KR102029522B1 - 마이크로센서 패키지 및 그와 관련된 조립 방법 - Google Patents

마이크로센서 패키지 및 그와 관련된 조립 방법 Download PDF

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KR102029522B1
KR102029522B1 KR1020147029413A KR20147029413A KR102029522B1 KR 102029522 B1 KR102029522 B1 KR 102029522B1 KR 1020147029413 A KR1020147029413 A KR 1020147029413A KR 20147029413 A KR20147029413 A KR 20147029413A KR 102029522 B1 KR102029522 B1 KR 102029522B1
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South Korea
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substrate
microsensor
bonding
circuit board
printed circuit
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Korean (ko)
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KR20150031223A (ko
Inventor
제임스 알 언더브린크
마크 셰플라크
딜런 피. 알랙샌더
티파니 엔 레이건
제시카 씨. 멜로이
Original Assignee
더 보잉 컴파니
유니버시티 오브 플로리다 리서치 파운데이션, 아이엔씨.
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Publication of KR20150031223A publication Critical patent/KR20150031223A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0006—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/094—Feed-through, via
    • B81B2207/096—Feed-through, via through the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
  • Measuring Fluid Pressure (AREA)
KR1020147029413A 2012-06-15 2013-03-18 마이크로센서 패키지 및 그와 관련된 조립 방법 Active KR102029522B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/524,141 US9278849B2 (en) 2012-06-15 2012-06-15 Micro-sensor package and associated method of assembling the same
US13/524,141 2012-06-15
PCT/US2013/032811 WO2013187987A1 (en) 2012-06-15 2013-03-18 Micro-sensor package and associated method of assembling the same

Publications (2)

Publication Number Publication Date
KR20150031223A KR20150031223A (ko) 2015-03-23
KR102029522B1 true KR102029522B1 (ko) 2019-10-07

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Application Number Title Priority Date Filing Date
KR1020147029413A Active KR102029522B1 (ko) 2012-06-15 2013-03-18 마이크로센서 패키지 및 그와 관련된 조립 방법

Country Status (7)

Country Link
US (1) US9278849B2 (enExample)
EP (1) EP2861523B1 (enExample)
JP (1) JP6177320B2 (enExample)
KR (1) KR102029522B1 (enExample)
CN (1) CN104334492B (enExample)
CA (1) CA2870476C (enExample)
WO (1) WO2013187987A1 (enExample)

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US9146164B2 (en) * 2013-03-07 2015-09-29 Sensata Technologies, Inc. Pressure transducer substrate with self alignment feature
US10859448B2 (en) 2015-02-12 2020-12-08 University Of Florida Research Foundation, Incorporated MEMS capacitive shear sensor system having an interface circuit
JP6344266B2 (ja) * 2015-03-03 2018-06-20 株式会社デンソー 半導体装置およびその製造方法
KR101966491B1 (ko) 2016-03-16 2019-04-05 현대자동차주식회사 전해질 고갈을 방지할 수 있는 리튬 공기 전지
WO2017176506A1 (en) * 2016-04-05 2017-10-12 University Of Florida Research Foundation, Incorporated Flush-mount micromachined transducers
CN107290099B (zh) 2016-04-11 2021-06-08 森萨塔科技公司 压力传感器、用于压力传感器的插塞件和制造插塞件的方法
EP3236226B1 (en) 2016-04-20 2019-07-24 Sensata Technologies, Inc. Method of manufacturing a pressure sensor
US10545064B2 (en) 2017-05-04 2020-01-28 Sensata Technologies, Inc. Integrated pressure and temperature sensor
US10323998B2 (en) 2017-06-30 2019-06-18 Sensata Technologies, Inc. Fluid pressure sensor
US10724907B2 (en) 2017-07-12 2020-07-28 Sensata Technologies, Inc. Pressure sensor element with glass barrier material configured for increased capacitive response
US10557770B2 (en) 2017-09-14 2020-02-11 Sensata Technologies, Inc. Pressure sensor with improved strain gauge
CN111133768A (zh) * 2017-09-21 2020-05-08 美商楼氏电子有限公司 具有进入保护的麦克风中的提升mems器件
CN108190828B (zh) * 2018-02-07 2024-08-13 北京先通康桥医药科技有限公司 Mems传感器线阵、触诊探头及其制造方法
EP3680211B1 (en) * 2019-01-10 2024-03-06 TE Connectivity Solutions GmbH Sensor unit and method of interconnecting a substrate and a carrier
CN110610953B (zh) * 2019-09-30 2020-06-02 大连环宇安迪科技有限公司 一种相机感测组件及其制造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100705007B1 (ko) 2005-11-30 2007-04-09 매그나칩 반도체 유한회사 마이크로 센서 및 그 제조방법
JP2009004507A (ja) * 2007-06-20 2009-01-08 Shinko Electric Ind Co Ltd 電子部品用パッケージ及びその製造方法と電子部品装置
US20100084722A1 (en) 2008-09-22 2010-04-08 Torsten Kramer Method for manufacturing a micromechanical chip and a component having a chip of this type

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CN1545484A (zh) * 2001-08-24 2004-11-10 Ф�ء�����˹��˾ 制造微机电构件的方法
US7534722B2 (en) * 2005-06-14 2009-05-19 John Trezza Back-to-front via process
KR100995301B1 (ko) * 2005-12-26 2010-11-19 쿄세라 코포레이션 마이크로 전자 기계 장치 및 그 제조방법
JP5011820B2 (ja) * 2006-05-24 2012-08-29 オムロン株式会社 積層デバイス、およびその製造方法
JP2008085508A (ja) * 2006-09-26 2008-04-10 Matsushita Electric Works Ltd 音響センサの製造方法
DE102008025599B4 (de) 2007-05-14 2013-02-21 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Gehäuste aktive Mikrostrukturen mit Direktkontaktierung zu einem Substrat
JP4481323B2 (ja) * 2007-07-20 2010-06-16 日立オートモティブシステムズ株式会社 物理量センサ及びその製造方法
TWI464835B (zh) * 2008-04-04 2014-12-11 藤倉股份有限公司 半導體封裝體及其製造方法
US7929376B2 (en) 2008-04-25 2011-04-19 The Boeing Company Method and apparatus for identifying noise sources
US7812418B2 (en) 2008-07-29 2010-10-12 Fortemedia, Inc Chip-scaled MEMS microphone package
US8280694B2 (en) 2008-11-03 2012-10-02 The Boeing Company Constant current power source electronics for a sensor
JP5325630B2 (ja) * 2009-03-27 2013-10-23 株式会社東芝 マイクロホン装置並びにその調整装置及び調整方法
JP5018852B2 (ja) * 2009-09-29 2012-09-05 セイコーエプソン株式会社 圧電デバイスの製造方法
US8580594B2 (en) * 2011-08-09 2013-11-12 Taiwan Semiconductor Manufacturing Company, Ltd. Method of fabricating a semiconductor device having recessed bonding site

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100705007B1 (ko) 2005-11-30 2007-04-09 매그나칩 반도체 유한회사 마이크로 센서 및 그 제조방법
JP2009004507A (ja) * 2007-06-20 2009-01-08 Shinko Electric Ind Co Ltd 電子部品用パッケージ及びその製造方法と電子部品装置
US20100084722A1 (en) 2008-09-22 2010-04-08 Torsten Kramer Method for manufacturing a micromechanical chip and a component having a chip of this type

Also Published As

Publication number Publication date
CA2870476C (en) 2016-11-29
CN104334492B (zh) 2016-08-24
WO2013187987A1 (en) 2013-12-19
JP2015527568A (ja) 2015-09-17
JP6177320B2 (ja) 2017-08-09
CA2870476A1 (en) 2013-12-19
US20130336511A1 (en) 2013-12-19
CN104334492A (zh) 2015-02-04
EP2861523B1 (en) 2016-08-24
KR20150031223A (ko) 2015-03-23
EP2861523A1 (en) 2015-04-22
US9278849B2 (en) 2016-03-08

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