KR102119861B1 - 몰드 성형이 가능한 실리콘 수지, 조성물 및 이의 반도체 발광소자 - Google Patents

몰드 성형이 가능한 실리콘 수지, 조성물 및 이의 반도체 발광소자 Download PDF

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KR102119861B1
KR102119861B1 KR1020180098996A KR20180098996A KR102119861B1 KR 102119861 B1 KR102119861 B1 KR 102119861B1 KR 1020180098996 A KR1020180098996 A KR 1020180098996A KR 20180098996 A KR20180098996 A KR 20180098996A KR 102119861 B1 KR102119861 B1 KR 102119861B1
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South Korea
Prior art keywords
silicone resin
present
resin composition
molding
silicone
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KR1020180098996A
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English (en)
Korean (ko)
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KR20190024731A (ko
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홍지에 쑨
쓰치 덩
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베이징 케이엠티 테크놀로지 코.,엘티디.
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/02—Organic and inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L51/50—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Led Device Packages (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
KR1020180098996A 2017-08-29 2018-08-24 몰드 성형이 가능한 실리콘 수지, 조성물 및 이의 반도체 발광소자 KR102119861B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710758019.6A CN107501942B (zh) 2017-08-29 2017-08-29 可模塑成型的有机硅树脂、组合物及其半导体发光元件
CN201710758019.6 2017-08-29

Publications (2)

Publication Number Publication Date
KR20190024731A KR20190024731A (ko) 2019-03-08
KR102119861B1 true KR102119861B1 (ko) 2020-06-08

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KR1020180098996A KR102119861B1 (ko) 2017-08-29 2018-08-24 몰드 성형이 가능한 실리콘 수지, 조성물 및 이의 반도체 발광소자

Country Status (4)

Country Link
JP (1) JP6626168B2 (zh)
KR (1) KR102119861B1 (zh)
CN (1) CN107501942B (zh)
TW (1) TWI665236B (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109517175A (zh) * 2018-11-27 2019-03-26 湖北新四海化工股份有限公司 Led封装用高品质苯基乙烯基mtq硅树脂及制备方法
CN113372758A (zh) * 2021-08-12 2021-09-10 北京康美特科技股份有限公司 白色有机硅油墨、反射层、背光基板和背光模组
CN113968972A (zh) * 2021-11-30 2022-01-25 广州市斯洛柯高分子聚合物有限公司 一种固体纯有机硅树脂及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100359392B1 (ko) 1995-02-02 2003-01-24 다우 코닝 아시아 리미티드 열경화성실리콘수지
JP2014185293A (ja) 2013-03-25 2014-10-02 Mitsubishi Chemicals Corp 硬化性シリコーン樹脂

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3683770B2 (ja) * 2000-03-21 2005-08-17 東レ・ダウコーニング株式会社 シリコーンゴムスポンジ形成性組成物、シリコーンゴムスポンジおよびシリコーンゴムスポンジの製造方法
CA2543366A1 (en) * 2003-08-01 2005-02-24 Dow Corning Corporation Silicone based dielectric coatings and films for photovoltaic applications
JP4849814B2 (ja) * 2005-03-29 2012-01-11 東レ・ダウコーニング株式会社 ホットメルト型シリコーン系接着剤
MY141236A (en) * 2007-06-29 2010-03-31 Dow Corning Toray Co Ltd Silicone resin composition, curable resin composition, and cured resin
JP4623322B2 (ja) * 2007-12-26 2011-02-02 信越化学工業株式会社 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物並びに光半導体ケース及びその成形方法
JP2010106243A (ja) * 2008-09-30 2010-05-13 Shin-Etsu Chemical Co Ltd 光半導体装置用シリコーン樹脂組成物
CN101508776B (zh) * 2009-03-13 2011-04-20 杭州师范大学 一种甲基苯基硅树脂制备方法
KR101114922B1 (ko) * 2010-01-25 2012-02-14 주식회사 엘지화학 실리콘 수지
KR101881604B1 (ko) * 2011-11-21 2018-07-24 신에쓰 가가꾸 고교 가부시끼가이샤 Ｌｅｄ 리플렉터로서 유용한 백색 열경화성 실리콘 수지 조성물 및 상기 조성물을 이용한 광반도체 장치
US10208164B2 (en) * 2014-09-01 2019-02-19 Dow Corning Toray Co., Ltd. Curable silicone composition, curable hot-melt silicone, and optical device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100359392B1 (ko) 1995-02-02 2003-01-24 다우 코닝 아시아 리미티드 열경화성실리콘수지
JP2014185293A (ja) 2013-03-25 2014-10-02 Mitsubishi Chemicals Corp 硬化性シリコーン樹脂

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Publication number Publication date
JP2019044166A (ja) 2019-03-22
KR20190024731A (ko) 2019-03-08
CN107501942B (zh) 2020-10-02
TW201912684A (zh) 2019-04-01
CN107501942A (zh) 2017-12-22
TWI665236B (zh) 2019-07-11
JP6626168B2 (ja) 2019-12-25

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