KR102103321B1 - 기판 세정 장치 및 기판 세정 방법 - Google Patents

기판 세정 장치 및 기판 세정 방법 Download PDF

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Publication number
KR102103321B1
KR102103321B1 KR1020130148922A KR20130148922A KR102103321B1 KR 102103321 B1 KR102103321 B1 KR 102103321B1 KR 1020130148922 A KR1020130148922 A KR 1020130148922A KR 20130148922 A KR20130148922 A KR 20130148922A KR 102103321 B1 KR102103321 B1 KR 102103321B1
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South Korea
Prior art keywords
substrate
cleaning
cleaning member
rotation axis
contact surface
Prior art date
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KR1020130148922A
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English (en)
Korean (ko)
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KR20140073428A (ko
Inventor
도모아츠 이시바시
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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Publication of KR20140073428A publication Critical patent/KR20140073428A/ko
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Publication of KR102103321B1 publication Critical patent/KR102103321B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
KR1020130148922A 2012-12-06 2013-12-03 기판 세정 장치 및 기판 세정 방법 Active KR102103321B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2012-267568 2012-12-06
JP2012267568 2012-12-06
JPJP-P-2013-238224 2013-11-18
JP2013238224A JP6297308B2 (ja) 2012-12-06 2013-11-18 基板洗浄装置及び基板洗浄方法

Publications (2)

Publication Number Publication Date
KR20140073428A KR20140073428A (ko) 2014-06-16
KR102103321B1 true KR102103321B1 (ko) 2020-04-22

Family

ID=50879637

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130148922A Active KR102103321B1 (ko) 2012-12-06 2013-12-03 기판 세정 장치 및 기판 세정 방법

Country Status (4)

Country Link
US (1) US9058977B2 (https=)
JP (1) JP6297308B2 (https=)
KR (1) KR102103321B1 (https=)
TW (1) TWI611848B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170043664A (ko) * 2014-10-31 2017-04-21 가부시키가이샤 에바라 세이사꾸쇼 기판 세정 장치 및 기판 세정 방법
JP6871499B2 (ja) * 2016-06-16 2021-05-12 サミー株式会社 ぱちんこ遊技機
WO2023145431A1 (ja) * 2022-01-31 2023-08-03 Ａｇｃ株式会社 基板洗浄方法、ガラス基板の製造方法、ｅｕｖｌ用マスクブランクの製造方法、および基板洗浄装置
JP2024064209A (ja) * 2022-10-27 2024-05-14 株式会社Ｓｃｒｅｅｎホールディングス ブラシ及びそれを備えた基板処理装置並びにブラシの押し圧制御方法
US12525468B2 (en) 2022-12-30 2026-01-13 Applied Materials, Inc. Integrated clean and dry module for cleaning a substrate
CN118649956B (zh) * 2024-07-30 2025-12-05 宁波礼达先导生物技术有限公司 一种自动化多工位孔板洗板机

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000015189A (ja) 1998-06-29 2000-01-18 Shibaura Mechatronics Corp ブラシ洗浄装置およびブラシ洗浄方法
US20020096191A1 (en) * 2001-01-24 2002-07-25 International Business Machines Corporation Apparatus and method for wafer cleaning
KR100412542B1 (ko) * 1995-09-20 2004-05-31 가부시끼가이샤 도시바 작업물의세정방법및장치
JP2004273961A (ja) 2003-03-12 2004-09-30 Ebara Corp 金属配線形成基板の洗浄処理装置
JP2005012238A (ja) 2004-09-02 2005-01-13 Ebara Corp 基板洗浄方法及び装置
JP2006073788A (ja) 2004-09-02 2006-03-16 Sumco Corp ウェーハの洗浄方法及び洗浄装置
US20110189857A1 (en) 2008-09-24 2011-08-04 Tokyo Electron Limited Chemical mechanical polishing apparatus, chemical mechanical polishing method, and control program

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2628168B2 (ja) 1987-07-14 1997-07-09 住友シチックス株式会社 半導体ウエーハの表面処理装置
JP3302873B2 (ja) 1995-12-05 2002-07-15 東京エレクトロン株式会社 洗浄方法と洗浄装置
JPH09260322A (ja) * 1996-03-26 1997-10-03 Nippon Steel Corp 洗浄装置
JPH10199844A (ja) * 1997-01-10 1998-07-31 Dainippon Screen Mfg Co Ltd 基板洗浄装置
JPH10308374A (ja) 1997-03-06 1998-11-17 Ebara Corp 洗浄方法及び洗浄装置
JPH10312983A (ja) 1997-05-12 1998-11-24 Dainippon Screen Mfg Co Ltd 基板洗浄装置
JPH10312982A (ja) 1997-05-12 1998-11-24 Dainippon Screen Mfg Co Ltd 基板洗浄装置
JP4091187B2 (ja) 1998-12-08 2008-05-28 株式会社荏原製作所 洗浄具、基板洗浄装置及び基板洗浄方法
JP2002018368A (ja) 2000-07-05 2002-01-22 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2003031536A (ja) 2001-07-12 2003-01-31 Nec Corp ウエハの洗浄方法
JP2007273608A (ja) * 2006-03-30 2007-10-18 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100412542B1 (ko) * 1995-09-20 2004-05-31 가부시끼가이샤 도시바 작업물의세정방법및장치
JP2000015189A (ja) 1998-06-29 2000-01-18 Shibaura Mechatronics Corp ブラシ洗浄装置およびブラシ洗浄方法
US20020096191A1 (en) * 2001-01-24 2002-07-25 International Business Machines Corporation Apparatus and method for wafer cleaning
JP2004273961A (ja) 2003-03-12 2004-09-30 Ebara Corp 金属配線形成基板の洗浄処理装置
JP2005012238A (ja) 2004-09-02 2005-01-13 Ebara Corp 基板洗浄方法及び装置
JP2006073788A (ja) 2004-09-02 2006-03-16 Sumco Corp ウェーハの洗浄方法及び洗浄装置
US20110189857A1 (en) 2008-09-24 2011-08-04 Tokyo Electron Limited Chemical mechanical polishing apparatus, chemical mechanical polishing method, and control program

Also Published As

Publication number Publication date
US9058977B2 (en) 2015-06-16
JP2014132639A (ja) 2014-07-17
TW201429567A (zh) 2014-08-01
TWI611848B (zh) 2018-01-21
US20140158160A1 (en) 2014-06-12
KR20140073428A (ko) 2014-06-16
JP6297308B2 (ja) 2018-03-20

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