CN103137526B - 用于安装半导体芯片的设备 - Google Patents

用于安装半导体芯片的设备 Download PDF

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Publication number
CN103137526B
CN103137526B CN201210483718.1A CN201210483718A CN103137526B CN 103137526 B CN103137526 B CN 103137526B CN 201210483718 A CN201210483718 A CN 201210483718A CN 103137526 B CN103137526 B CN 103137526B
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CN
China
Prior art keywords
pick
support table
head
semiconductor chips
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201210483718.1A
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English (en)
Chinese (zh)
Other versions
CN103137526A (zh
Inventor
鲁埃迪·格吕特尔
吉多·祖特尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Besi Switzerland AG
Original Assignee
Esec AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esec AG filed Critical Esec AG
Publication of CN103137526A publication Critical patent/CN103137526A/zh
Application granted granted Critical
Publication of CN103137526B publication Critical patent/CN103137526B/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75701—Means for aligning in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75702—Means for aligning in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75801—Lower part of the bonding apparatus, e.g. XY table
    • H01L2224/75804—Translational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75822—Rotational mechanism
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201210483718.1A 2011-11-25 2012-11-23 用于安装半导体芯片的设备 Active CN103137526B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH01886/11 2011-11-25
CH01886/11A CH705802B1 (de) 2011-11-25 2011-11-25 Einrichtung für die Montage von Halbleiterchips.

Publications (2)

Publication Number Publication Date
CN103137526A CN103137526A (zh) 2013-06-05
CN103137526B true CN103137526B (zh) 2017-12-19

Family

ID=48366057

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210483718.1A Active CN103137526B (zh) 2011-11-25 2012-11-23 用于安装半导体芯片的设备

Country Status (10)

Country Link
US (1) US9603294B2 (enExample)
JP (1) JP6217958B2 (enExample)
KR (1) KR101991965B1 (enExample)
CN (1) CN103137526B (enExample)
CH (1) CH705802B1 (enExample)
DE (1) DE102012110604B4 (enExample)
FR (1) FR2983344B1 (enExample)
MY (1) MY160071A (enExample)
SG (1) SG190511A1 (enExample)
TW (1) TWI555110B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015038074A1 (en) * 2013-09-13 2015-03-19 Orion Systems Integration Pte Ltd System and method for positioning a semiconductor chip with a bond head, thermal bonding system and method
US9136243B2 (en) * 2013-12-03 2015-09-15 Kulicke And Soffa Industries, Inc. Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
JP6426742B2 (ja) * 2014-08-01 2018-11-21 株式会社Ｆｕｊｉ 部品装着方法および部品装着装置
DE102016113328B4 (de) 2015-08-31 2018-07-19 Besi Switzerland Ag Verfahren für die Montage von mit Bumps versehenen Halbleiterchips auf Substratplätzen eines Substrats
CH711536B1 (de) * 2015-08-31 2019-02-15 Besi Switzerland Ag Verfahren für die Montage von mit Bumps versehenen Halbleiterchips auf Substratplätzen eines Substrats.
DE102015220746A1 (de) * 2015-10-23 2017-04-27 Ersa Gmbh Verfahren und Vorrichtung zur Platzierung elektronischer Bauteile
JP7164314B2 (ja) 2017-04-28 2022-11-01 ベシ スウィッツァーランド エージー 部品を基板上に搭載する装置及び方法
JP7340774B2 (ja) * 2019-05-23 2023-09-08 パナソニックＩｐマネジメント株式会社 部品圧着装置および部品圧着方法
CN113471107B (zh) * 2021-06-29 2022-04-19 深圳新益昌科技股份有限公司 固晶机及固晶方法

Citations (1)

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Publication number Priority date Publication date Assignee Title
CN101740418A (zh) * 2008-11-20 2010-06-16 松下电器产业株式会社 元件安装设备和元件安装方法

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JPH09186180A (ja) * 1995-09-16 1997-07-15 Samsung Aerospace Ind Ltd ダイボンディング装置
KR0175267B1 (ko) * 1995-09-30 1999-04-01 김광호 회전운동을 하는 픽업 툴을 구비하는 다이 본딩 장치
WO1997032460A1 (de) * 1996-02-29 1997-09-04 Alphasem Ag Verfahren und vorrichtung zum aufnehmen, orientieren und montieren von bauelementen
JP2002271093A (ja) * 2001-03-07 2002-09-20 Fuji Mach Mfg Co Ltd 電気部品装着システム
JP2003086611A (ja) 2001-09-07 2003-03-20 Heiwa Kinzoku Kogyo Kk Ｉｃダイボンド装置
JP3636127B2 (ja) * 2001-10-12 2005-04-06 松下電器産業株式会社 電子部品実装装置および電子部品実装方法
KR20030046306A (ko) 2001-12-05 2003-06-12 에섹 트레이딩 에스에이 반도체 칩을 설치하기 위한 장치
SG104292A1 (en) 2002-01-07 2004-06-21 Advance Systems Automation Ltd Flip chip bonder and method therefor
US7033842B2 (en) * 2002-03-25 2006-04-25 Matsushita Electric Industrial Co., Ltd. Electronic component mounting apparatus and electronic component mounting method
JP2004179517A (ja) * 2002-11-28 2004-06-24 Shinkawa Ltd ボンディング装置、ボンディング方法及びボンディングプログラム
TWI231561B (en) 2003-05-21 2005-04-21 Esec Trading Sa Apparatus for mounting semiconductors
EP1480507B1 (de) 2003-05-21 2006-07-19 Unaxis International Trading Ltd. Halbleiter-Montageeinrichtung
JP4156460B2 (ja) * 2003-07-09 2008-09-24 Ｔｄｋ株式会社 ワークのピックアップ方法及びその装置、実装機
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JP4111160B2 (ja) * 2004-03-26 2008-07-02 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
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JP4946989B2 (ja) * 2008-07-07 2012-06-06 パナソニック株式会社 電子部品ボンディング装置
CN101842000B (zh) * 2009-03-19 2014-04-30 鸿富锦精密工业（深圳）有限公司 贴附装置及使用该贴附装置的贴附方法
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Also Published As

Publication number Publication date
CH705802A1 (de) 2013-05-31
TW201330154A (zh) 2013-07-16
KR101991965B1 (ko) 2019-06-21
TWI555110B (zh) 2016-10-21
CH705802B1 (de) 2016-04-15
FR2983344B1 (fr) 2019-01-25
SG190511A1 (en) 2013-06-28
JP6217958B2 (ja) 2017-10-25
US20130133188A1 (en) 2013-05-30
DE102012110604B4 (de) 2024-05-23
CN103137526A (zh) 2013-06-05
FR2983344A1 (fr) 2013-05-31
JP2013115428A (ja) 2013-06-10
DE102012110604A1 (de) 2013-05-29
KR20130058628A (ko) 2013-06-04
MY160071A (en) 2017-02-15
US9603294B2 (en) 2017-03-21

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