JP5531188B2 - フラックス、はんだ組成物および電子回路実装基板の製造方法 - Google Patents

フラックス、はんだ組成物および電子回路実装基板の製造方法 Download PDF

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Publication number
JP5531188B2
JP5531188B2 JP2012054833A JP2012054833A JP5531188B2 JP 5531188 B2 JP5531188 B2 JP 5531188B2 JP 2012054833 A JP2012054833 A JP 2012054833A JP 2012054833 A JP2012054833 A JP 2012054833A JP 5531188 B2 JP5531188 B2 JP 5531188B2
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JP
Japan
Prior art keywords
solder
flux
rosin
electronic circuit
polybutadiene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012054833A
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English (en)
Japanese (ja)
Other versions
JP2013188761A (ja
JP2013188761A5 (https=
Inventor
健司 新井
光康 古澤
淳一 青木
舞由美 高田
宗彦 中妻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koki Co Ltd
Original Assignee
Koki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2012054833A priority Critical patent/JP5531188B2/ja
Application filed by Koki Co Ltd filed Critical Koki Co Ltd
Priority to PCT/JP2013/056660 priority patent/WO2013137200A1/ja
Priority to CN201380013308.3A priority patent/CN104159701B/zh
Priority to EP13761926.8A priority patent/EP2826589B1/en
Priority to US14/384,204 priority patent/US9609762B2/en
Priority to KR1020147021777A priority patent/KR102013759B1/ko
Publication of JP2013188761A publication Critical patent/JP2013188761A/ja
Publication of JP2013188761A5 publication Critical patent/JP2013188761A5/ja
Application granted granted Critical
Publication of JP5531188B2 publication Critical patent/JP5531188B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2012054833A 2012-03-12 2012-03-12 フラックス、はんだ組成物および電子回路実装基板の製造方法 Active JP5531188B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2012054833A JP5531188B2 (ja) 2012-03-12 2012-03-12 フラックス、はんだ組成物および電子回路実装基板の製造方法
CN201380013308.3A CN104159701B (zh) 2012-03-12 2013-03-11 助焊剂、焊料组合物和电子电路安装基板的制造方法
EP13761926.8A EP2826589B1 (en) 2012-03-12 2013-03-11 Flux, solder composition and method for producing electronic circuit mounting substrate
US14/384,204 US9609762B2 (en) 2012-03-12 2013-03-11 Flux, solder composition, and method for manufacturing electronic circuit mounted substrate
PCT/JP2013/056660 WO2013137200A1 (ja) 2012-03-12 2013-03-11 フラックス、はんだ組成物及び電子回路実装基板の製造方法
KR1020147021777A KR102013759B1 (ko) 2012-03-12 2013-03-11 플럭스, 땜납 조성물 및 전자 회로 실장 기판의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012054833A JP5531188B2 (ja) 2012-03-12 2012-03-12 フラックス、はんだ組成物および電子回路実装基板の製造方法

Publications (3)

Publication Number Publication Date
JP2013188761A JP2013188761A (ja) 2013-09-26
JP2013188761A5 JP2013188761A5 (https=) 2014-02-20
JP5531188B2 true JP5531188B2 (ja) 2014-06-25

Family

ID=49161107

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012054833A Active JP5531188B2 (ja) 2012-03-12 2012-03-12 フラックス、はんだ組成物および電子回路実装基板の製造方法

Country Status (6)

Country Link
US (1) US9609762B2 (https=)
EP (1) EP2826589B1 (https=)
JP (1) JP5531188B2 (https=)
KR (1) KR102013759B1 (https=)
CN (1) CN104159701B (https=)
WO (1) WO2013137200A1 (https=)

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JP5812230B2 (ja) * 2013-08-12 2015-11-11 千住金属工業株式会社 フラックス及びソルダペースト
JP6342208B2 (ja) * 2014-04-28 2018-06-13 株式会社タムラ製作所 はんだ付け用フラックス組成物およびそれを用いた電子基板
CN104476007B (zh) * 2014-12-17 2015-10-28 东莞永安科技有限公司 一种高熔点无铅无卤焊锡膏及其制备方法
ES2775586T3 (es) * 2014-12-25 2020-07-27 Kuraray Co Caucho de dieno líquido modificado, y composición de resina que contiene dicho caucho de dieno líquido modificado
TWI713498B (zh) 2015-03-24 2020-12-21 美商羅門哈斯公司 核-殼水性乳膠
JP6310893B2 (ja) * 2015-09-30 2018-04-11 株式会社タムラ製作所 フラックス組成物、はんだ組成物、および電子基板の製造方法
JP6268507B1 (ja) * 2017-06-07 2018-01-31 千住金属工業株式会社 やに入りはんだ用フラックス、フラックスコートはんだ用フラックス、やに入りはんだ、及びフラックスコートはんだ
JP6635986B2 (ja) * 2017-07-12 2020-01-29 株式会社タムラ製作所 はんだ組成物および電子基板
JP6477842B1 (ja) * 2017-11-24 2019-03-06 千住金属工業株式会社 フラックス及びソルダペースト
JP6540789B1 (ja) * 2017-12-29 2019-07-10 千住金属工業株式会社 樹脂組成物及びはんだ付け用フラックス
JP6540788B1 (ja) * 2017-12-29 2019-07-10 千住金属工業株式会社 フラックス及びソルダペースト
CN111655421B (zh) * 2018-01-16 2022-07-26 千住金属工业株式会社 助焊剂和焊膏
JP6544498B1 (ja) * 2019-01-15 2019-07-17 千住金属工業株式会社 フラックス及びソルダペースト
JP6540833B1 (ja) * 2018-01-17 2019-07-10 千住金属工業株式会社 フラックス及びソルダペースト
US11833622B2 (en) * 2018-08-10 2023-12-05 Koki Company Limited Flux and solder paste
US11618109B2 (en) * 2020-06-30 2023-04-04 Electronics And Telecommunications Research Institute Wire for electric bonding
CN118417761B (zh) * 2024-05-09 2025-09-09 北京达博长城锡焊料有限公司 5g通讯线束焊接用锡丝助焊剂及其制备方法和锡丝

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JPH11179589A (ja) * 1997-12-24 1999-07-06 Nippon Handa Kk フラックス
JP3886650B2 (ja) 1998-08-03 2007-02-28 内橋エステック株式会社 フラックス及びそのフラックスを使用したはんだペ−スト並びにはんだ付け方法
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Also Published As

Publication number Publication date
US20150102090A1 (en) 2015-04-16
EP2826589A1 (en) 2015-01-21
CN104159701B (zh) 2017-03-01
WO2013137200A1 (ja) 2013-09-19
EP2826589A4 (en) 2016-04-20
US9609762B2 (en) 2017-03-28
KR102013759B1 (ko) 2019-08-23
EP2826589B1 (en) 2017-05-31
KR20140133512A (ko) 2014-11-19
CN104159701A (zh) 2014-11-19
JP2013188761A (ja) 2013-09-26

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