KR102105515B1 - 다이싱ㆍ다이 본딩 시트 - Google Patents

다이싱ㆍ다이 본딩 시트 Download PDF

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Publication number
KR102105515B1
KR102105515B1 KR1020120100670A KR20120100670A KR102105515B1 KR 102105515 B1 KR102105515 B1 KR 102105515B1 KR 1020120100670 A KR1020120100670 A KR 1020120100670A KR 20120100670 A KR20120100670 A KR 20120100670A KR 102105515 B1 KR102105515 B1 KR 102105515B1
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South Korea
Prior art keywords
adhesive layer
mass
parts
bonding sheet
acrylic polymer
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KR1020120100670A
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English (en)
Korean (ko)
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KR20130029341A (ko
Inventor
유스케 네즈
야스노리 카라사와
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린텍 코포레이션
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Publication of KR20130029341A publication Critical patent/KR20130029341A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

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  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)
KR1020120100670A 2011-09-14 2012-09-11 다이싱ㆍ다이 본딩 시트 Active KR102105515B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011201167A JP5951207B2 (ja) 2011-09-14 2011-09-14 ダイシング・ダイボンディングシート
JPJP-P-2011-201167 2011-09-14

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020190027593A Division KR20190030667A (ko) 2011-09-14 2019-03-11 다이싱ㆍ다이 본딩 시트

Publications (2)

Publication Number Publication Date
KR20130029341A KR20130029341A (ko) 2013-03-22
KR102105515B1 true KR102105515B1 (ko) 2020-04-28

Family

ID=48179321

Family Applications (2)

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KR1020120100670A Active KR102105515B1 (ko) 2011-09-14 2012-09-11 다이싱ㆍ다이 본딩 시트
KR1020190027593A Withdrawn KR20190030667A (ko) 2011-09-14 2019-03-11 다이싱ㆍ다이 본딩 시트

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020190027593A Withdrawn KR20190030667A (ko) 2011-09-14 2019-03-11 다이싱ㆍ다이 본딩 시트

Country Status (3)

Country Link
JP (1) JP5951207B2 (https=)
KR (2) KR102105515B1 (https=)
TW (1) TWI566282B (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6877982B2 (ja) * 2016-12-08 2021-05-26 日東電工株式会社 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置
CN108987294B (zh) * 2018-06-21 2021-02-02 上海飞骧电子科技有限公司 解决封装溢胶问题的无源器件砷化镓刷胶方法
WO2020157029A1 (en) * 2019-01-29 2020-08-06 Trinamix Gmbh Optical detector
JP7625784B2 (ja) * 2019-11-15 2025-02-04 株式会社レゾナック ダイシング・ダイボンディング一体型フィルム及びその製造方法、並びに半導体装置の製造方法
JP7298468B2 (ja) * 2019-12-18 2023-06-27 信越化学工業株式会社 熱硬化性樹脂組成物及びその使用
US11639410B2 (en) 2019-12-18 2023-05-02 Shin-Etsu Chemical Co., Ltd. Heat-curable resin composition and uses thereof
WO2021132679A1 (ja) * 2019-12-27 2021-07-01 リンテック株式会社 硬化性樹脂フィルム、複合シート、及び半導体チップの製造方法
CN112341975B (zh) * 2020-11-25 2022-03-08 中路交科科技股份有限公司 一种二阶环氧粘层油、制备方法及其应用方法
KR20230125247A (ko) 2020-12-25 2023-08-29 다우 도레이 캄파니 리미티드 일체형 다이싱 다이 본딩용 시트 및 반도체 장치의 제조 방법
JP2024039980A (ja) * 2022-09-12 2024-03-25 三菱ケミカル株式会社 粘接着剤組成物、粘接着剤、粘接着シート及び積層体

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010219293A (ja) * 2009-03-17 2010-09-30 Furukawa Electric Co Ltd:The ウエハ加工用テープ

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3383227B2 (ja) * 1998-11-06 2003-03-04 リンテック株式会社 半導体ウエハの裏面研削方法
JP4841802B2 (ja) * 2003-05-02 2011-12-21 リンテック株式会社 粘着シートおよびその使用方法
JP4274867B2 (ja) * 2003-08-06 2009-06-10 リンテック株式会社 Ｉｃタグ
JP4776188B2 (ja) * 2004-08-03 2011-09-21 古河電気工業株式会社 半導体装置製造方法およびウエハ加工用テープ
JP4780653B2 (ja) * 2005-02-21 2011-09-28 日東電工株式会社 半導体装置の製造方法
US7768141B2 (en) * 2006-02-14 2010-08-03 Lg Innotek Co., Ltd. Dicing die attachment film and method for packaging semiconductor using same
JP5005258B2 (ja) 2006-05-23 2012-08-22 リンテック株式会社 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
JP2010171402A (ja) * 2008-12-24 2010-08-05 Nitto Denko Corp 熱硬化型ダイボンドフィルム

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010219293A (ja) * 2009-03-17 2010-09-30 Furukawa Electric Co Ltd:The ウエハ加工用テープ

Also Published As

Publication number Publication date
TWI566282B (zh) 2017-01-11
JP2013062446A (ja) 2013-04-04
KR20190030667A (ko) 2019-03-22
TW201327653A (zh) 2013-07-01
JP5951207B2 (ja) 2016-07-13
KR20130029341A (ko) 2013-03-22

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