CA2870476C - Micro-sensor package and associated method of assembling the same - Google Patents
Micro-sensor package and associated method of assembling the same Download PDFInfo
- Publication number
- CA2870476C CA2870476C CA2870476A CA2870476A CA2870476C CA 2870476 C CA2870476 C CA 2870476C CA 2870476 A CA2870476 A CA 2870476A CA 2870476 A CA2870476 A CA 2870476A CA 2870476 C CA2870476 C CA 2870476C
- Authority
- CA
- Canada
- Prior art keywords
- micro
- substrate
- sensor
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 36
- 239000000758 substrate Substances 0.000 claims abstract description 130
- 239000007767 bonding agent Substances 0.000 claims description 38
- 239000000853 adhesive Substances 0.000 claims description 27
- 230000001070 adhesive effect Effects 0.000 claims description 27
- 238000004519 manufacturing process Methods 0.000 description 15
- QHZSDTDMQZPUKC-UHFFFAOYSA-N 3,5-dichlorobiphenyl Chemical compound ClC1=CC(Cl)=CC(C=2C=CC=CC=2)=C1 QHZSDTDMQZPUKC-UHFFFAOYSA-N 0.000 description 10
- 238000012360 testing method Methods 0.000 description 8
- 238000005259 measurement Methods 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 4
- 238000003491 array Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910000078 germane Inorganic materials 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 238000012356 Product development Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- -1 conductive (e.g. Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000009419 refurbishment Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0006—Interconnects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/09—Packages
- B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/09—Packages
- B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
- B81B2207/094—Feed-through, via
- B81B2207/096—Feed-through, via through the substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Micromachines (AREA)
- Pressure Sensors (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
- Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
- Measuring Fluid Pressure (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/524,141 US9278849B2 (en) | 2012-06-15 | 2012-06-15 | Micro-sensor package and associated method of assembling the same |
| US13/524,141 | 2012-06-15 | ||
| PCT/US2013/032811 WO2013187987A1 (en) | 2012-06-15 | 2013-03-18 | Micro-sensor package and associated method of assembling the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2870476A1 CA2870476A1 (en) | 2013-12-19 |
| CA2870476C true CA2870476C (en) | 2016-11-29 |
Family
ID=48045119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2870476A Active CA2870476C (en) | 2012-06-15 | 2013-03-18 | Micro-sensor package and associated method of assembling the same |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9278849B2 (enExample) |
| EP (1) | EP2861523B1 (enExample) |
| JP (1) | JP6177320B2 (enExample) |
| KR (1) | KR102029522B1 (enExample) |
| CN (1) | CN104334492B (enExample) |
| CA (1) | CA2870476C (enExample) |
| WO (1) | WO2013187987A1 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9146164B2 (en) * | 2013-03-07 | 2015-09-29 | Sensata Technologies, Inc. | Pressure transducer substrate with self alignment feature |
| US10859448B2 (en) | 2015-02-12 | 2020-12-08 | University Of Florida Research Foundation, Incorporated | MEMS capacitive shear sensor system having an interface circuit |
| JP6344266B2 (ja) * | 2015-03-03 | 2018-06-20 | 株式会社デンソー | 半導体装置およびその製造方法 |
| KR101966491B1 (ko) | 2016-03-16 | 2019-04-05 | 현대자동차주식회사 | 전해질 고갈을 방지할 수 있는 리튬 공기 전지 |
| WO2017176506A1 (en) * | 2016-04-05 | 2017-10-12 | University Of Florida Research Foundation, Incorporated | Flush-mount micromachined transducers |
| CN107290099B (zh) | 2016-04-11 | 2021-06-08 | 森萨塔科技公司 | 压力传感器、用于压力传感器的插塞件和制造插塞件的方法 |
| EP3236226B1 (en) | 2016-04-20 | 2019-07-24 | Sensata Technologies, Inc. | Method of manufacturing a pressure sensor |
| US10545064B2 (en) | 2017-05-04 | 2020-01-28 | Sensata Technologies, Inc. | Integrated pressure and temperature sensor |
| US10323998B2 (en) | 2017-06-30 | 2019-06-18 | Sensata Technologies, Inc. | Fluid pressure sensor |
| US10724907B2 (en) | 2017-07-12 | 2020-07-28 | Sensata Technologies, Inc. | Pressure sensor element with glass barrier material configured for increased capacitive response |
| US10557770B2 (en) | 2017-09-14 | 2020-02-11 | Sensata Technologies, Inc. | Pressure sensor with improved strain gauge |
| CN111133768A (zh) * | 2017-09-21 | 2020-05-08 | 美商楼氏电子有限公司 | 具有进入保护的麦克风中的提升mems器件 |
| CN108190828B (zh) * | 2018-02-07 | 2024-08-13 | 北京先通康桥医药科技有限公司 | Mems传感器线阵、触诊探头及其制造方法 |
| EP3680211B1 (en) * | 2019-01-10 | 2024-03-06 | TE Connectivity Solutions GmbH | Sensor unit and method of interconnecting a substrate and a carrier |
| CN110610953B (zh) * | 2019-09-30 | 2020-06-02 | 大连环宇安迪科技有限公司 | 一种相机感测组件及其制造方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1545484A (zh) * | 2001-08-24 | 2004-11-10 | Ф�ء�����˹��˾ | 制造微机电构件的方法 |
| US7534722B2 (en) * | 2005-06-14 | 2009-05-19 | John Trezza | Back-to-front via process |
| KR100705007B1 (ko) * | 2005-11-30 | 2007-04-09 | 매그나칩 반도체 유한회사 | 마이크로 센서 및 그 제조방법 |
| KR100995301B1 (ko) * | 2005-12-26 | 2010-11-19 | 쿄세라 코포레이션 | 마이크로 전자 기계 장치 및 그 제조방법 |
| JP5011820B2 (ja) * | 2006-05-24 | 2012-08-29 | オムロン株式会社 | 積層デバイス、およびその製造方法 |
| JP2008085508A (ja) * | 2006-09-26 | 2008-04-10 | Matsushita Electric Works Ltd | 音響センサの製造方法 |
| DE102008025599B4 (de) | 2007-05-14 | 2013-02-21 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Gehäuste aktive Mikrostrukturen mit Direktkontaktierung zu einem Substrat |
| JP5137059B2 (ja) * | 2007-06-20 | 2013-02-06 | 新光電気工業株式会社 | 電子部品用パッケージ及びその製造方法と電子部品装置 |
| JP4481323B2 (ja) * | 2007-07-20 | 2010-06-16 | 日立オートモティブシステムズ株式会社 | 物理量センサ及びその製造方法 |
| TWI464835B (zh) * | 2008-04-04 | 2014-12-11 | 藤倉股份有限公司 | 半導體封裝體及其製造方法 |
| US7929376B2 (en) | 2008-04-25 | 2011-04-19 | The Boeing Company | Method and apparatus for identifying noise sources |
| US7812418B2 (en) | 2008-07-29 | 2010-10-12 | Fortemedia, Inc | Chip-scaled MEMS microphone package |
| DE102008042258A1 (de) | 2008-09-22 | 2010-04-01 | Robert Bosch Gmbh | Verfahren zur Herstellung eines mikromechanischen Chips sowie ein Bauelement mit einem derartigen Chip |
| US8280694B2 (en) | 2008-11-03 | 2012-10-02 | The Boeing Company | Constant current power source electronics for a sensor |
| JP5325630B2 (ja) * | 2009-03-27 | 2013-10-23 | 株式会社東芝 | マイクロホン装置並びにその調整装置及び調整方法 |
| JP5018852B2 (ja) * | 2009-09-29 | 2012-09-05 | セイコーエプソン株式会社 | 圧電デバイスの製造方法 |
| US8580594B2 (en) * | 2011-08-09 | 2013-11-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of fabricating a semiconductor device having recessed bonding site |
-
2012
- 2012-06-15 US US13/524,141 patent/US9278849B2/en active Active
-
2013
- 2013-03-18 JP JP2015517247A patent/JP6177320B2/ja active Active
- 2013-03-18 CA CA2870476A patent/CA2870476C/en active Active
- 2013-03-18 WO PCT/US2013/032811 patent/WO2013187987A1/en not_active Ceased
- 2013-03-18 EP EP13713693.3A patent/EP2861523B1/en active Active
- 2013-03-18 KR KR1020147029413A patent/KR102029522B1/ko active Active
- 2013-03-18 CN CN201380026772.6A patent/CN104334492B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN104334492B (zh) | 2016-08-24 |
| WO2013187987A1 (en) | 2013-12-19 |
| JP2015527568A (ja) | 2015-09-17 |
| JP6177320B2 (ja) | 2017-08-09 |
| CA2870476A1 (en) | 2013-12-19 |
| US20130336511A1 (en) | 2013-12-19 |
| CN104334492A (zh) | 2015-02-04 |
| EP2861523B1 (en) | 2016-08-24 |
| KR102029522B1 (ko) | 2019-10-07 |
| KR20150031223A (ko) | 2015-03-23 |
| EP2861523A1 (en) | 2015-04-22 |
| US9278849B2 (en) | 2016-03-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request |
Effective date: 20141014 |