KR102092615B1 - 이방성 접속 구조체 - Google Patents

이방성 접속 구조체 Download PDF

Info

Publication number
KR102092615B1
KR102092615B1 KR1020177024610A KR20177024610A KR102092615B1 KR 102092615 B1 KR102092615 B1 KR 102092615B1 KR 1020177024610 A KR1020177024610 A KR 1020177024610A KR 20177024610 A KR20177024610 A KR 20177024610A KR 102092615 B1 KR102092615 B1 KR 102092615B1
Authority
KR
South Korea
Prior art keywords
bump
anisotropic
connection structure
flexible substrate
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020177024610A
Other languages
English (en)
Korean (ko)
Other versions
KR20170113621A (ko
Inventor
고지 에지마
겐이치 히라야마
히로미 구보데
Original Assignee
데쿠세리아루즈 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 데쿠세리아루즈 가부시키가이샤 filed Critical 데쿠세리아루즈 가부시키가이샤
Publication of KR20170113621A publication Critical patent/KR20170113621A/ko
Application granted granted Critical
Publication of KR102092615B1 publication Critical patent/KR102092615B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
KR1020177024610A 2015-03-20 2016-03-03 이방성 접속 구조체 Active KR102092615B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015058069A JP6512632B2 (ja) 2015-03-20 2015-03-20 異方性接続構造体及び異方性接続構造体の製造方法
JPJP-P-2015-058069 2015-03-20
PCT/JP2016/056610 WO2016152441A1 (ja) 2015-03-20 2016-03-03 異方性接続構造体

Publications (2)

Publication Number Publication Date
KR20170113621A KR20170113621A (ko) 2017-10-12
KR102092615B1 true KR102092615B1 (ko) 2020-03-24

Family

ID=56977307

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177024610A Active KR102092615B1 (ko) 2015-03-20 2016-03-03 이방성 접속 구조체

Country Status (5)

Country Link
JP (1) JP6512632B2 (https=)
KR (1) KR102092615B1 (https=)
CN (1) CN107409467B (https=)
TW (1) TWI708413B (https=)
WO (1) WO2016152441A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112166529A (zh) * 2018-06-06 2021-01-01 迪睿合株式会社 连接体、连接体的制造方法、连接方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006278637A (ja) * 2005-03-29 2006-10-12 Sharp Corp 基板実装構造および表示装置
WO2013099135A1 (ja) * 2011-12-28 2013-07-04 パナソニック株式会社 フレキシブル表示装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6621766B2 (en) * 2001-08-01 2003-09-16 Fossil, Inc. Flexible timepiece in multiple environments
JP3910527B2 (ja) 2002-03-13 2007-04-25 シャープ株式会社 液晶表示装置およびその製造方法
JP4389447B2 (ja) * 2003-01-28 2009-12-24 セイコーエプソン株式会社 電気光学装置の製造方法
US8742260B2 (en) * 2006-10-18 2014-06-03 Nec Corporation Circuit board device and circuit board module device
JP2008165219A (ja) 2006-12-08 2008-07-17 Bridgestone Corp フレキシブルドライバｉｃ
JP5039427B2 (ja) 2007-05-08 2012-10-03 株式会社ブリヂストン フレキシブルドライバｉｃの実装方法およびフレキシブルドライバｉｃ
JP2008281638A (ja) 2007-05-08 2008-11-20 Bridgestone Corp フレキシブルドライバｉｃの実装方法およびそれに用いるフレキシブルドライバｉｃ
KR101878251B1 (ko) * 2011-04-08 2018-07-13 삼성전자주식회사 굽힘 감지 센서 및 그를 제조하는 방법
TWI547369B (zh) * 2011-05-27 2016-09-01 康寧公司 玻璃塑膠積層之裝置、處理線、及方法
JP5508480B2 (ja) * 2011-07-06 2014-05-28 積水化学工業株式会社 異方性導電ペースト、接続構造体及び接続構造体の製造方法
JP5887790B2 (ja) * 2011-09-21 2016-03-16 ソニー株式会社 表示装置および電子機器
JP5910106B2 (ja) * 2012-01-23 2016-04-27 大日本印刷株式会社 タッチパネルモジュールおよびタッチパネル付表示装置
JP2013160942A (ja) * 2012-02-06 2013-08-19 Sony Corp 半導体装置およびその製造方法、並びに電子機器
JP2013210491A (ja) * 2012-03-30 2013-10-10 Sony Corp 表示装置および電子機器
KR101889008B1 (ko) * 2012-06-11 2018-08-20 삼성전자주식회사 플렉서블 디스플레이 장치 및 그 제어 방법
US8960899B2 (en) * 2012-09-26 2015-02-24 Google Inc. Assembling thin silicon chips on a contact lens
EP2743785B1 (fr) * 2012-12-17 2014-12-17 The Swatch Group Research and Development Ltd. Dispositif électronique portable flexible
US9348362B2 (en) * 2013-02-08 2016-05-24 Samsung Electronics Co., Ltd. Flexible portable terminal
JP6376355B2 (ja) * 2013-05-22 2018-08-22 パナソニックＩｐマネジメント株式会社 ウェアラブル機器
JP3193457U (ja) * 2014-07-24 2014-10-02 双葉電子工業株式会社 有機ｅｌ表示素子

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006278637A (ja) * 2005-03-29 2006-10-12 Sharp Corp 基板実装構造および表示装置
WO2013099135A1 (ja) * 2011-12-28 2013-07-04 パナソニック株式会社 フレキシブル表示装置

Also Published As

Publication number Publication date
TWI708413B (zh) 2020-10-21
WO2016152441A1 (ja) 2016-09-29
KR20170113621A (ko) 2017-10-12
JP2016178226A (ja) 2016-10-06
TW201637260A (zh) 2016-10-16
CN107409467A (zh) 2017-11-28
HK1244994A1 (zh) 2018-08-17
CN107409467B (zh) 2019-08-06
JP6512632B2 (ja) 2019-05-15

Similar Documents

Publication Publication Date Title
JP6932110B2 (ja) 異方導電性フィルム及び接続構造体
JP5974147B1 (ja) 配線体アセンブリ、導体層付き構造体、及びタッチセンサ
JP7047282B2 (ja) フィラー含有フィルム
JP2020177916A (ja) 異方導電性フィルム及び接続構造体
JP6645730B2 (ja) 接続体及び接続体の製造方法
CN108476591B (zh) 连接体、连接体的制造方法、检测方法
KR101937001B1 (ko) 접속체, 접속체의 제조 방법, 전자 기기
KR20150058312A (ko) 이방성 도전 필름, 이방성 도전 필름의 제조 방법, 접속체의 제조 방법 및 접속 방법
CN106797080A (zh) 各向异性导电膜及连接结构体
US20120146215A1 (en) Bonding pad structure and integrated circuit comprising a plurality of bonding pad structures
WO2015076234A1 (ja) 異方導電性フィルム及び接続構造体
KR102424343B1 (ko) 접속체, 접속체의 제조 방법 및 검사 방법
KR102092615B1 (ko) 이방성 접속 구조체
JP7332956B2 (ja) フィラー含有フィルム
JP2020038993A (ja) 接続体及び接続体の製造方法
KR101923621B1 (ko) 전도성 기판 및 이를 포함하는 전자장치
HK1244994B (zh) 各向异性连接构造体
KR101344345B1 (ko) 본딩 패드 구조체 및 복수의 본딩 패드 구조체를 포함하는 집적 회로
HK1257116A1 (en) Connector, method for manufacturing connector, and testing method
HK1257116B (en) Connector, method for manufacturing connector, and testing method
JP2017130525A (ja) 異方性導電接続構造体、表示装置、および異方性導電接続方法

Legal Events

Date Code Title Description
A201 Request for examination
PA0105 International application

Patent event date: 20170901

Patent event code: PA01051R01D

Comment text: International Patent Application

PA0201 Request for examination
PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20190522

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20200103

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20200318

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20200319

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20230222

Start annual number: 4

End annual number: 4

PR1001 Payment of annual fee

Payment date: 20240220

Start annual number: 5

End annual number: 5

PR1001 Payment of annual fee

Payment date: 20250218

Start annual number: 6

End annual number: 6