083011 A KR1020140083011 A KR 1020140083011A KR 20140083011 A KR20140083011 A KR 20140083011A KR 102173287 B1 KR102173287 B1 KR 102173287B1
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group
radiation
insulating film
mass
resin composition
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KR1020140083011A
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KR20150018370A (ko
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노부히로 다카마츠
히로유키 야스다
요시히사 오쿠무라
히로미츠 가츠이
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제이에스알 가부시끼가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020140083011A 2013-08-08 2014-07-03 감방사선성 수지 조성물, 절연막 및 그의 형성 방법 그리고 유기 ｅｌ 소자 KR102173287B1 (ko)

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Application Number Priority Date Filing Date Title
JP2013165640 2013-08-08
JPJP-P-2013-165640 2013-08-08
JPJP-P-2014-032352 2014-02-21
JP2014032352A JP6303588B2 (ja) 2013-08-08 2014-02-21 感放射線性樹脂組成物、絶縁膜及びその形成方法並びに有機ｅｌ素子

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KR20150018370A KR20150018370A (ko) 2015-02-23
KR102173287B1 true KR102173287B1 (ko) 2020-11-03

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JP6228796B2 (ja) * 2013-09-26 2017-11-08 東京応化工業株式会社 レジスト組成物、レジストパターン形成方法
EP3121652B1 (en) 2014-03-20 2019-09-04 Zeon Corporation Radiation-sensitive resin composition and electronic component
CN106462063A (zh) * 2014-06-12 2017-02-22 Dic株式会社 永久膜用感光性组合物、抗蚀材料及涂膜
WO2016024425A1 (ja) * 2014-08-12 2016-02-18 Jsr株式会社 素子、絶縁膜及びその製造方法、並びに感放射線性樹脂組成物
WO2017068936A1 (ja) * 2015-10-23 2017-04-27 東レ株式会社 ディスプレイ基板用樹脂組成物、並びに、それを用いた耐熱性樹脂フィルム、有機ｅｌディスプレイ基板及び有機ｅｌディスプレイの製造方法
WO2017164103A1 (ja) * 2016-03-24 2017-09-28 東レ株式会社 エッチング用マスクレジスト組成物、それを用いた基板の製造方法および発光素子の製造方法
JP7088636B2 (ja) * 2017-07-11 2022-06-21 旭化成株式会社 半導体装置、及びその製造方法
JP7088639B2 (ja) * 2017-08-01 2022-06-21 旭化成株式会社 半導体装置、及びその製造方法
JP7088638B2 (ja) * 2017-08-01 2022-06-21 旭化成株式会社 半導体装置、及びその製造方法
JP2019029556A (ja) * 2017-08-01 2019-02-21 旭化成株式会社 半導体装置、及びその製造方法
CN111479854B (zh) * 2018-01-17 2023-05-09 旭化成株式会社 聚酰亚胺前体树脂组合物
JP7261882B2 (ja) * 2019-07-05 2023-04-20 富士フイルム株式会社 熱硬化性感光性組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
JP7409564B2 (ja) * 2021-06-25 2024-01-09 住友ベークライト株式会社 ネガ型感光性ポリマー、ポリマー溶液、ネガ型感光性樹脂組成物、硬化膜および半導体装置

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JP2008083359A (ja) 2006-09-27 2008-04-10 Jsr Corp 感光性樹脂組成物及び硬化膜

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JP2005088726A (ja) 2003-09-17 2005-04-07 Advics:Kk タイヤ空気圧警報装置、この装置によって監視されるタイヤ、およびタイヤの特性値の管理方法
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JP2005249847A (ja) * 2004-03-01 2005-09-15 Sumitomo Bakelite Co Ltd ポジ型感光性樹脂組成物及びそれを用いた半導体装置または表示素子
JP2008083359A (ja) 2006-09-27 2008-04-10 Jsr Corp 感光性樹脂組成物及び硬化膜

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JP2015052770A (ja) 2015-03-19
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