KR102050109B1 - 배선 구조 및 기판 검사 장치 - Google Patents

배선 구조 및 기판 검사 장치 Download PDF

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Publication number
KR102050109B1
KR102050109B1 KR1020130074510A KR20130074510A KR102050109B1 KR 102050109 B1 KR102050109 B1 KR 102050109B1 KR 1020130074510 A KR1020130074510 A KR 1020130074510A KR 20130074510 A KR20130074510 A KR 20130074510A KR 102050109 B1 KR102050109 B1 KR 102050109B1
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KR
South Korea
Prior art keywords
inspection
unit
connection
connection switching
probe
Prior art date
Application number
KR1020130074510A
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English (en)
Korean (ko)
Other versions
KR20140005087A (ko
Inventor
무네히로 야마시타
Original Assignee
니혼덴산리드가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 니혼덴산리드가부시키가이샤 filed Critical 니혼덴산리드가부시키가이샤
Publication of KR20140005087A publication Critical patent/KR20140005087A/ko
Application granted granted Critical
Publication of KR102050109B1 publication Critical patent/KR102050109B1/ko

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
KR1020130074510A 2012-07-04 2013-06-27 배선 구조 및 기판 검사 장치 KR102050109B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-150413 2012-07-04
JP2012150413A JP5966688B2 (ja) 2012-07-04 2012-07-04 配線構造及び基板検査装置

Publications (2)

Publication Number Publication Date
KR20140005087A KR20140005087A (ko) 2014-01-14
KR102050109B1 true KR102050109B1 (ko) 2019-11-28

Family

ID=50108939

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130074510A KR102050109B1 (ko) 2012-07-04 2013-06-27 배선 구조 및 기판 검사 장치

Country Status (3)

Country Link
JP (1) JP5966688B2 (zh)
KR (1) KR102050109B1 (zh)
TW (1) TWI577091B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018021801A (ja) * 2016-08-02 2018-02-08 株式会社デンソー 半導体素子の検査装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002156400A (ja) 2000-11-21 2002-05-31 Seiko Instruments Inc 電子機器およびその製造方法
JP2003098222A (ja) 2001-09-25 2003-04-03 Mitsubishi Electric Corp 検査用基板、検査装置及び半導体装置の検査方法
US20050156166A1 (en) 2004-01-07 2005-07-21 Unitechno Inc. Jig device for transporting and testing integrated circuit chip
US20060022688A1 (en) 2004-07-29 2006-02-02 Fujitsu Limited Probe card
US20070075726A1 (en) 2005-04-21 2007-04-05 Endicott Interconnect Technologies, Inc. Interposer and test assembly for testing electronic devices
JP2008309587A (ja) 2007-06-13 2008-12-25 Taiyo Kogyo Co Ltd プリント基板のユニバーサル機能を有する検査装置
JP2010230335A (ja) 2009-03-26 2010-10-14 Hioki Ee Corp 回路基板検査装置
JP2011227059A (ja) 2010-03-30 2011-11-10 Ngk Spark Plug Co Ltd 電気検査用治具、及び配線基板の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001091543A (ja) * 1999-09-27 2001-04-06 Hitachi Ltd 半導体検査装置
JP4251855B2 (ja) * 2002-11-19 2009-04-08 株式会社ヨコオ 高周波・高速用デバイスの検査治具の製法
JPWO2007026877A1 (ja) * 2005-09-02 2009-03-12 Jsr株式会社 回路基板の検査装置および回路基板の検査方法
JP2007304008A (ja) * 2006-05-12 2007-11-22 Nidec-Read Corp 基板検査用接触子、基板検査用治具及び基板検査装置
JP4895281B2 (ja) 2006-10-16 2012-03-14 日本電産リード株式会社 コネクタ
JP5798435B2 (ja) * 2011-03-07 2015-10-21 日本特殊陶業株式会社 電子部品検査装置用配線基板およびその製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002156400A (ja) 2000-11-21 2002-05-31 Seiko Instruments Inc 電子機器およびその製造方法
JP2003098222A (ja) 2001-09-25 2003-04-03 Mitsubishi Electric Corp 検査用基板、検査装置及び半導体装置の検査方法
US20050156166A1 (en) 2004-01-07 2005-07-21 Unitechno Inc. Jig device for transporting and testing integrated circuit chip
US20060022688A1 (en) 2004-07-29 2006-02-02 Fujitsu Limited Probe card
US20070075726A1 (en) 2005-04-21 2007-04-05 Endicott Interconnect Technologies, Inc. Interposer and test assembly for testing electronic devices
JP2008309587A (ja) 2007-06-13 2008-12-25 Taiyo Kogyo Co Ltd プリント基板のユニバーサル機能を有する検査装置
JP2010230335A (ja) 2009-03-26 2010-10-14 Hioki Ee Corp 回路基板検査装置
JP2011227059A (ja) 2010-03-30 2011-11-10 Ngk Spark Plug Co Ltd 電気検査用治具、及び配線基板の製造方法

Also Published As

Publication number Publication date
JP5966688B2 (ja) 2016-08-10
TWI577091B (zh) 2017-04-01
KR20140005087A (ko) 2014-01-14
JP2014013181A (ja) 2014-01-23
TW201403953A (zh) 2014-01-16

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