JP5951207B2 - ダイシング・ダイボンディングシート - Google Patents

ダイシング・ダイボンディングシート Download PDF

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Publication number
JP5951207B2
JP5951207B2 JP2011201167A JP2011201167A JP5951207B2 JP 5951207 B2 JP5951207 B2 JP 5951207B2 JP 2011201167 A JP2011201167 A JP 2011201167A JP 2011201167 A JP2011201167 A JP 2011201167A JP 5951207 B2 JP5951207 B2 JP 5951207B2
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JP
Japan
Prior art keywords
mass
adhesive layer
parts
bonding sheet
acrylic polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011201167A
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English (en)
Japanese (ja)
Other versions
JP2013062446A (ja
JP2013062446A5 (https=
Inventor
裕介 根津
裕介 根津
泰紀 柄澤
泰紀 柄澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to JP2011201167A priority Critical patent/JP5951207B2/ja
Priority to TW101126559A priority patent/TWI566282B/zh
Priority to KR1020120100670A priority patent/KR102105515B1/ko
Publication of JP2013062446A publication Critical patent/JP2013062446A/ja
Publication of JP2013062446A5 publication Critical patent/JP2013062446A5/ja
Application granted granted Critical
Publication of JP5951207B2 publication Critical patent/JP5951207B2/ja
Priority to KR1020190027593A priority patent/KR20190030667A/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)
JP2011201167A 2011-09-14 2011-09-14 ダイシング・ダイボンディングシート Active JP5951207B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011201167A JP5951207B2 (ja) 2011-09-14 2011-09-14 ダイシング・ダイボンディングシート
TW101126559A TWI566282B (zh) 2011-09-14 2012-07-24 Cut the adhesive sheet
KR1020120100670A KR102105515B1 (ko) 2011-09-14 2012-09-11 다이싱ㆍ다이 본딩 시트
KR1020190027593A KR20190030667A (ko) 2011-09-14 2019-03-11 다이싱ㆍ다이 본딩 시트

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011201167A JP5951207B2 (ja) 2011-09-14 2011-09-14 ダイシング・ダイボンディングシート

Publications (3)

Publication Number Publication Date
JP2013062446A JP2013062446A (ja) 2013-04-04
JP2013062446A5 JP2013062446A5 (https=) 2014-10-30
JP5951207B2 true JP5951207B2 (ja) 2016-07-13

Family

ID=48179321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011201167A Active JP5951207B2 (ja) 2011-09-14 2011-09-14 ダイシング・ダイボンディングシート

Country Status (3)

Country Link
JP (1) JP5951207B2 (https=)
KR (2) KR102105515B1 (https=)
TW (1) TWI566282B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108987294A (zh) * 2018-06-21 2018-12-11 上海飞骧电子科技有限公司 解决封装溢胶问题的无源器件砷化镓刷胶方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6877982B2 (ja) * 2016-12-08 2021-05-26 日東電工株式会社 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置
WO2020157029A1 (en) * 2019-01-29 2020-08-06 Trinamix Gmbh Optical detector
JP7625784B2 (ja) * 2019-11-15 2025-02-04 株式会社レゾナック ダイシング・ダイボンディング一体型フィルム及びその製造方法、並びに半導体装置の製造方法
JP7298468B2 (ja) * 2019-12-18 2023-06-27 信越化学工業株式会社 熱硬化性樹脂組成物及びその使用
US11639410B2 (en) 2019-12-18 2023-05-02 Shin-Etsu Chemical Co., Ltd. Heat-curable resin composition and uses thereof
WO2021132679A1 (ja) * 2019-12-27 2021-07-01 リンテック株式会社 硬化性樹脂フィルム、複合シート、及び半導体チップの製造方法
CN112341975B (zh) * 2020-11-25 2022-03-08 中路交科科技股份有限公司 一种二阶环氧粘层油、制备方法及其应用方法
KR20230125247A (ko) 2020-12-25 2023-08-29 다우 도레이 캄파니 리미티드 일체형 다이싱 다이 본딩용 시트 및 반도체 장치의 제조 방법
JP2024039980A (ja) * 2022-09-12 2024-03-25 三菱ケミカル株式会社 粘接着剤組成物、粘接着剤、粘接着シート及び積層体

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3383227B2 (ja) * 1998-11-06 2003-03-04 リンテック株式会社 半導体ウエハの裏面研削方法
JP4841802B2 (ja) * 2003-05-02 2011-12-21 リンテック株式会社 粘着シートおよびその使用方法
JP4274867B2 (ja) * 2003-08-06 2009-06-10 リンテック株式会社 Ｉｃタグ
JP4776188B2 (ja) * 2004-08-03 2011-09-21 古河電気工業株式会社 半導体装置製造方法およびウエハ加工用テープ
JP4780653B2 (ja) * 2005-02-21 2011-09-28 日東電工株式会社 半導体装置の製造方法
US7768141B2 (en) * 2006-02-14 2010-08-03 Lg Innotek Co., Ltd. Dicing die attachment film and method for packaging semiconductor using same
JP5005258B2 (ja) 2006-05-23 2012-08-22 リンテック株式会社 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
JP2010171402A (ja) * 2008-12-24 2010-08-05 Nitto Denko Corp 熱硬化型ダイボンドフィルム
JP2010219293A (ja) * 2009-03-17 2010-09-30 Furukawa Electric Co Ltd:The ウエハ加工用テープ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108987294A (zh) * 2018-06-21 2018-12-11 上海飞骧电子科技有限公司 解决封装溢胶问题的无源器件砷化镓刷胶方法

Also Published As

Publication number Publication date
TWI566282B (zh) 2017-01-11
JP2013062446A (ja) 2013-04-04
KR20190030667A (ko) 2019-03-22
KR102105515B1 (ko) 2020-04-28
TW201327653A (zh) 2013-07-01
KR20130029341A (ko) 2013-03-22

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