KR102013759B1 - 플럭스, 땜납 조성물 및 전자 회로 실장 기판의 제조 방법 - Google Patents

플럭스, 땜납 조성물 및 전자 회로 실장 기판의 제조 방법 Download PDF

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Publication number
KR102013759B1
KR102013759B1 KR1020147021777A KR20147021777A KR102013759B1 KR 102013759 B1 KR102013759 B1 KR 102013759B1 KR 1020147021777 A KR1020147021777 A KR 1020147021777A KR 20147021777 A KR20147021777 A KR 20147021777A KR 102013759 B1 KR102013759 B1 KR 102013759B1
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South Korea
Prior art keywords
flux
solder
formula
rosin
mass
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KR1020147021777A
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Korean (ko)
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KR20140133512A (ko
Inventor
겐지 아라이
미쓰야스 후루사와
준이치 아오키
마유미 다카다
무네히코 나카쓰마
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가부시키가이샤 코키
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020147021777A 2012-03-12 2013-03-11 플럭스, 땜납 조성물 및 전자 회로 실장 기판의 제조 방법 Active KR102013759B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2012-054833 2012-03-12
JP2012054833A JP5531188B2 (ja) 2012-03-12 2012-03-12 フラックス、はんだ組成物および電子回路実装基板の製造方法
PCT/JP2013/056660 WO2013137200A1 (ja) 2012-03-12 2013-03-11 フラックス、はんだ組成物及び電子回路実装基板の製造方法

Publications (2)

Publication Number Publication Date
KR20140133512A KR20140133512A (ko) 2014-11-19
KR102013759B1 true KR102013759B1 (ko) 2019-08-23

Family

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KR1020147021777A Active KR102013759B1 (ko) 2012-03-12 2013-03-11 플럭스, 땜납 조성물 및 전자 회로 실장 기판의 제조 방법

Country Status (6)

Country Link
US (1) US9609762B2 (https=)
EP (1) EP2826589B1 (https=)
JP (1) JP5531188B2 (https=)
KR (1) KR102013759B1 (https=)
CN (1) CN104159701B (https=)
WO (1) WO2013137200A1 (https=)

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JP5812230B2 (ja) * 2013-08-12 2015-11-11 千住金属工業株式会社 フラックス及びソルダペースト
JP6342208B2 (ja) * 2014-04-28 2018-06-13 株式会社タムラ製作所 はんだ付け用フラックス組成物およびそれを用いた電子基板
CN104476007B (zh) * 2014-12-17 2015-10-28 东莞永安科技有限公司 一种高熔点无铅无卤焊锡膏及其制备方法
ES2775586T3 (es) * 2014-12-25 2020-07-27 Kuraray Co Caucho de dieno líquido modificado, y composición de resina que contiene dicho caucho de dieno líquido modificado
TWI713498B (zh) 2015-03-24 2020-12-21 美商羅門哈斯公司 核-殼水性乳膠
JP6310893B2 (ja) * 2015-09-30 2018-04-11 株式会社タムラ製作所 フラックス組成物、はんだ組成物、および電子基板の製造方法
JP6268507B1 (ja) * 2017-06-07 2018-01-31 千住金属工業株式会社 やに入りはんだ用フラックス、フラックスコートはんだ用フラックス、やに入りはんだ、及びフラックスコートはんだ
JP6635986B2 (ja) * 2017-07-12 2020-01-29 株式会社タムラ製作所 はんだ組成物および電子基板
JP6477842B1 (ja) * 2017-11-24 2019-03-06 千住金属工業株式会社 フラックス及びソルダペースト
JP6540789B1 (ja) * 2017-12-29 2019-07-10 千住金属工業株式会社 樹脂組成物及びはんだ付け用フラックス
JP6540788B1 (ja) * 2017-12-29 2019-07-10 千住金属工業株式会社 フラックス及びソルダペースト
CN111655421B (zh) * 2018-01-16 2022-07-26 千住金属工业株式会社 助焊剂和焊膏
JP6544498B1 (ja) * 2019-01-15 2019-07-17 千住金属工業株式会社 フラックス及びソルダペースト
JP6540833B1 (ja) * 2018-01-17 2019-07-10 千住金属工業株式会社 フラックス及びソルダペースト
US11833622B2 (en) * 2018-08-10 2023-12-05 Koki Company Limited Flux and solder paste
US11618109B2 (en) * 2020-06-30 2023-04-04 Electronics And Telecommunications Research Institute Wire for electric bonding
CN118417761B (zh) * 2024-05-09 2025-09-09 北京达博长城锡焊料有限公司 5g通讯线束焊接用锡丝助焊剂及其制备方法和锡丝

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JPH11179589A (ja) * 1997-12-24 1999-07-06 Nippon Handa Kk フラックス
JP3886650B2 (ja) 1998-08-03 2007-02-28 内橋エステック株式会社 フラックス及びそのフラックスを使用したはんだペ−スト並びにはんだ付け方法
JP3656213B2 (ja) 1999-12-01 2005-06-08 タムラ化研株式会社 リフローはんだ付用ソルダーペースト組成物及び回路基板
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JP2007222932A (ja) 2006-02-27 2007-09-06 Arakawa Chem Ind Co Ltd プリコート用鉛フリーソルダーペースト、プリコート用鉛フリーソルダーペーストに用いるフラックス

Also Published As

Publication number Publication date
US20150102090A1 (en) 2015-04-16
EP2826589A1 (en) 2015-01-21
CN104159701B (zh) 2017-03-01
WO2013137200A1 (ja) 2013-09-19
JP5531188B2 (ja) 2014-06-25
EP2826589A4 (en) 2016-04-20
US9609762B2 (en) 2017-03-28
EP2826589B1 (en) 2017-05-31
KR20140133512A (ko) 2014-11-19
CN104159701A (zh) 2014-11-19
JP2013188761A (ja) 2013-09-26

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