JP6297308B2 - 基板洗浄装置及び基板洗浄方法 - Google Patents

基板洗浄装置及び基板洗浄方法 Download PDF

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Publication number
JP6297308B2
JP6297308B2 JP2013238224A JP2013238224A JP6297308B2 JP 6297308 B2 JP6297308 B2 JP 6297308B2 JP 2013238224 A JP2013238224 A JP 2013238224A JP 2013238224 A JP2013238224 A JP 2013238224A JP 6297308 B2 JP6297308 B2 JP 6297308B2
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Japan
Prior art keywords
substrate
cleaning member
cleaning
end contact
contact surface
Prior art date
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Active
Application number
JP2013238224A
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English (en)
Japanese (ja)
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JP2014132639A (ja
JP2014132639A5 (https=
Inventor
知淳 石橋
知淳 石橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2013238224A priority Critical patent/JP6297308B2/ja
Priority to KR1020130148922A priority patent/KR102103321B1/ko
Priority to TW102144346A priority patent/TWI611848B/zh
Priority to US14/098,471 priority patent/US9058977B2/en
Publication of JP2014132639A publication Critical patent/JP2014132639A/ja
Publication of JP2014132639A5 publication Critical patent/JP2014132639A5/ja
Application granted granted Critical
Publication of JP6297308B2 publication Critical patent/JP6297308B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
JP2013238224A 2012-12-06 2013-11-18 基板洗浄装置及び基板洗浄方法 Active JP6297308B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013238224A JP6297308B2 (ja) 2012-12-06 2013-11-18 基板洗浄装置及び基板洗浄方法
KR1020130148922A KR102103321B1 (ko) 2012-12-06 2013-12-03 기판 세정 장치 및 기판 세정 방법
TW102144346A TWI611848B (zh) 2012-12-06 2013-12-04 基板洗淨裝置及基板洗淨方法
US14/098,471 US9058977B2 (en) 2012-12-06 2013-12-05 Substrate cleaning apparatus and substrate cleaning method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012267568 2012-12-06
JP2012267568 2012-12-06
JP2013238224A JP6297308B2 (ja) 2012-12-06 2013-11-18 基板洗浄装置及び基板洗浄方法

Publications (3)

Publication Number Publication Date
JP2014132639A JP2014132639A (ja) 2014-07-17
JP2014132639A5 JP2014132639A5 (https=) 2016-11-17
JP6297308B2 true JP6297308B2 (ja) 2018-03-20

Family

ID=50879637

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013238224A Active JP6297308B2 (ja) 2012-12-06 2013-11-18 基板洗浄装置及び基板洗浄方法

Country Status (4)

Country Link
US (1) US9058977B2 (https=)
JP (1) JP6297308B2 (https=)
KR (1) KR102103321B1 (https=)
TW (1) TWI611848B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170043664A (ko) * 2014-10-31 2017-04-21 가부시키가이샤 에바라 세이사꾸쇼 기판 세정 장치 및 기판 세정 방법
JP6871499B2 (ja) * 2016-06-16 2021-05-12 サミー株式会社 ぱちんこ遊技機
WO2023145431A1 (ja) * 2022-01-31 2023-08-03 Ａｇｃ株式会社 基板洗浄方法、ガラス基板の製造方法、ｅｕｖｌ用マスクブランクの製造方法、および基板洗浄装置
JP2024064209A (ja) * 2022-10-27 2024-05-14 株式会社Ｓｃｒｅｅｎホールディングス ブラシ及びそれを備えた基板処理装置並びにブラシの押し圧制御方法
US12525468B2 (en) 2022-12-30 2026-01-13 Applied Materials, Inc. Integrated clean and dry module for cleaning a substrate
CN118649956B (zh) * 2024-07-30 2025-12-05 宁波礼达先导生物技术有限公司 一种自动化多工位孔板洗板机

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2628168B2 (ja) 1987-07-14 1997-07-09 住友シチックス株式会社 半導体ウエーハの表面処理装置
JP3447869B2 (ja) * 1995-09-20 2003-09-16 株式会社荏原製作所 洗浄方法及び装置
JP3302873B2 (ja) 1995-12-05 2002-07-15 東京エレクトロン株式会社 洗浄方法と洗浄装置
JPH09260322A (ja) * 1996-03-26 1997-10-03 Nippon Steel Corp 洗浄装置
JPH10199844A (ja) * 1997-01-10 1998-07-31 Dainippon Screen Mfg Co Ltd 基板洗浄装置
JPH10308374A (ja) 1997-03-06 1998-11-17 Ebara Corp 洗浄方法及び洗浄装置
JPH10312983A (ja) 1997-05-12 1998-11-24 Dainippon Screen Mfg Co Ltd 基板洗浄装置
JPH10312982A (ja) 1997-05-12 1998-11-24 Dainippon Screen Mfg Co Ltd 基板洗浄装置
JP4268239B2 (ja) * 1998-06-29 2009-05-27 芝浦メカトロニクス株式会社 ブラシ洗浄装置およびブラシ洗浄方法
JP4091187B2 (ja) 1998-12-08 2008-05-28 株式会社荏原製作所 洗浄具、基板洗浄装置及び基板洗浄方法
JP2002018368A (ja) 2000-07-05 2002-01-22 Dainippon Screen Mfg Co Ltd 基板処理装置
US6648979B2 (en) * 2001-01-24 2003-11-18 International Business Machines Corporation Apparatus and method for wafer cleaning
JP2003031536A (ja) 2001-07-12 2003-01-31 Nec Corp ウエハの洗浄方法
JP2004273961A (ja) * 2003-03-12 2004-09-30 Ebara Corp 金属配線形成基板の洗浄処理装置
JP2005012238A (ja) * 2004-09-02 2005-01-13 Ebara Corp 基板洗浄方法及び装置
JP2006073788A (ja) * 2004-09-02 2006-03-16 Sumco Corp ウェーハの洗浄方法及び洗浄装置
JP2007273608A (ja) * 2006-03-30 2007-10-18 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP5336799B2 (ja) 2008-09-24 2013-11-06 東京エレクトロン株式会社 化学的機械研磨装置、化学的機械研磨方法及び制御プログラム

Also Published As

Publication number Publication date
US9058977B2 (en) 2015-06-16
JP2014132639A (ja) 2014-07-17
TW201429567A (zh) 2014-08-01
TWI611848B (zh) 2018-01-21
US20140158160A1 (en) 2014-06-12
KR20140073428A (ko) 2014-06-16
KR102103321B1 (ko) 2020-04-22

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