KR102044769B1 - 점착 테이프, 방열 시트 및 전자기기 - Google Patents

점착 테이프, 방열 시트 및 전자기기 Download PDF

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Publication number
KR102044769B1
KR102044769B1 KR1020187022740A KR20187022740A KR102044769B1 KR 102044769 B1 KR102044769 B1 KR 102044769B1 KR 1020187022740 A KR1020187022740 A KR 1020187022740A KR 20187022740 A KR20187022740 A KR 20187022740A KR 102044769 B1 KR102044769 B1 KR 102044769B1
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KR
South Korea
Prior art keywords
adhesive
adhesive tape
shape
adhesion
mass
Prior art date
Application number
KR1020187022740A
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English (en)
Korean (ko)
Other versions
KR20180113194A (ko
Inventor
가츠아키 이마이
아키라 야마카미
Original Assignee
디아이씨 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 디아이씨 가부시끼가이샤 filed Critical 디아이씨 가부시끼가이샤
Publication of KR20180113194A publication Critical patent/KR20180113194A/ko
Application granted granted Critical
Publication of KR102044769B1 publication Critical patent/KR102044769B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B32B7/14—Interconnection of layers using interposed adhesives or interposed materials with bonding properties applied in spaced arrangements, e.g. in stripes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • C09J2201/28—
    • C09J2201/622—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR1020187022740A 2016-02-24 2017-02-09 점착 테이프, 방열 시트 및 전자기기 KR102044769B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016033132 2016-02-24
JPJP-P-2016-033132 2016-02-24
PCT/JP2017/004698 WO2017145773A1 (ja) 2016-02-24 2017-02-09 粘着テープ、放熱シート及び電子機器

Publications (2)

Publication Number Publication Date
KR20180113194A KR20180113194A (ko) 2018-10-15
KR102044769B1 true KR102044769B1 (ko) 2019-11-14

Family

ID=59686555

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187022740A KR102044769B1 (ko) 2016-02-24 2017-02-09 점착 테이프, 방열 시트 및 전자기기

Country Status (4)

Country Link
JP (3) JP6566115B2 (zh)
KR (1) KR102044769B1 (zh)
CN (1) CN108699406B (zh)
WO (1) WO2017145773A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7332147B2 (ja) 2019-08-26 2023-08-23 株式会社Joled 表示パネル、および、表示パネルの製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002319653A (ja) * 2001-04-20 2002-10-31 Matsushita Electric Ind Co Ltd グラファイトシートおよびそれを用いた放熱部品
JP2005272763A (ja) * 2004-03-26 2005-10-06 J-Film Corp 貼着用粘着シート
WO2016111208A1 (ja) * 2015-01-08 2016-07-14 株式会社寺岡製作所 粘着テープ

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4290759B2 (ja) * 1993-12-14 2009-07-08 スリーエム カンパニー 両面感圧接着テープ及びその製造方法
JP3018714U (ja) * 1995-05-29 1995-11-28 株式会社コスモテック 微弱粘着フィルム
JP2001110965A (ja) * 1999-10-07 2001-04-20 Fujikura Ltd 高熱伝導性粘着シート
JP4761428B2 (ja) * 2004-07-20 2011-08-31 日東電工株式会社 粘着テープ類
KR100671404B1 (ko) * 2004-12-15 2007-01-19 주식회사 에이스 디지텍 대형 디스플레이 장치용 아크릴계 점착제 조성물 및 이를이용한 광학필름
JP2007154144A (ja) * 2005-12-05 2007-06-21 Yoshihiro Suzuki 粘着加工シート及び粘着剤付剥離紙
JP4875357B2 (ja) 2005-12-19 2012-02-15 リンテック株式会社 両面粘着テープ
JP5853257B2 (ja) * 2009-01-29 2016-02-09 コクヨ株式会社 粘着製品、転写具
JP5110113B2 (ja) * 2009-03-31 2012-12-26 Ｄｉｃ株式会社 放熱シート用粘着テープ及び放熱シート
JP2011042773A (ja) * 2009-08-24 2011-03-03 K D K Kk 穴あきフィルムシート
JP2011216671A (ja) * 2010-03-31 2011-10-27 Furukawa Electric Co Ltd:The 半導体ウエハの加工用テープ、その製造方法および半導体ウエハの加工方法
JP5647576B2 (ja) * 2010-08-05 2015-01-07 日東電工株式会社 接着テープ
JP5903984B2 (ja) * 2012-03-29 2016-04-13 Dic株式会社 着色粘着テープおよびグラファイト複合シート
JP5696739B2 (ja) * 2013-05-10 2015-04-08 コクヨ株式会社 感圧転写式粘着テープ及び転写具
US20180072920A1 (en) * 2015-04-10 2018-03-15 Kaneka Corporation Graphite composite film and method for producing same, and heat-dissipating part
JPWO2017022749A1 (ja) * 2015-08-06 2018-02-22 Dic株式会社 粘着テープ、放熱シート、電子機器及び粘着テープの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002319653A (ja) * 2001-04-20 2002-10-31 Matsushita Electric Ind Co Ltd グラファイトシートおよびそれを用いた放熱部品
JP2005272763A (ja) * 2004-03-26 2005-10-06 J-Film Corp 貼着用粘着シート
WO2016111208A1 (ja) * 2015-01-08 2016-07-14 株式会社寺岡製作所 粘着テープ

Also Published As

Publication number Publication date
JP6711387B2 (ja) 2020-06-17
JPWO2017145773A1 (ja) 2018-11-08
CN108699406A (zh) 2018-10-23
JP2019019336A (ja) 2019-02-07
JP6566115B2 (ja) 2019-08-28
CN108699406B (zh) 2020-01-14
WO2017145773A1 (ja) 2017-08-31
JP6711388B2 (ja) 2020-06-17
JP2019019337A (ja) 2019-02-07
KR20180113194A (ko) 2018-10-15

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