CN104334492B - 微传感器封装件及其装配的相关方法 - Google Patents

微传感器封装件及其装配的相关方法 Download PDF

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Publication number
CN104334492B
CN104334492B CN201380026772.6A CN201380026772A CN104334492B CN 104334492 B CN104334492 B CN 104334492B CN 201380026772 A CN201380026772 A CN 201380026772A CN 104334492 B CN104334492 B CN 104334492B
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CN
China
Prior art keywords
substrate
microsensor
bonding
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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CN201380026772.6A
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English (en)
Chinese (zh)
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CN104334492A (zh
Inventor
J·R·安德布林克
M·赛普拉克
D·P·亚历山大
T·N·里根
J·C·梅洛伊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Boeing Co
University of Florida Research Foundation Inc
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Boeing Co
University of Florida Research Foundation Inc
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Publication of CN104334492A publication Critical patent/CN104334492A/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0006—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/094—Feed-through, via
    • B81B2207/096—Feed-through, via through the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
  • Measuring Fluid Pressure (AREA)
CN201380026772.6A 2012-06-15 2013-03-18 微传感器封装件及其装配的相关方法 Active CN104334492B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/524,141 US9278849B2 (en) 2012-06-15 2012-06-15 Micro-sensor package and associated method of assembling the same
US13/524,141 2012-06-15
PCT/US2013/032811 WO2013187987A1 (en) 2012-06-15 2013-03-18 Micro-sensor package and associated method of assembling the same

Publications (2)

Publication Number Publication Date
CN104334492A CN104334492A (zh) 2015-02-04
CN104334492B true CN104334492B (zh) 2016-08-24

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380026772.6A Active CN104334492B (zh) 2012-06-15 2013-03-18 微传感器封装件及其装配的相关方法

Country Status (7)

Country Link
US (1) US9278849B2 (enExample)
EP (1) EP2861523B1 (enExample)
JP (1) JP6177320B2 (enExample)
KR (1) KR102029522B1 (enExample)
CN (1) CN104334492B (enExample)
CA (1) CA2870476C (enExample)
WO (1) WO2013187987A1 (enExample)

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US9146164B2 (en) * 2013-03-07 2015-09-29 Sensata Technologies, Inc. Pressure transducer substrate with self alignment feature
US10859448B2 (en) 2015-02-12 2020-12-08 University Of Florida Research Foundation, Incorporated MEMS capacitive shear sensor system having an interface circuit
JP6344266B2 (ja) * 2015-03-03 2018-06-20 株式会社デンソー 半導体装置およびその製造方法
KR101966491B1 (ko) 2016-03-16 2019-04-05 현대자동차주식회사 전해질 고갈을 방지할 수 있는 리튬 공기 전지
WO2017176506A1 (en) * 2016-04-05 2017-10-12 University Of Florida Research Foundation, Incorporated Flush-mount micromachined transducers
CN107290099B (zh) 2016-04-11 2021-06-08 森萨塔科技公司 压力传感器、用于压力传感器的插塞件和制造插塞件的方法
EP3236226B1 (en) 2016-04-20 2019-07-24 Sensata Technologies, Inc. Method of manufacturing a pressure sensor
US10545064B2 (en) 2017-05-04 2020-01-28 Sensata Technologies, Inc. Integrated pressure and temperature sensor
US10323998B2 (en) 2017-06-30 2019-06-18 Sensata Technologies, Inc. Fluid pressure sensor
US10724907B2 (en) 2017-07-12 2020-07-28 Sensata Technologies, Inc. Pressure sensor element with glass barrier material configured for increased capacitive response
US10557770B2 (en) 2017-09-14 2020-02-11 Sensata Technologies, Inc. Pressure sensor with improved strain gauge
CN111133768A (zh) * 2017-09-21 2020-05-08 美商楼氏电子有限公司 具有进入保护的麦克风中的提升mems器件
CN108190828B (zh) * 2018-02-07 2024-08-13 北京先通康桥医药科技有限公司 Mems传感器线阵、触诊探头及其制造方法
EP3680211B1 (en) * 2019-01-10 2024-03-06 TE Connectivity Solutions GmbH Sensor unit and method of interconnecting a substrate and a carrier
CN110610953B (zh) * 2019-09-30 2020-06-02 大连环宇安迪科技有限公司 一种相机感测组件及其制造方法

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US20080283991A1 (en) * 2007-05-14 2008-11-20 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Housed active microstructures with direct contacting to a substrate
CN101346815A (zh) * 2005-12-26 2009-01-14 京瓷株式会社 微小电子机械装置及其制造方法
US20090020419A1 (en) * 2007-07-20 2009-01-22 Hitachi, Ltd. Physical Sensor And Method Of Process
DE102008042258A1 (de) * 2008-09-22 2010-04-01 Robert Bosch Gmbh Verfahren zur Herstellung eines mikromechanischen Chips sowie ein Bauelement mit einem derartigen Chip

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CN1545484A (zh) * 2001-08-24 2004-11-10 Ф�ء�����˹��˾ 制造微机电构件的方法
US7534722B2 (en) * 2005-06-14 2009-05-19 John Trezza Back-to-front via process
KR100705007B1 (ko) * 2005-11-30 2007-04-09 매그나칩 반도체 유한회사 마이크로 센서 및 그 제조방법
JP5011820B2 (ja) * 2006-05-24 2012-08-29 オムロン株式会社 積層デバイス、およびその製造方法
JP2008085508A (ja) * 2006-09-26 2008-04-10 Matsushita Electric Works Ltd 音響センサの製造方法
JP5137059B2 (ja) * 2007-06-20 2013-02-06 新光電気工業株式会社 電子部品用パッケージ及びその製造方法と電子部品装置
TWI464835B (zh) * 2008-04-04 2014-12-11 藤倉股份有限公司 半導體封裝體及其製造方法
US7929376B2 (en) 2008-04-25 2011-04-19 The Boeing Company Method and apparatus for identifying noise sources
US7812418B2 (en) 2008-07-29 2010-10-12 Fortemedia, Inc Chip-scaled MEMS microphone package
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JP5325630B2 (ja) * 2009-03-27 2013-10-23 株式会社東芝 マイクロホン装置並びにその調整装置及び調整方法
JP5018852B2 (ja) * 2009-09-29 2012-09-05 セイコーエプソン株式会社 圧電デバイスの製造方法
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CN101346815A (zh) * 2005-12-26 2009-01-14 京瓷株式会社 微小电子机械装置及其制造方法
US20080283991A1 (en) * 2007-05-14 2008-11-20 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Housed active microstructures with direct contacting to a substrate
US20090020419A1 (en) * 2007-07-20 2009-01-22 Hitachi, Ltd. Physical Sensor And Method Of Process
DE102008042258A1 (de) * 2008-09-22 2010-04-01 Robert Bosch Gmbh Verfahren zur Herstellung eines mikromechanischen Chips sowie ein Bauelement mit einem derartigen Chip

Also Published As

Publication number Publication date
CA2870476C (en) 2016-11-29
WO2013187987A1 (en) 2013-12-19
JP2015527568A (ja) 2015-09-17
JP6177320B2 (ja) 2017-08-09
CA2870476A1 (en) 2013-12-19
US20130336511A1 (en) 2013-12-19
CN104334492A (zh) 2015-02-04
EP2861523B1 (en) 2016-08-24
KR102029522B1 (ko) 2019-10-07
KR20150031223A (ko) 2015-03-23
EP2861523A1 (en) 2015-04-22
US9278849B2 (en) 2016-03-08

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Applicant after: Boeing Company

Applicant after: Univ. of Florida Research Foundation Inc.

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