KR101947891B1 - 기판 처리 장치 및 간극 세정 방법 - Google Patents

기판 처리 장치 및 간극 세정 방법 Download PDF

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Publication number
KR101947891B1
KR101947891B1 KR1020170019461A KR20170019461A KR101947891B1 KR 101947891 B1 KR101947891 B1 KR 101947891B1 KR 1020170019461 A KR1020170019461 A KR 1020170019461A KR 20170019461 A KR20170019461 A KR 20170019461A KR 101947891 B1 KR101947891 B1 KR 101947891B1
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KR
South Korea
Prior art keywords
cleaning liquid
substrate
cleaning
discharge port
nozzle
Prior art date
Application number
KR1020170019461A
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English (en)
Korean (ko)
Other versions
KR20170096954A (ko
Inventor
도시히토 모리오카
Original Assignee
가부시키가이샤 스크린 홀딩스
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Application filed by 가부시키가이샤 스크린 홀딩스 filed Critical 가부시키가이샤 스크린 홀딩스
Publication of KR20170096954A publication Critical patent/KR20170096954A/ko
Application granted granted Critical
Publication of KR101947891B1 publication Critical patent/KR101947891B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/02307—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020170019461A 2016-02-17 2017-02-13 기판 처리 장치 및 간극 세정 방법 KR101947891B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016028311 2016-02-17
JPJP-P-2016-028311 2016-02-17
JPJP-P-2017-011643 2017-01-25
JP2017011643A JP6929652B2 (ja) 2016-02-17 2017-01-25 基板処理装置および間隙洗浄方法

Publications (2)

Publication Number Publication Date
KR20170096954A KR20170096954A (ko) 2017-08-25
KR101947891B1 true KR101947891B1 (ko) 2019-02-13

Family

ID=59682463

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170019461A KR101947891B1 (ko) 2016-02-17 2017-02-13 기판 처리 장치 및 간극 세정 방법

Country Status (3)

Country Link
JP (1) JP6929652B2 (ja)
KR (1) KR101947891B1 (ja)
TW (1) TWI653104B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6979852B2 (ja) * 2017-10-26 2021-12-15 株式会社Ｓｃｒｅｅｎホールディングス 処理液供給装置、基板処理装置、および処理液供給方法
JP6955971B2 (ja) * 2017-11-10 2021-10-27 株式会社ディスコ 洗浄ノズル
KR102093641B1 (ko) * 2018-06-22 2020-04-23 주식회사 로보스타 파티클제거팁 및 그것을 이용한 인덱스형 파티클 제거장치
CN112713110A (zh) * 2020-12-28 2021-04-27 北京北方华创微电子装备有限公司 半导体清洗设备

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2703424B2 (ja) * 1991-08-07 1998-01-26 シャープ株式会社 洗浄装置
KR20030079134A (ko) * 2002-04-02 2003-10-10 삼성전자주식회사 반도체 코팅 장비의 노즐
KR200286810Y1 (ko) * 2002-05-01 2002-08-24 한국디엔에스 주식회사 스핀 스크러버
JP4191009B2 (ja) * 2003-11-05 2008-12-03 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4890067B2 (ja) * 2006-03-28 2012-03-07 大日本スクリーン製造株式会社 基板処理装置および基板搬送方法
JP2008244115A (ja) * 2007-03-27 2008-10-09 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP5666414B2 (ja) * 2011-10-27 2015-02-12 東京エレクトロン株式会社 液処理装置、液処理方法および記憶媒体
JP6111104B2 (ja) * 2013-03-15 2017-04-05 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板洗浄乾燥方法および基板現像方法

Also Published As

Publication number Publication date
JP2017147440A (ja) 2017-08-24
JP6929652B2 (ja) 2021-09-01
TW201736009A (zh) 2017-10-16
KR20170096954A (ko) 2017-08-25
TWI653104B (zh) 2019-03-11

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