KR101973395B1 - 발광 모듈 - Google Patents

발광 모듈 Download PDF

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Publication number
KR101973395B1
KR101973395B1 KR1020120087167A KR20120087167A KR101973395B1 KR 101973395 B1 KR101973395 B1 KR 101973395B1 KR 1020120087167 A KR1020120087167 A KR 1020120087167A KR 20120087167 A KR20120087167 A KR 20120087167A KR 101973395 B1 KR101973395 B1 KR 101973395B1
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KR
South Korea
Prior art keywords
light emitting
ceramic substrate
heat dissipation
hole
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020120087167A
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English (en)
Korean (ko)
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KR20140020529A (ko
Inventor
김병목
노영진
정수정
강보희
히로시 코다이라
유이치로 탄다
사토시 오제키
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020120087167A priority Critical patent/KR101973395B1/ko
Priority to JP2013098976A priority patent/JP6401435B2/ja
Priority to US13/924,167 priority patent/US9893259B2/en
Priority to EP22165623.4A priority patent/EP4040518A1/en
Priority to EP13177955.5A priority patent/EP2696379B1/en
Priority to CN201310346581.XA priority patent/CN103574354B/zh
Priority to CN201710194634.9A priority patent/CN107023760A/zh
Publication of KR20140020529A publication Critical patent/KR20140020529A/ko
Priority to US15/863,146 priority patent/US10388841B2/en
Application granted granted Critical
Publication of KR101973395B1 publication Critical patent/KR101973395B1/ko
Assigned to 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 reassignment 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 권리의 전부이전등록 Assignors: 엘지이노텍 주식회사
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
KR1020120087167A 2012-08-09 2012-08-09 발광 모듈 Expired - Fee Related KR101973395B1 (ko)

Priority Applications (8)

Application Number Priority Date Filing Date Title
KR1020120087167A KR101973395B1 (ko) 2012-08-09 2012-08-09 발광 모듈
JP2013098976A JP6401435B2 (ja) 2012-08-09 2013-05-09 発光パッケージ
US13/924,167 US9893259B2 (en) 2012-08-09 2013-06-21 Light emitting package
EP13177955.5A EP2696379B1 (en) 2012-08-09 2013-07-25 Light emitting device
EP22165623.4A EP4040518A1 (en) 2012-08-09 2013-07-25 Light emitting device
CN201310346581.XA CN103574354B (zh) 2012-08-09 2013-08-09 发光器件
CN201710194634.9A CN107023760A (zh) 2012-08-09 2013-08-09 发光器件
US15/863,146 US10388841B2 (en) 2012-08-09 2018-01-05 Light emitting package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120087167A KR101973395B1 (ko) 2012-08-09 2012-08-09 발광 모듈

Publications (2)

Publication Number Publication Date
KR20140020529A KR20140020529A (ko) 2014-02-19
KR101973395B1 true KR101973395B1 (ko) 2019-04-29

Family

ID=48874869

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120087167A Expired - Fee Related KR101973395B1 (ko) 2012-08-09 2012-08-09 발광 모듈

Country Status (5)

Country Link
US (2) US9893259B2 (https=)
EP (2) EP4040518A1 (https=)
JP (1) JP6401435B2 (https=)
KR (1) KR101973395B1 (https=)
CN (2) CN103574354B (https=)

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KR101973395B1 (ko) * 2012-08-09 2019-04-29 엘지이노텍 주식회사 발광 모듈
EP3547379A1 (en) * 2014-03-14 2019-10-02 Citizen Electronics Co., Ltd. Light emitting apparatus
KR102252156B1 (ko) * 2014-07-08 2021-05-17 엘지이노텍 주식회사 발광 소자 패키지
US9481572B2 (en) * 2014-07-17 2016-11-01 Texas Instruments Incorporated Optical electronic device and method of fabrication
DE112015006331T5 (de) * 2015-03-19 2017-12-14 Osram Opto Semiconductors Gmbh Fenster zum Bedecken eines optoelektronischen Halbleiterchips, mehrere Fenster umfassende Scheibe, Verfahren zur Herstellung von Fenstern und optoelektronisches Halbleiterbauelement
EP3297020A4 (en) * 2015-05-13 2018-11-21 Mitsubishi Electric Corporation Semiconductor module
US10317018B2 (en) * 2015-09-01 2019-06-11 Lg Innotek Co., Ltd. Lighting device
JP2017073489A (ja) * 2015-10-08 2017-04-13 エヌイーシー ショット コンポーネンツ株式会社 メタル−ガラスリッドおよびそれを利用したｄｕｖ−ｌｅｄ装置
JP6889533B2 (ja) * 2015-10-21 2021-06-18 スタンレー電気株式会社 紫外線発光装置及び紫外線照射装置
JP6712855B2 (ja) * 2015-12-02 2020-06-24 スタンレー電気株式会社 紫外線発光装置及び紫外線照射装置
CN108633317B (zh) * 2016-02-12 2021-07-09 Lg 伊诺特有限公司 发光器件封装和包括该发光器件封装的照明设备
US10864377B2 (en) 2016-12-01 2020-12-15 Medtronic, Inc. Pacing mode switching in a ventricular pacemaker
US10207116B2 (en) 2016-12-01 2019-02-19 Medtronic, Inc. Pacing mode switching in a ventricular pacemaker
JP2019096778A (ja) * 2017-11-24 2019-06-20 京セラ株式会社 蓋体および光学装置
JP6687008B2 (ja) * 2017-11-30 2020-04-22 日亜化学工業株式会社 発光装置
FR3075466B1 (fr) 2017-12-15 2020-05-29 Stmicroelectronics (Grenoble 2) Sas Couvercle de boitier de circuit electronique
FR3075465B1 (fr) * 2017-12-15 2020-03-27 Stmicroelectronics (Grenoble 2) Sas Couvercle de boitier de circuit electronique
JP7109930B2 (ja) * 2018-02-05 2022-08-01 日機装株式会社 流体殺菌装置
US10438975B1 (en) * 2018-03-13 2019-10-08 Innolux Corporation Display device and method for preparing the same
TWI840397B (zh) * 2018-08-22 2024-05-01 日商Ａｄｙ股份有限公司 紫外線元件套組
JP7405031B2 (ja) * 2020-07-16 2023-12-26 日本電気硝子株式会社 電子装置及び電子装置の製造方法
CN113707616A (zh) * 2021-07-19 2021-11-26 中国电子科技集团公司第十三研究所 盖板及陶瓷封装结构
WO2023042792A1 (ja) * 2021-09-16 2023-03-23 旭化成株式会社 紫外線照射装置
JP2025041057A (ja) * 2023-09-13 2025-03-26 ウシオ電機株式会社 光源モジュール、光源モジュールの製造方法

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Also Published As

Publication number Publication date
JP2014036226A (ja) 2014-02-24
EP2696379B1 (en) 2022-05-18
EP2696379A3 (en) 2016-01-20
CN107023760A (zh) 2017-08-08
US9893259B2 (en) 2018-02-13
US20140042482A1 (en) 2014-02-13
CN103574354B (zh) 2018-06-01
EP4040518A1 (en) 2022-08-10
US20180130934A1 (en) 2018-05-10
CN103574354A (zh) 2014-02-12
JP6401435B2 (ja) 2018-10-10
KR20140020529A (ko) 2014-02-19
EP2696379A2 (en) 2014-02-12
US10388841B2 (en) 2019-08-20

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