KR102069960B1 - 마스크 블랭크, 위상 시프트 마스크 및 위상 시프트 마스크의 제조 방법, 및 반도체 장치의 제조 방법 - Google Patents
마스크 블랭크, 위상 시프트 마스크 및 위상 시프트 마스크의 제조 방법, 및 반도체 장치의 제조 방법 Download PDFInfo
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- KR102069960B1 KR102069960B1 KR1020177030296A KR20177030296A KR102069960B1 KR 102069960 B1 KR102069960 B1 KR 102069960B1 KR 1020177030296 A KR1020177030296 A KR 1020177030296A KR 20177030296 A KR20177030296 A KR 20177030296A KR 102069960 B1 KR102069960 B1 KR 102069960B1
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- South Korea
- Prior art keywords
- phase shift
- film
- layer
- mask
- silicon
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-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/32—Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portion; Preparation thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
- C23C14/0652—Silicon nitride
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0682—Silicides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2015-067259 | 2015-03-27 | ||
| JP2015067259 | 2015-03-27 | ||
| PCT/JP2016/059326 WO2016158649A1 (ja) | 2015-03-27 | 2016-03-24 | マスクブランク、位相シフトマスク及び位相シフトマスクの製造方法、並びに半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20170123346A KR20170123346A (ko) | 2017-11-07 |
| KR102069960B1 true KR102069960B1 (ko) | 2020-01-23 |
Family
ID=57006798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020177030296A Active KR102069960B1 (ko) | 2015-03-27 | 2016-03-24 | 마스크 블랭크, 위상 시프트 마스크 및 위상 시프트 마스크의 제조 방법, 및 반도체 장치의 제조 방법 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10365556B2 (https=) |
| JP (2) | JP6073028B2 (https=) |
| KR (1) | KR102069960B1 (https=) |
| TW (1) | TWI682233B (https=) |
| WO (1) | WO2016158649A1 (https=) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6058757B1 (ja) * | 2015-07-15 | 2017-01-11 | Hoya株式会社 | マスクブランク、位相シフトマスク、位相シフトマスクの製造方法および半導体デバイスの製造方法 |
| SG11201811413QA (en) * | 2016-07-25 | 2019-02-27 | Hoya Corp | Mask blank, transfer mask, method for producing transfer mask, and method for manufacturing semiconductor device |
| JP6772037B2 (ja) * | 2016-11-11 | 2020-10-21 | Hoya株式会社 | マスクブランク、転写用マスク、転写用マスクの製造方法および半導体デバイスの製造方法 |
| JP6740107B2 (ja) | 2016-11-30 | 2020-08-12 | Hoya株式会社 | マスクブランク、転写用マスク及び半導体デバイスの製造方法 |
| JP6812236B2 (ja) * | 2016-12-27 | 2021-01-13 | Hoya株式会社 | 位相シフトマスクブランク及びこれを用いた位相シフトマスクの製造方法、並びに表示装置の製造方法 |
| JP6400763B2 (ja) * | 2017-03-16 | 2018-10-03 | Hoya株式会社 | マスクブランク、転写用マスクおよび半導体デバイスの製造方法 |
| JP7126836B2 (ja) * | 2017-03-28 | 2022-08-29 | Hoya株式会社 | 位相シフトマスクブランク及びそれを用いた位相シフトマスクの製造方法、並びにパターン転写方法 |
| JP6716629B2 (ja) * | 2017-05-18 | 2020-07-01 | エスアンドエス テック カンパニー リミテッド | 位相反転ブランクマスク及びその製造方法 |
| KR102599738B1 (ko) * | 2017-05-22 | 2023-11-09 | 엔체인 홀딩스 리미티드 | 미결정 소스로부터 미결정 데이터를 블록체인 트랜잭션의 잠금 스크립트에 안전하게 제공하는 기법 |
| JP6998181B2 (ja) * | 2017-11-14 | 2022-02-04 | アルバック成膜株式会社 | マスクブランク、位相シフトマスクおよびその製造方法 |
| JP6547019B1 (ja) * | 2018-02-22 | 2019-07-17 | Hoya株式会社 | マスクブランク、位相シフトマスク及び半導体デバイスの製造方法 |
| TWI835695B (zh) * | 2018-11-30 | 2024-03-11 | 日商Hoya股份有限公司 | 光罩基底、光罩之製造方法及顯示裝置之製造方法 |
| JP7350682B2 (ja) | 2020-03-23 | 2023-09-26 | Hoya株式会社 | マスクブランク及び転写用マスクの製造方法 |
| JP7296927B2 (ja) * | 2020-09-17 | 2023-06-23 | 信越化学工業株式会社 | 位相シフトマスクブランク、位相シフトマスクの製造方法、及び位相シフトマスク |
| DE102023112057A1 (de) * | 2022-08-31 | 2024-02-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Verfahren zum herstellen von fotomasken |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005284213A (ja) * | 2004-03-31 | 2005-10-13 | Shin Etsu Chem Co Ltd | 位相シフトマスクブランク、位相シフトマスク及びパターン転写方法 |
| JP2014232191A (ja) | 2013-05-29 | 2014-12-11 | Hoya株式会社 | マスクブランク、位相シフトマスク、これらの製造方法、および半導体デバイスの製造方法 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3410089B2 (ja) * | 1991-11-13 | 2003-05-26 | 株式会社東芝 | 露光用マスクの製造方法及び露光方法 |
| JP3339716B2 (ja) | 1992-07-17 | 2002-10-28 | 株式会社東芝 | 露光用マスクの製造方法 |
| US5547787A (en) | 1992-04-22 | 1996-08-20 | Kabushiki Kaisha Toshiba | Exposure mask, exposure mask substrate, method for fabricating the same, and method for forming pattern based on exposure mask |
| JP3247485B2 (ja) * | 1992-07-08 | 2002-01-15 | 株式会社東芝 | 露光用マスク及びその製造方法 |
| JP2002040625A (ja) * | 1992-07-17 | 2002-02-06 | Toshiba Corp | 露光用マスク、レジストパターン形成方法及び露光マスク用基板の製造方法 |
| JP3257893B2 (ja) * | 1993-10-18 | 2002-02-18 | 三菱電機株式会社 | 位相シフトマスク、その位相シフトマスクの製造方法およびその位相シフトマスクを用いた露光方法 |
| JP3445329B2 (ja) | 1993-11-02 | 2003-09-08 | Hoya株式会社 | ハーフトーン型位相シフトマスク及びハーフトーン型位相シフトマスクブランク |
| JP2002258458A (ja) | 2000-12-26 | 2002-09-11 | Hoya Corp | ハーフトーン型位相シフトマスク及びマスクブランク |
| JP4027660B2 (ja) * | 2000-12-26 | 2007-12-26 | Hoya株式会社 | ハーフトーン型位相シフトマスクブランク及びマスク |
| JP4387390B2 (ja) * | 2000-12-26 | 2009-12-16 | Hoya株式会社 | ハーフトーン型位相シフトマスクおよびマスクブランク、これらの製造方法、並びにパターン転写方法 |
| DE10307545A1 (de) | 2002-02-22 | 2003-11-06 | Hoya Corp | Zuschnitt für halbtonartige Phasenverschiebungsmaske und zugehörige Phasenverschiebungsmaske |
| JP2004004791A (ja) | 2002-04-25 | 2004-01-08 | Hoya Corp | ハーフトーン型位相シフトマスクブランク及びハーフトーン型位相シフトマスク |
| JP2005208282A (ja) * | 2004-01-22 | 2005-08-04 | Hoya Corp | ハーフトーン型位相シフトマスクブランクの製造方法、及びハーフトーン型位相シフトマスクの製造方法 |
| US7556892B2 (en) | 2004-03-31 | 2009-07-07 | Shin-Etsu Chemical Co., Ltd. | Halftone phase shift mask blank, halftone phase shift mask, and pattern transfer method |
| US7790334B2 (en) | 2005-01-27 | 2010-09-07 | Applied Materials, Inc. | Method for photomask plasma etching using a protected mask |
| JP2010217514A (ja) | 2009-03-17 | 2010-09-30 | Toppan Printing Co Ltd | フォトマスクの製造方法 |
| JP4797114B2 (ja) * | 2009-10-12 | 2011-10-19 | Hoya株式会社 | 転写用マスクの製造方法及び半導体デバイスの製造方法 |
| JP5313401B2 (ja) | 2010-04-09 | 2013-10-09 | Hoya株式会社 | 位相シフトマスクブランク及びその製造方法、並びに位相シフトマスク |
| JP5713953B2 (ja) * | 2012-04-26 | 2015-05-07 | 信越化学工業株式会社 | フォトマスクブランクおよびその製造方法 |
| JP5795991B2 (ja) * | 2012-05-16 | 2015-10-14 | 信越化学工業株式会社 | フォトマスクブランク、フォトマスクの製造方法、および位相シフトマスクの製造方法 |
-
2016
- 2016-03-24 KR KR1020177030296A patent/KR102069960B1/ko active Active
- 2016-03-24 WO PCT/JP2016/059326 patent/WO2016158649A1/ja not_active Ceased
- 2016-03-24 US US15/561,124 patent/US10365556B2/en active Active
- 2016-03-25 JP JP2016061844A patent/JP6073028B2/ja active Active
- 2016-03-25 TW TW105109531A patent/TWI682233B/zh active
- 2016-12-30 JP JP2016257484A patent/JP6709540B2/ja active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005284213A (ja) * | 2004-03-31 | 2005-10-13 | Shin Etsu Chem Co Ltd | 位相シフトマスクブランク、位相シフトマスク及びパターン転写方法 |
| JP2014232191A (ja) | 2013-05-29 | 2014-12-11 | Hoya株式会社 | マスクブランク、位相シフトマスク、これらの製造方法、および半導体デバイスの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201640216A (zh) | 2016-11-16 |
| TWI682233B (zh) | 2020-01-11 |
| JP6709540B2 (ja) | 2020-06-17 |
| JP2016189002A (ja) | 2016-11-04 |
| US10365556B2 (en) | 2019-07-30 |
| WO2016158649A1 (ja) | 2016-10-06 |
| JP2017058703A (ja) | 2017-03-23 |
| US20180129130A1 (en) | 2018-05-10 |
| JP6073028B2 (ja) | 2017-02-01 |
| KR20170123346A (ko) | 2017-11-07 |
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