KR102094563B1 - 와이어 상호접속 구조를 형성하는 방법 - Google Patents

와이어 상호접속 구조를 형성하는 방법 Download PDF

Info

Publication number
KR102094563B1
KR102094563B1 KR1020157000968A KR20157000968A KR102094563B1 KR 102094563 B1 KR102094563 B1 KR 102094563B1 KR 1020157000968 A KR1020157000968 A KR 1020157000968A KR 20157000968 A KR20157000968 A KR 20157000968A KR 102094563 B1 KR102094563 B1 KR 102094563B1
Authority
KR
South Korea
Prior art keywords
wire
interconnect structure
forming
length
bond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020157000968A
Other languages
English (en)
Korean (ko)
Other versions
KR20150036074A (ko
Inventor
토마스 제이. 주니어 콜로시모
존 더블유. 브루너
Original Assignee
쿨리케 앤드 소파 인더스트리즈, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 filed Critical 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드
Publication of KR20150036074A publication Critical patent/KR20150036074A/ko
Application granted granted Critical
Publication of KR102094563B1 publication Critical patent/KR102094563B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H01L24/85—
    • H01L24/97—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H01L2224/48465—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads

Landscapes

  • Wire Bonding (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
KR1020157000968A 2012-07-17 2013-07-01 와이어 상호접속 구조를 형성하는 방법 Active KR102094563B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261672449P 2012-07-17 2012-07-17
US61/672,449 2012-07-17
PCT/US2013/048860 WO2014014643A1 (en) 2012-07-17 2013-07-01 Methods of forming wire interconnect structures

Publications (2)

Publication Number Publication Date
KR20150036074A KR20150036074A (ko) 2015-04-07
KR102094563B1 true KR102094563B1 (ko) 2020-03-27

Family

ID=49949169

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157000968A Active KR102094563B1 (ko) 2012-07-17 2013-07-01 와이어 상호접속 구조를 형성하는 방법

Country Status (6)

Country Link
US (3) US9502371B2 (https=)
JP (1) JP6297553B2 (https=)
KR (1) KR102094563B1 (https=)
CN (1) CN104471693B (https=)
TW (1) TWI531015B (https=)
WO (1) WO2014014643A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102094563B1 (ko) * 2012-07-17 2020-03-27 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 와이어 상호접속 구조를 형성하는 방법
US9870946B2 (en) * 2013-12-31 2018-01-16 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer level package structure and method of forming same
JP5686912B1 (ja) * 2014-02-20 2015-03-18 株式会社新川 バンプ形成方法、バンプ形成装置及び半導体装置の製造方法
KR20160055100A (ko) * 2014-10-03 2016-05-17 인텔 코포레이션 수직 기둥들을 갖는 오버랩핑 적층형 다이 패키지
US11145620B2 (en) * 2019-03-05 2021-10-12 Asm Technology Singapore Pte Ltd Formation of bonding wire vertical interconnects
US11543362B2 (en) * 2019-05-02 2023-01-03 Asmpt Singapore Pte. Ltd. Method for measuring the heights of wire interconnections
JP2022033633A (ja) 2020-08-17 2022-03-02 キオクシア株式会社 半導体装置
KR20220045684A (ko) 2020-10-06 2022-04-13 에스케이하이닉스 주식회사 지그재그 모양의 와이어를 포함하는 반도체 패키지
WO2022113193A1 (ja) * 2020-11-25 2022-06-02 株式会社新川 ワイヤ形成方法及び半導体装置の製造方法
US12057431B2 (en) * 2020-12-18 2024-08-06 Kulicke And Soffa Industries, Inc. Methods of forming wire interconnect structures and related wire bonding tools
WO2023042333A1 (ja) 2021-09-16 2023-03-23 株式会社新川 ピンワイヤ形成方法、及びワイヤボンディング装置
JP7741745B2 (ja) 2022-02-15 2025-09-18 キオクシア株式会社 半導体装置およびその製造方法
US12183711B2 (en) 2022-02-15 2024-12-31 Kulicke And Soffa Industries, Inc. Methods of determining a sequence for creating a plurality of wire loops in connection with a workpiece
WO2026024695A1 (en) * 2024-07-24 2026-01-29 Kulicke And Soffa Industries, Inc. Wire bonding systems and related methods of forming a vertical wire structure

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007134611A (ja) * 2005-11-14 2007-05-31 Shinkawa Ltd ワイヤボンディング方法
US20070187467A1 (en) * 2006-02-14 2007-08-16 Kabushiki Kaisha Shinkawa Method for forming a stud bump

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4213556A (en) * 1978-10-02 1980-07-22 General Motors Corporation Method and apparatus to detect automatic wire bonder failure
DE3536908A1 (de) * 1984-10-18 1986-04-24 Sanyo Electric Co., Ltd., Moriguchi, Osaka Induktivitaetselement und verfahren zur herstellung desselben
US5045975A (en) * 1987-05-21 1991-09-03 Cray Computer Corporation Three dimensionally interconnected module assembly
US5195237A (en) * 1987-05-21 1993-03-23 Cray Computer Corporation Flying leads for integrated circuits
US5172851A (en) * 1990-09-20 1992-12-22 Matsushita Electronics Corporation Method of forming a bump electrode and manufacturing a resin-encapsulated semiconductor device
US6295729B1 (en) * 1992-10-19 2001-10-02 International Business Machines Corporation Angled flying lead wire bonding process
US6835898B2 (en) * 1993-11-16 2004-12-28 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US6836962B2 (en) * 1993-11-16 2005-01-04 Formfactor, Inc. Method and apparatus for shaping spring elements
US5421503A (en) * 1994-08-24 1995-06-06 Kulicke And Soffa Investments, Inc. Fine pitch capillary bonding tool
JPH09289276A (ja) * 1996-04-23 1997-11-04 Hitachi Ltd リードフレームおよびそれを用いた半導体装置
DE69739125D1 (de) * 1996-10-01 2009-01-02 Panasonic Corp Kapillare zum Drahtverbinden zur Herstellung von Höckerelektroden
JPH10135220A (ja) 1996-10-29 1998-05-22 Taiyo Yuden Co Ltd バンプ形成方法
JPH10135219A (ja) * 1996-10-29 1998-05-22 Taiyo Yuden Co Ltd バンプ形成方法
JP3189115B2 (ja) * 1996-12-27 2001-07-16 株式会社新川 半導体装置及びワイヤボンディング方法
US7032311B2 (en) * 2002-06-25 2006-04-25 Eli Razon Stabilized wire bonded electrical connections and method of making same
US7229906B2 (en) * 2002-09-19 2007-06-12 Kulicke And Soffa Industries, Inc. Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine
JP3854232B2 (ja) * 2003-02-17 2006-12-06 株式会社新川 バンプ形成方法及びワイヤボンディング方法
US6815836B2 (en) * 2003-03-24 2004-11-09 Texas Instruments Incorporated Wire bonding for thin semiconductor package
US7227095B2 (en) * 2003-08-06 2007-06-05 Micron Technology, Inc. Wire bonders and methods of wire-bonding
CN1934691A (zh) * 2004-08-05 2007-03-21 精工爱普生株式会社 结合结构、引线结合方法、致动装置和液体喷射头
JP4298665B2 (ja) 2005-02-08 2009-07-22 株式会社新川 ワイヤボンディング方法
US7255538B2 (en) * 2005-02-09 2007-08-14 Hamilton Sundstrand Corporation Shrink-fit stress coupling for a shaft of differing materials
JP4744238B2 (ja) * 2005-08-29 2011-08-10 田中電子工業株式会社 ワイヤの切断方法
US8183684B2 (en) * 2007-03-23 2012-05-22 Semiconductor Components Industries, Llc Semiconductor device and method of manufacturing the same
KR102094563B1 (ko) * 2012-07-17 2020-03-27 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 와이어 상호접속 구조를 형성하는 방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007134611A (ja) * 2005-11-14 2007-05-31 Shinkawa Ltd ワイヤボンディング方法
US20070187467A1 (en) * 2006-02-14 2007-08-16 Kabushiki Kaisha Shinkawa Method for forming a stud bump

Also Published As

Publication number Publication date
TWI531015B (zh) 2016-04-21
US9865560B2 (en) 2018-01-09
JP6297553B2 (ja) 2018-03-20
US9502371B2 (en) 2016-11-22
US20170345787A1 (en) 2017-11-30
US20170040280A1 (en) 2017-02-09
CN104471693A (zh) 2015-03-25
CN104471693B (zh) 2018-05-08
JP2015533258A (ja) 2015-11-19
US20150132888A1 (en) 2015-05-14
TW201405683A (zh) 2014-02-01
WO2014014643A1 (en) 2014-01-23
US10153247B2 (en) 2018-12-11
KR20150036074A (ko) 2015-04-07

Similar Documents

Publication Publication Date Title
KR102094563B1 (ko) 와이어 상호접속 구조를 형성하는 방법
US7067413B2 (en) Wire bonding method, semiconductor chip, and semiconductor package
JP5714195B2 (ja) 半導体装置の製造方法
US9633981B2 (en) Systems and methods for bonding semiconductor elements
JP2005268497A (ja) 半導体装置及び半導体装置の製造方法
TWI482250B (zh) 中介片、其製造方法、及堆疊式封裝裝置
JP2003243441A (ja) 半導体装置及びその製造方法、回路基板並びに電子機器
KR101641102B1 (ko) 도전성 범프, 와이어 루프 및 그 형성 방법
US20060216863A1 (en) Method of manufacturing semiconductor device
US10643966B2 (en) Electrical interconnections for semiconductor devices and methods for forming the same
US12300663B2 (en) Methods of forming wire interconnect structures and related wire bonding tools
JP4666592B2 (ja) 半導体装置の製造方法
US20230275060A1 (en) Leaded semiconductor package with lead mold flash reduction
CN106158778B (zh) 具有侧面接触垫和底部接触垫的集成电路封装
WO2002082527A1 (en) Method of forming electrical connections
KR20090011564A (ko) 반도체 패키지 제조 방법
JP2004319921A (ja) ワイヤボンディング方法
JP5048990B2 (ja) 半導体装置及びその製造方法
Camenforte et al. Enabling Cu wire in 3D stack package QFN
CN101442036A (zh) 导线架结构及其应用

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000