KR102122749B1 - 기재막 및 소결 방법 - Google Patents

기재막 및 소결 방법 Download PDF

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Publication number
KR102122749B1
KR102122749B1 KR1020197017474A KR20197017474A KR102122749B1 KR 102122749 B1 KR102122749 B1 KR 102122749B1 KR 1020197017474 A KR1020197017474 A KR 1020197017474A KR 20197017474 A KR20197017474 A KR 20197017474A KR 102122749 B1 KR102122749 B1 KR 102122749B1
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South Korea
Prior art keywords
film
coating layer
oxide
base film
light irradiation
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Korean (ko)
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KR20190075151A (ko
Inventor
쿠르트 에이. 슈로더
히로시 우치다
켄지 시노자키
Original Assignee
쇼와 덴코 가부시키가이샤
엔씨씨 나노, 엘엘씨
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Publication of KR20190075151A publication Critical patent/KR20190075151A/ko
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Assigned to 가부시끼가이샤 레조낙 reassignment 가부시끼가이샤 레조낙 권리지분의 전부이전등록 Assignors: 가부시키가이샤 레조낙 홀딩스
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/10—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G13/00—Electrographic processes using a charge pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Pest Control & Pesticides (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Insulated Conductors (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
KR1020197017474A 2012-06-05 2013-05-31 기재막 및 소결 방법 Active KR102122749B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261655644P 2012-06-05 2012-06-05
US61/655,644 2012-06-05
PCT/IB2013/001254 WO2013182896A1 (en) 2012-06-05 2013-05-31 Substrate film and sintering method

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020177004747A Division KR20170023202A (ko) 2012-06-05 2013-05-31 기재막 및 소결 방법

Publications (2)

Publication Number Publication Date
KR20190075151A KR20190075151A (ko) 2019-06-28
KR102122749B1 true KR102122749B1 (ko) 2020-06-15

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Application Number Title Priority Date Filing Date
KR1020197017474A Active KR102122749B1 (ko) 2012-06-05 2013-05-31 기재막 및 소결 방법
KR1020177004747A Ceased KR20170023202A (ko) 2012-06-05 2013-05-31 기재막 및 소결 방법
KR1020147034282A Ceased KR20150016552A (ko) 2012-06-05 2013-05-31 기재막 및 소결 방법

Family Applications After (2)

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KR1020177004747A Ceased KR20170023202A (ko) 2012-06-05 2013-05-31 기재막 및 소결 방법
KR1020147034282A Ceased KR20150016552A (ko) 2012-06-05 2013-05-31 기재막 및 소결 방법

Country Status (6)

Country Link
US (1) US9631283B2 (enExample)
EP (1) EP2855148B1 (enExample)
JP (1) JP6258303B2 (enExample)
KR (3) KR102122749B1 (enExample)
CN (1) CN104797419B (enExample)
WO (1) WO2013182896A1 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10060180B2 (en) 2010-01-16 2018-08-28 Cardinal Cg Company Flash-treated indium tin oxide coatings, production methods, and insulating glass unit transparent conductive coating technology
US10000965B2 (en) 2010-01-16 2018-06-19 Cardinal Cg Company Insulating glass unit transparent conductive coating technology
US10000411B2 (en) 2010-01-16 2018-06-19 Cardinal Cg Company Insulating glass unit transparent conductivity and low emissivity coating technology
JP5275498B1 (ja) * 2012-07-03 2013-08-28 石原薬品株式会社 導電膜形成方法及び焼結進行剤
JP6441212B2 (ja) * 2013-03-29 2018-12-19 太陽ホールディングス株式会社 光焼成用熱可塑性樹脂フィルム基材、これを用いた導電回路基板およびその製造方法
WO2015149054A1 (en) * 2014-03-28 2015-10-01 Ez Print, Llc 3d print bed having permanent coating
WO2017073967A1 (ko) * 2015-10-26 2017-05-04 한국기계연구원 광소결을 이용한 패턴 형성 장치 및 이를 이용한 패턴 형성 방법
CN209440968U (zh) * 2015-12-24 2019-09-27 株式会社村田制作所 树脂片
JP2017216303A (ja) * 2016-05-30 2017-12-07 株式会社リコー 回路部材用基材、回路部材、回路部材用基材の製造方法、及び回路部材の製造方法
JP7048193B2 (ja) * 2016-11-17 2022-04-05 日本化学工業株式会社 亜酸化銅粒子の製造方法
CN109426397B (zh) * 2017-08-22 2020-08-04 京东方科技集团股份有限公司 触控结构的制备方法、触控结构
US11028012B2 (en) 2018-10-31 2021-06-08 Cardinal Cg Company Low solar heat gain coatings, laminated glass assemblies, and methods of producing same
US11267763B2 (en) 2019-05-17 2022-03-08 Raytheon Technologies Corporation Rapid processing of laminar composite components
DE102019114806A1 (de) * 2019-06-03 2020-12-03 Value & Intellectual Properties Management Gmbh Verfahren zur Herstellung elektrischer oder elektronischer Bauteile oder Schaltungen auf einem flexiblen flächigen Träger
JP7344297B2 (ja) * 2019-07-31 2023-09-13 株式会社Fuji ３次元積層造形による回路配線の製造方法
CN114051501A (zh) * 2019-09-05 2022-02-15 株式会社艾迪科 聚合性组合物、被覆结构体的制造方法、被覆结构体及被覆材
CN110577771A (zh) * 2019-09-17 2019-12-17 宁波石墨烯创新中心有限公司 一种导电油墨、rfid天线和电子标签及制备方法
US11996384B2 (en) 2020-12-15 2024-05-28 Pulseforge, Inc. Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications
JP2023017150A (ja) * 2021-07-26 2023-02-07 株式会社リコー 導体の製造方法、導体の製造装置、及び構造体
EP4274391A1 (en) 2022-05-06 2023-11-08 Ecole Polytechnique Federale De Lausanne (Epfl) Method for manufacturing an electrically conductive metal trace and corresponding metal trace, particularly suitable for transient electronic devices
JP7891788B2 (ja) * 2022-06-22 2026-07-17 石原ケミカル株式会社 回路基板、ｒｆタグ、及び回路基板作製方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011000892A (ja) * 2003-09-10 2011-01-06 Nippon Zeon Co Ltd 樹脂複合フィルム

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4147639B2 (ja) * 1998-09-29 2008-09-10 宇部興産株式会社 フレキシブル金属箔積層体
US7394663B2 (en) * 2003-02-18 2008-07-01 Matsushita Electric Industrial Co., Ltd. Electronic component built-in module and method of manufacturing the same
JP2005203396A (ja) 2004-01-13 2005-07-28 Toshiba Corp 電子部品の製造装置、電子部品の製造方法および電子部品
JP5408878B2 (ja) 2004-11-24 2014-02-05 エヌシーシー ナノ， エルエルシー ナノ材料組成物の電気的使用、めっき的使用および触媒的使用
US8945686B2 (en) 2007-05-24 2015-02-03 Ncc Method for reducing thin films on low temperature substrates
ATE514552T1 (de) * 2007-02-14 2011-07-15 Toray Industries Mehrlagige thermoplastische hazrfolie mit hoher haftkraft
US10231344B2 (en) 2007-05-18 2019-03-12 Applied Nanotech Holdings, Inc. Metallic ink
JP5390804B2 (ja) * 2007-07-31 2014-01-15 テクノポリマー株式会社 積層体
US7833683B2 (en) * 2007-08-14 2010-11-16 Xerox Corporation Photosensitive member having an overcoat
US8410712B2 (en) * 2008-07-09 2013-04-02 Ncc Nano, Llc Method and apparatus for curing thin films on low-temperature substrates at high speeds
KR100999506B1 (ko) * 2008-09-09 2010-12-09 삼성전기주식회사 인쇄회로기판 및 그 제조 방법
KR100999921B1 (ko) 2008-09-26 2010-12-13 삼성전기주식회사 기판의 이중 표면 처리 방법 및 상기 방법에 의해 표면 처리된 기판
CN104894538A (zh) * 2008-10-17 2015-09-09 Ncc纳诺责任有限公司 还原低温基底上的薄膜的方法
TWI466139B (zh) * 2010-07-22 2014-12-21 Panasonic Corp 導電性薄膜的製造方法
JP5608491B2 (ja) * 2010-09-13 2014-10-15 東芝テック株式会社 導電パターンの形成方法および印刷物
JP5880100B2 (ja) * 2012-02-10 2016-03-08 コニカミノルタ株式会社 透明電極の製造方法
JP5849834B2 (ja) * 2012-04-09 2016-02-03 コニカミノルタ株式会社 透明電極、透明電極の製造方法、及び該透明電極を用いた有機電子素子

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011000892A (ja) * 2003-09-10 2011-01-06 Nippon Zeon Co Ltd 樹脂複合フィルム

Also Published As

Publication number Publication date
CN104797419A (zh) 2015-07-22
EP2855148A4 (en) 2016-01-20
US20150225857A1 (en) 2015-08-13
WO2013182896A1 (en) 2013-12-12
KR20170023202A (ko) 2017-03-02
EP2855148A1 (en) 2015-04-08
JP2015528753A (ja) 2015-10-01
CN104797419B (zh) 2018-02-23
KR20150016552A (ko) 2015-02-12
US9631283B2 (en) 2017-04-25
JP6258303B2 (ja) 2018-01-10
KR20190075151A (ko) 2019-06-28
EP2855148B1 (en) 2019-04-10

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