KR102019298B1 - 전사 방법 및 실장 방법 - Google Patents

전사 방법 및 실장 방법 Download PDF

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Publication number
KR102019298B1
KR102019298B1 KR1020187028537A KR20187028537A KR102019298B1 KR 102019298 B1 KR102019298 B1 KR 102019298B1 KR 1020187028537 A KR1020187028537 A KR 1020187028537A KR 20187028537 A KR20187028537 A KR 20187028537A KR 102019298 B1 KR102019298 B1 KR 102019298B1
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KR
South Korea
Prior art keywords
paste
electronic component
sheet
mounting portion
mounting
Prior art date
Application number
KR1020187028537A
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English (en)
Korean (ko)
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KR20190024869A (ko
Inventor
츠토무 카타시오
테루유키 우수이
카즈오 히라키
츠요시 타츠이와
Original Assignee
가부시키가이샤 스즈키
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Application filed by 가부시키가이샤 스즈키 filed Critical 가부시키가이샤 스즈키
Publication of KR20190024869A publication Critical patent/KR20190024869A/ko
Application granted granted Critical
Publication of KR102019298B1 publication Critical patent/KR102019298B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
KR1020187028537A 2016-07-04 2016-07-04 전사 방법 및 실장 방법 KR102019298B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2016/069808 WO2018008066A1 (ja) 2016-07-04 2016-07-04 転写方法および実装方法

Publications (2)

Publication Number Publication Date
KR20190024869A KR20190024869A (ko) 2019-03-08
KR102019298B1 true KR102019298B1 (ko) 2019-09-06

Family

ID=60912619

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187028537A KR102019298B1 (ko) 2016-07-04 2016-07-04 전사 방법 및 실장 방법

Country Status (6)

Country Link
JP (1) JP6543421B2 (zh)
KR (1) KR102019298B1 (zh)
CN (1) CN109315067B (zh)
SG (1) SG11201807190XA (zh)
TW (1) TWI710294B (zh)
WO (1) WO2018008066A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7023740B2 (ja) * 2018-02-22 2022-02-22 東レエンジニアリング株式会社 実装装置
KR102436955B1 (ko) * 2020-03-11 2022-08-26 넥스타테크놀로지 주식회사 실장 헤드 및 이를 포함하는 부품 실장 장치
KR102182856B1 (ko) * 2020-03-11 2020-11-25 넥스타테크놀로지 주식회사 부품 실장 장치
KR102391169B1 (ko) * 2020-03-11 2022-05-03 넥스타테크놀로지 주식회사 실장 헤드 및 이를 포함하는 부품 실장 장치
KR102271499B1 (ko) * 2020-10-16 2021-07-01 넥스타테크놀로지 주식회사 실장 헤드 및 이를 포함하는 부품 실장 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004235442A (ja) 2003-01-30 2004-08-19 Sharp Corp 表面実装電子部品の実装方法および接着剤供給装置
JP2013172131A (ja) 2012-02-23 2013-09-02 Panasonic Corp 電子部品搭載方法
JP2014127615A (ja) 2012-12-27 2014-07-07 Panasonic Corp ペースト転写ユニットおよび電子部品実装装置ならびに転写膜厚測定方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03120790A (ja) * 1989-10-03 1991-05-22 Toshiba Corp 配線基板の接続装置
JPH09181491A (ja) * 1995-12-27 1997-07-11 Toshiba Corp 半導体装置の実装方法及び実装構造
JP2002226822A (ja) * 2001-01-30 2002-08-14 Three M Innovative Properties Co 光線活性化型接着フィルムを用いた基材接着方法
JP3914732B2 (ja) * 2001-10-02 2007-05-16 鹿児島日本電気株式会社 回路基板の接続構造及び該接続構造を備えた液晶表示装置並びに液晶表示装置の実装方法
JP2008177351A (ja) * 2007-01-18 2008-07-31 Fujitsu Ltd 電子装置および電子装置の製造方法
JP2009158791A (ja) * 2007-12-27 2009-07-16 Ohashi Seisakusho:Kk 緩衝材テープ供給装置の連装装置
JP2011082242A (ja) 2009-10-05 2011-04-21 Panasonic Corp 電子部品実装装置及び電子部品実装方法
JP5370278B2 (ja) * 2010-06-09 2013-12-18 パナソニック株式会社 テープ貼付け装置およびテープ貼付け方法
JP5630639B2 (ja) * 2010-07-07 2014-11-26 住友電気工業株式会社 フィルム状導電性接着剤
JP5025825B2 (ja) * 2010-07-28 2012-09-12 積水化学工業株式会社 絶縁性粒子付き導電性粒子、異方性導電材料及び接続構造体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004235442A (ja) 2003-01-30 2004-08-19 Sharp Corp 表面実装電子部品の実装方法および接着剤供給装置
JP2013172131A (ja) 2012-02-23 2013-09-02 Panasonic Corp 電子部品搭載方法
JP2014127615A (ja) 2012-12-27 2014-07-07 Panasonic Corp ペースト転写ユニットおよび電子部品実装装置ならびに転写膜厚測定方法

Also Published As

Publication number Publication date
TW201803436A (zh) 2018-01-16
JPWO2018008066A1 (ja) 2019-04-18
WO2018008066A1 (ja) 2018-01-11
CN109315067B (zh) 2019-12-24
CN109315067A (zh) 2019-02-05
KR20190024869A (ko) 2019-03-08
TWI710294B (zh) 2020-11-11
SG11201807190XA (en) 2019-01-30
JP6543421B2 (ja) 2019-07-10

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