KR101991965B1 - 반도체 칩을 실장하기 위한 장치 - Google Patents

반도체 칩을 실장하기 위한 장치 Download PDF

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Publication number
KR101991965B1
KR101991965B1 KR1020120133579A KR20120133579A KR101991965B1 KR 101991965 B1 KR101991965 B1 KR 101991965B1 KR 1020120133579 A KR1020120133579 A KR 1020120133579A KR 20120133579 A KR20120133579 A KR 20120133579A KR 101991965 B1 KR101991965 B1 KR 101991965B1
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KR
South Korea
Prior art keywords
support table
semiconductor chip
substrate
head
carriage
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KR1020120133579A
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English (en)
Korean (ko)
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KR20130058628A (ko
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뤼디 그뤼터
구이도 주터
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에섹 아게
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75701—Means for aligning in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75702—Means for aligning in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75801—Lower part of the bonding apparatus, e.g. XY table
    • H01L2224/75804—Translational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75822—Rotational mechanism
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020120133579A 2011-11-25 2012-11-23 반도체 칩을 실장하기 위한 장치 Active KR101991965B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH1886/11 2011-11-25
CH01886/11A CH705802B1 (de) 2011-11-25 2011-11-25 Einrichtung für die Montage von Halbleiterchips.

Publications (2)

Publication Number Publication Date
KR20130058628A KR20130058628A (ko) 2013-06-04
KR101991965B1 true KR101991965B1 (ko) 2019-06-21

Family

ID=48366057

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120133579A Active KR101991965B1 (ko) 2011-11-25 2012-11-23 반도체 칩을 실장하기 위한 장치

Country Status (10)

Country Link
US (1) US9603294B2 (enExample)
JP (1) JP6217958B2 (enExample)
KR (1) KR101991965B1 (enExample)
CN (1) CN103137526B (enExample)
CH (1) CH705802B1 (enExample)
DE (1) DE102012110604B4 (enExample)
FR (1) FR2983344B1 (enExample)
MY (1) MY160071A (enExample)
SG (1) SG190511A1 (enExample)
TW (1) TWI555110B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015038074A1 (en) * 2013-09-13 2015-03-19 Orion Systems Integration Pte Ltd System and method for positioning a semiconductor chip with a bond head, thermal bonding system and method
US9136243B2 (en) * 2013-12-03 2015-09-15 Kulicke And Soffa Industries, Inc. Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
EP3177128B1 (en) * 2014-08-01 2020-10-14 FUJI Corporation Component mounting method and component mounting device
DE102016113328B4 (de) 2015-08-31 2018-07-19 Besi Switzerland Ag Verfahren für die Montage von mit Bumps versehenen Halbleiterchips auf Substratplätzen eines Substrats
CH711536B1 (de) * 2015-08-31 2019-02-15 Besi Switzerland Ag Verfahren für die Montage von mit Bumps versehenen Halbleiterchips auf Substratplätzen eines Substrats.
DE102015220746A1 (de) * 2015-10-23 2017-04-27 Ersa Gmbh Verfahren und Vorrichtung zur Platzierung elektronischer Bauteile
JP7164314B2 (ja) * 2017-04-28 2022-11-01 ベシ スウィッツァーランド エージー 部品を基板上に搭載する装置及び方法
JP7340774B2 (ja) * 2019-05-23 2023-09-08 パナソニックＩｐマネジメント株式会社 部品圧着装置および部品圧着方法
CN113471107B (zh) * 2021-06-29 2022-04-19 深圳新益昌科技股份有限公司 固晶机及固晶方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179517A (ja) 2002-11-28 2004-06-24 Shinkawa Ltd ボンディング装置、ボンディング方法及びボンディングプログラム
US20070069340A1 (en) 2005-09-29 2007-03-29 Semiconductor Energy Laboratory Co., Ltd. Pickup device and pickup method
JP2010016271A (ja) 2008-07-07 2010-01-21 Panasonic Corp 電子部品ボンディング装置
JP2010123770A (ja) 2008-11-20 2010-06-03 Panasonic Corp 部品実装装置および部品実装方法

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US5251266A (en) * 1990-08-27 1993-10-05 Sierra Research And Technology, Inc. System for placement and mounting of fine pitch integrated circuit devices using a split mirror assembly
US5799858A (en) * 1995-09-16 1998-09-01 Samsung Aerospace Industries, Ltd. Die bonding device
KR0175267B1 (ko) * 1995-09-30 1999-04-01 김광호 회전운동을 하는 픽업 툴을 구비하는 다이 본딩 장치
KR100319546B1 (ko) 1996-02-29 2002-02-19 알파젬 아게 부품을수용,배향및조립하는방법및장치
JP2002271093A (ja) * 2001-03-07 2002-09-20 Fuji Mach Mfg Co Ltd 電気部品装着システム
JP2003086611A (ja) 2001-09-07 2003-03-20 Heiwa Kinzoku Kogyo Kk Ｉｃダイボンド装置
JP3636127B2 (ja) * 2001-10-12 2005-04-06 松下電器産業株式会社 電子部品実装装置および電子部品実装方法
KR20030046306A (ko) 2001-12-05 2003-06-12 에섹 트레이딩 에스에이 반도체 칩을 설치하기 위한 장치
SG104292A1 (en) 2002-01-07 2004-06-21 Advance Systems Automation Ltd Flip chip bonder and method therefor
US7033842B2 (en) * 2002-03-25 2006-04-25 Matsushita Electric Industrial Co., Ltd. Electronic component mounting apparatus and electronic component mounting method
EP1480507B1 (de) 2003-05-21 2006-07-19 Unaxis International Trading Ltd. Halbleiter-Montageeinrichtung
TWI231561B (en) 2003-05-21 2005-04-21 Esec Trading Sa Apparatus for mounting semiconductors
JP4156460B2 (ja) * 2003-07-09 2008-09-24 Ｔｄｋ株式会社 ワークのピックアップ方法及びその装置、実装機
WO2005041630A1 (en) * 2003-10-24 2005-05-06 Matsushita Electric Industrial Co. Ltd. Electronic component mounting apparatus and electronic component mounting method
JP4111160B2 (ja) * 2004-03-26 2008-07-02 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
EP2005808B1 (de) 2006-04-12 2010-03-17 Kulicke & Soffa Die Bonding GmbH Verfahren und vorrichtung zum ablegen von elektronischen bauteilen, insbesondere halbleiterchips auf einem substrat
KR20080041471A (ko) 2006-11-07 2008-05-13 삼성전자주식회사 다이 본더
CH698718B1 (de) 2007-01-31 2009-10-15 Oerlikon Assembly Equipment Ag Vorrichtung für die Montage eines Flipchips auf einem Substrat.
WO2009047214A2 (en) 2007-10-09 2009-04-16 Oerlikon Assembly Equipment Ag, Steinhausen Method for picking up semiconductor chips from a wafer table and mounting the removed semiconductor chips on a substrate
TW200931543A (en) 2007-12-03 2009-07-16 Panasonic Corp Chip mounting system
CN101842000B (zh) * 2009-03-19 2014-04-30 鸿富锦精密工业（深圳）有限公司 贴附装置及使用该贴附装置的贴附方法
JP4766144B2 (ja) * 2009-04-08 2011-09-07 パナソニック株式会社 電子部品実装装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179517A (ja) 2002-11-28 2004-06-24 Shinkawa Ltd ボンディング装置、ボンディング方法及びボンディングプログラム
US20070069340A1 (en) 2005-09-29 2007-03-29 Semiconductor Energy Laboratory Co., Ltd. Pickup device and pickup method
JP2010016271A (ja) 2008-07-07 2010-01-21 Panasonic Corp 電子部品ボンディング装置
JP2010123770A (ja) 2008-11-20 2010-06-03 Panasonic Corp 部品実装装置および部品実装方法

Also Published As

Publication number Publication date
US20130133188A1 (en) 2013-05-30
CN103137526B (zh) 2017-12-19
FR2983344B1 (fr) 2019-01-25
MY160071A (en) 2017-02-15
CH705802A1 (de) 2013-05-31
DE102012110604B4 (de) 2024-05-23
TW201330154A (zh) 2013-07-16
DE102012110604A1 (de) 2013-05-29
FR2983344A1 (fr) 2013-05-31
SG190511A1 (en) 2013-06-28
JP2013115428A (ja) 2013-06-10
CH705802B1 (de) 2016-04-15
US9603294B2 (en) 2017-03-21
JP6217958B2 (ja) 2017-10-25
KR20130058628A (ko) 2013-06-04
CN103137526A (zh) 2013-06-05
TWI555110B (zh) 2016-10-21

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