KR102044045B1 - 상이한 소수 캐리어 수명들을 가진 채널 영역을 포함한 장치들 및 방법들 - Google Patents
상이한 소수 캐리어 수명들을 가진 채널 영역을 포함한 장치들 및 방법들 Download PDFInfo
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- KR102044045B1 KR102044045B1 KR1020147006540A KR20147006540A KR102044045B1 KR 102044045 B1 KR102044045 B1 KR 102044045B1 KR 1020147006540 A KR1020147006540 A KR 1020147006540A KR 20147006540 A KR20147006540 A KR 20147006540A KR 102044045 B1 KR102044045 B1 KR 102044045B1
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- elongated channel
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/10—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the top-view layout
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/20—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels
- H10B41/23—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
- H10B41/27—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
- H10B41/35—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region with a cell select transistor, e.g. NAND
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/10—EEPROM devices comprising charge-trapping gate insulators characterised by the top-view layout
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/20—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels
- H10B43/23—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
- H10B43/27—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
- H10B43/35—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region with cell select transistors, e.g. NAND
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/751—Insulated-gate field-effect transistors [IGFET] having composition variations in the channel regions
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- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/211,033 US8742481B2 (en) | 2011-08-16 | 2011-08-16 | Apparatuses and methods comprising a channel region having different minority carrier lifetimes |
| US13/211,033 | 2011-08-16 | ||
| PCT/US2012/050796 WO2013025719A2 (en) | 2011-08-16 | 2012-08-14 | Apparatuses and methods comprising a channel region having different minority carrier lifetimes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20140068061A KR20140068061A (ko) | 2014-06-05 |
| KR102044045B1 true KR102044045B1 (ko) | 2019-12-02 |
Family
ID=47712018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020147006540A Active KR102044045B1 (ko) | 2011-08-16 | 2012-08-14 | 상이한 소수 캐리어 수명들을 가진 채널 영역을 포함한 장치들 및 방법들 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US8742481B2 (enExample) |
| EP (1) | EP2745321A4 (enExample) |
| JP (1) | JP5877246B2 (enExample) |
| KR (1) | KR102044045B1 (enExample) |
| CN (1) | CN103828049A (enExample) |
| TW (1) | TWI538165B (enExample) |
| WO (1) | WO2013025719A2 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8750040B2 (en) | 2011-01-21 | 2014-06-10 | Micron Technology, Inc. | Memory devices having source lines directly coupled to body regions and methods |
| US8742481B2 (en) | 2011-08-16 | 2014-06-03 | Micron Technology, Inc. | Apparatuses and methods comprising a channel region having different minority carrier lifetimes |
| US9214235B2 (en) * | 2013-04-16 | 2015-12-15 | Conversant Intellectual Property Management Inc. | U-shaped common-body type cell string |
| SG10201803464XA (en) | 2017-06-12 | 2019-01-30 | Samsung Electronics Co Ltd | Semiconductor memory device and method of manufacturing the same |
| US10727244B2 (en) | 2017-06-12 | 2020-07-28 | Samsung Electronics Co., Ltd. | Semiconductor memory devices and methods of fabricating the same |
| US10923493B2 (en) | 2018-09-06 | 2021-02-16 | Micron Technology, Inc. | Microelectronic devices, electronic systems, and related methods |
| WO2020076652A1 (en) | 2018-10-09 | 2020-04-16 | Micron Technology, Inc. | Semiconductor devices comprising transistors having increased threshold voltage and related methods and systems |
Citations (4)
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| US20070158736A1 (en) | 2005-12-28 | 2007-07-12 | Kabushiki Kaisha Toshiba | Semiconductor memory device and method of fabricating the same |
| JP2010114369A (ja) | 2008-11-10 | 2010-05-20 | Toshiba Corp | 不揮発性半導体記憶装置 |
| US20100213538A1 (en) * | 2009-02-25 | 2010-08-26 | Kabushiki Kaisha Toshiba | Nonvolatile semiconductor memory device and method of manufacturing the same |
| JP2011070730A (ja) * | 2009-09-25 | 2011-04-07 | Toshiba Corp | 不揮発性半導体記憶装置 |
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| JPH07226446A (ja) * | 1994-02-12 | 1995-08-22 | Toshiba Corp | 半導体装置及びその製造方法 |
| JP4104701B2 (ja) | 1997-06-26 | 2008-06-18 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP4236722B2 (ja) | 1998-02-05 | 2009-03-11 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US6333217B1 (en) * | 1999-05-14 | 2001-12-25 | Matsushita Electric Industrial Co., Ltd. | Method of forming MOSFET with channel, extension and pocket implants |
| JP2003031693A (ja) | 2001-07-19 | 2003-01-31 | Toshiba Corp | 半導体メモリ装置 |
| US7304354B2 (en) * | 2004-02-17 | 2007-12-04 | Silicon Space Technology Corp. | Buried guard ring and radiation hardened isolation structures and fabrication methods |
| US20060278913A1 (en) * | 2005-06-08 | 2006-12-14 | Micron Technology, Inc. | Non-volatile memory cells without diffusion junctions |
| KR20070009183A (ko) | 2005-07-15 | 2007-01-18 | 엘지전자 주식회사 | 팝업기능과 연동하는 알람 방법 및 이를 이용한 이동통신단말기 |
| JP4592580B2 (ja) * | 2005-12-19 | 2010-12-01 | 株式会社東芝 | 不揮発性半導体記憶装置 |
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| KR20070091833A (ko) | 2006-03-07 | 2007-09-12 | 삼성전자주식회사 | 비휘발성 기억 소자 및 그 형성 방법 |
| US20080083943A1 (en) | 2006-10-10 | 2008-04-10 | Walker Andrew J | Dual-gate memory device and optimization of electrical interaction between front and back gates to enable scaling |
| KR100876082B1 (ko) * | 2006-12-07 | 2008-12-26 | 삼성전자주식회사 | 메모리 소자 및 그 형성 방법 |
| JP4791949B2 (ja) * | 2006-12-22 | 2011-10-12 | 株式会社東芝 | 不揮発性半導体メモリ |
| US7525136B2 (en) * | 2007-05-03 | 2009-04-28 | Dsm Solutions, Inc. | JFET device with virtual source and drain link regions and method of fabrication |
| US20100155858A1 (en) * | 2007-09-04 | 2010-06-24 | Yuan-Feng Chen | Asymmetric extension device |
| JP5364342B2 (ja) * | 2008-11-10 | 2013-12-11 | 株式会社東芝 | 不揮発性半導体記憶装置、及びその製造方法 |
| JP2010118530A (ja) | 2008-11-13 | 2010-05-27 | Toshiba Corp | 不揮発性半導体記憶装置 |
| KR101559549B1 (ko) | 2008-12-08 | 2015-10-13 | 삼성전자주식회사 | 모바일 SoC 및 모바일 단말기 |
| JP5356005B2 (ja) * | 2008-12-10 | 2013-12-04 | 株式会社東芝 | 不揮発性半導体記憶装置及びその製造方法 |
| JP2010199235A (ja) * | 2009-02-24 | 2010-09-09 | Toshiba Corp | 不揮発性半導体記憶装置 |
| KR101532366B1 (ko) | 2009-02-25 | 2015-07-01 | 삼성전자주식회사 | 반도체 기억 소자 |
| US20100314678A1 (en) | 2009-06-12 | 2010-12-16 | Se-Yun Lim | Non-volatile memory device and method for fabricating the same |
| JP2011108921A (ja) | 2009-11-19 | 2011-06-02 | Toshiba Corp | 不揮発性半導体記憶装置及びその製造方法 |
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| US8750040B2 (en) * | 2011-01-21 | 2014-06-10 | Micron Technology, Inc. | Memory devices having source lines directly coupled to body regions and methods |
| JP5330421B2 (ja) * | 2011-02-01 | 2013-10-30 | 株式会社東芝 | 不揮発性半導体記憶装置 |
| US8802525B2 (en) * | 2011-08-08 | 2014-08-12 | Micron Technology, Inc. | Methods of forming charge storage structures including etching diffused regions to form recesses |
| US8797806B2 (en) * | 2011-08-15 | 2014-08-05 | Micron Technology, Inc. | Apparatus and methods including source gates |
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-
2011
- 2011-08-16 US US13/211,033 patent/US8742481B2/en active Active
-
2012
- 2012-08-13 TW TW101129260A patent/TWI538165B/zh active
- 2012-08-14 EP EP12824323.5A patent/EP2745321A4/en not_active Ceased
- 2012-08-14 WO PCT/US2012/050796 patent/WO2013025719A2/en not_active Ceased
- 2012-08-14 CN CN201280046388.8A patent/CN103828049A/zh active Pending
- 2012-08-14 KR KR1020147006540A patent/KR102044045B1/ko active Active
- 2012-08-14 JP JP2014526134A patent/JP5877246B2/ja active Active
-
2014
- 2014-06-02 US US14/293,854 patent/US9190472B2/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070158736A1 (en) | 2005-12-28 | 2007-07-12 | Kabushiki Kaisha Toshiba | Semiconductor memory device and method of fabricating the same |
| JP2007180389A (ja) * | 2005-12-28 | 2007-07-12 | Toshiba Corp | 半導体記憶装置及びその製造方法 |
| JP2010114369A (ja) | 2008-11-10 | 2010-05-20 | Toshiba Corp | 不揮発性半導体記憶装置 |
| US20100213538A1 (en) * | 2009-02-25 | 2010-08-26 | Kabushiki Kaisha Toshiba | Nonvolatile semiconductor memory device and method of manufacturing the same |
| JP2011070730A (ja) * | 2009-09-25 | 2011-04-07 | Toshiba Corp | 不揮発性半導体記憶装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20130043505A1 (en) | 2013-02-21 |
| US9190472B2 (en) | 2015-11-17 |
| TW201316489A (zh) | 2013-04-16 |
| WO2013025719A2 (en) | 2013-02-21 |
| US8742481B2 (en) | 2014-06-03 |
| WO2013025719A3 (en) | 2013-05-02 |
| EP2745321A4 (en) | 2015-04-01 |
| KR20140068061A (ko) | 2014-06-05 |
| TWI538165B (zh) | 2016-06-11 |
| EP2745321A2 (en) | 2014-06-25 |
| JP2014522131A (ja) | 2014-08-28 |
| CN103828049A (zh) | 2014-05-28 |
| US20140264447A1 (en) | 2014-09-18 |
| JP5877246B2 (ja) | 2016-03-02 |
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