TWI566282B - Cut the adhesive sheet - Google Patents

Cut the adhesive sheet Download PDF

Info

Publication number
TWI566282B
TWI566282B TW101126559A TW101126559A TWI566282B TW I566282 B TWI566282 B TW I566282B TW 101126559 A TW101126559 A TW 101126559A TW 101126559 A TW101126559 A TW 101126559A TW I566282 B TWI566282 B TW I566282B
Authority
TW
Taiwan
Prior art keywords
adhesive layer
mass
adhesive
parts
propylene polymer
Prior art date
Application number
TW101126559A
Other languages
English (en)
Chinese (zh)
Other versions
TW201327653A (zh
Inventor
根津裕介
柄澤泰紀
Original Assignee
琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 琳得科股份有限公司 filed Critical 琳得科股份有限公司
Publication of TW201327653A publication Critical patent/TW201327653A/zh
Application granted granted Critical
Publication of TWI566282B publication Critical patent/TWI566282B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)
TW101126559A 2011-09-14 2012-07-24 Cut the adhesive sheet TWI566282B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011201167A JP5951207B2 (ja) 2011-09-14 2011-09-14 ダイシング・ダイボンディングシート

Publications (2)

Publication Number Publication Date
TW201327653A TW201327653A (zh) 2013-07-01
TWI566282B true TWI566282B (zh) 2017-01-11

Family

ID=48179321

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101126559A TWI566282B (zh) 2011-09-14 2012-07-24 Cut the adhesive sheet

Country Status (3)

Country Link
JP (1) JP5951207B2 (https=)
KR (2) KR102105515B1 (https=)
TW (1) TWI566282B (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6877982B2 (ja) * 2016-12-08 2021-05-26 日東電工株式会社 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置
CN108987294B (zh) * 2018-06-21 2021-02-02 上海飞骧电子科技有限公司 解决封装溢胶问题的无源器件砷化镓刷胶方法
WO2020157029A1 (en) * 2019-01-29 2020-08-06 Trinamix Gmbh Optical detector
JP7625784B2 (ja) * 2019-11-15 2025-02-04 株式会社レゾナック ダイシング・ダイボンディング一体型フィルム及びその製造方法、並びに半導体装置の製造方法
JP7298468B2 (ja) * 2019-12-18 2023-06-27 信越化学工業株式会社 熱硬化性樹脂組成物及びその使用
US11639410B2 (en) 2019-12-18 2023-05-02 Shin-Etsu Chemical Co., Ltd. Heat-curable resin composition and uses thereof
WO2021132679A1 (ja) * 2019-12-27 2021-07-01 リンテック株式会社 硬化性樹脂フィルム、複合シート、及び半導体チップの製造方法
CN112341975B (zh) * 2020-11-25 2022-03-08 中路交科科技股份有限公司 一种二阶环氧粘层油、制备方法及其应用方法
KR20230125247A (ko) 2020-12-25 2023-08-29 다우 도레이 캄파니 리미티드 일체형 다이싱 다이 본딩용 시트 및 반도체 장치의 제조 방법
JP2024039980A (ja) * 2022-09-12 2024-03-25 三菱ケミカル株式会社 粘接着剤組成物、粘接着剤、粘接着シート及び積層体

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006261657A (ja) * 2005-02-21 2006-09-28 Nitto Denko Corp 半導体装置の製造方法
US20070141330A1 (en) * 2004-08-03 2007-06-21 The Furukawa Electric Co., Ltd. Method of producing a semiconductor device, and wafer-processing tape
JP2010219293A (ja) * 2009-03-17 2010-09-30 Furukawa Electric Co Ltd:The ウエハ加工用テープ

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3383227B2 (ja) * 1998-11-06 2003-03-04 リンテック株式会社 半導体ウエハの裏面研削方法
JP4841802B2 (ja) * 2003-05-02 2011-12-21 リンテック株式会社 粘着シートおよびその使用方法
JP4274867B2 (ja) * 2003-08-06 2009-06-10 リンテック株式会社 Ｉｃタグ
US7768141B2 (en) * 2006-02-14 2010-08-03 Lg Innotek Co., Ltd. Dicing die attachment film and method for packaging semiconductor using same
JP5005258B2 (ja) 2006-05-23 2012-08-22 リンテック株式会社 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
JP2010171402A (ja) * 2008-12-24 2010-08-05 Nitto Denko Corp 熱硬化型ダイボンドフィルム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070141330A1 (en) * 2004-08-03 2007-06-21 The Furukawa Electric Co., Ltd. Method of producing a semiconductor device, and wafer-processing tape
JP2006261657A (ja) * 2005-02-21 2006-09-28 Nitto Denko Corp 半導体装置の製造方法
JP2010219293A (ja) * 2009-03-17 2010-09-30 Furukawa Electric Co Ltd:The ウエハ加工用テープ

Also Published As

Publication number Publication date
JP2013062446A (ja) 2013-04-04
KR20190030667A (ko) 2019-03-22
KR102105515B1 (ko) 2020-04-28
TW201327653A (zh) 2013-07-01
JP5951207B2 (ja) 2016-07-13
KR20130029341A (ko) 2013-03-22

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