KR101900771B1 - 도포 현상 장치, 도포 현상 방법 및 기억 매체 - Google Patents

도포 현상 장치, 도포 현상 방법 및 기억 매체 Download PDF

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Publication number
KR101900771B1
KR101900771B1 KR1020137017552A KR20137017552A KR101900771B1 KR 101900771 B1 KR101900771 B1 KR 101900771B1 KR 1020137017552 A KR1020137017552 A KR 1020137017552A KR 20137017552 A KR20137017552 A KR 20137017552A KR 101900771 B1 KR101900771 B1 KR 101900771B1
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KR
South Korea
Prior art keywords
substrate
wafers
processing block
time
maintenance
Prior art date
Application number
KR1020137017552A
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English (en)
Korean (ko)
Other versions
KR20140002697A (ko
Inventor
게이조오 구로이와
구니에 오가타
노부아키 마츠오카
노부유키 다사키
아키라 미야타
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20140002697A publication Critical patent/KR20140002697A/ko
Application granted granted Critical
Publication of KR101900771B1 publication Critical patent/KR101900771B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Coating Apparatus (AREA)
KR1020137017552A 2011-01-05 2011-12-26 도포 현상 장치, 도포 현상 방법 및 기억 매체 KR101900771B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011000756 2011-01-05
JPJP-P-2011-000756 2011-01-05
PCT/JP2011/080046 WO2012093609A1 (ja) 2011-01-05 2011-12-26 塗布現像装置、塗布現像方法及び記憶媒体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020187026627A Division KR101980508B1 (ko) 2011-01-05 2011-12-26 도포 현상 장치, 도포 현상 방법 및 기억 매체

Publications (2)

Publication Number Publication Date
KR20140002697A KR20140002697A (ko) 2014-01-08
KR101900771B1 true KR101900771B1 (ko) 2018-09-20

Family

ID=46457468

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020137017552A KR101900771B1 (ko) 2011-01-05 2011-12-26 도포 현상 장치, 도포 현상 방법 및 기억 매체
KR1020187026627A KR101980508B1 (ko) 2011-01-05 2011-12-26 도포 현상 장치, 도포 현상 방법 및 기억 매체

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020187026627A KR101980508B1 (ko) 2011-01-05 2011-12-26 도포 현상 장치, 도포 현상 방법 및 기억 매체

Country Status (4)

Country Link
JP (1) JP5696658B2 (zh)
KR (2) KR101900771B1 (zh)
TW (2) TWI497226B (zh)
WO (1) WO2012093609A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6005604B2 (ja) * 2012-09-13 2016-10-12 東京エレクトロン株式会社 現像処理装置
CN104597726A (zh) * 2013-10-30 2015-05-06 沈阳芯源微电子设备有限公司 涂胶显影机的工艺模块结构及布局方法
KR20220047346A (ko) * 2019-08-19 2022-04-15 도쿄엘렉트론가부시키가이샤 도포, 현상 장치
KR102556992B1 (ko) * 2020-09-10 2023-07-20 세메스 주식회사 세정 지그, 이를 포함하는 기판 처리 장치, 그리고 기판 처리 장치의 세정 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002043208A (ja) 2000-07-24 2002-02-08 Tokyo Electron Ltd 塗布現像処理方法
JP2005057290A (ja) * 2003-08-04 2005-03-03 Asml Netherlands Bv 基板処理のための方法、コンピュータ・プログラム製品および装置
JP2008277528A (ja) * 2007-04-27 2008-11-13 Tokyo Electron Ltd 基板の処理方法、基板の処理システム及びコンピュータ読み取り可能な記憶媒体

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3280618B2 (ja) * 1998-03-24 2002-05-13 東京エレクトロン株式会社 熱処理装置
JP4566574B2 (ja) * 2004-02-13 2010-10-20 大日本スクリーン製造株式会社 基板処理装置
JP4356936B2 (ja) * 2005-01-21 2009-11-04 東京エレクトロン株式会社 塗布、現像装置及びその方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002043208A (ja) 2000-07-24 2002-02-08 Tokyo Electron Ltd 塗布現像処理方法
JP2005057290A (ja) * 2003-08-04 2005-03-03 Asml Netherlands Bv 基板処理のための方法、コンピュータ・プログラム製品および装置
JP2008277528A (ja) * 2007-04-27 2008-11-13 Tokyo Electron Ltd 基板の処理方法、基板の処理システム及びコンピュータ読み取り可能な記憶媒体

Also Published As

Publication number Publication date
KR20180104780A (ko) 2018-09-21
TW201250393A (en) 2012-12-16
TWI560530B (zh) 2016-12-01
KR20140002697A (ko) 2014-01-08
JP5696658B2 (ja) 2015-04-08
JP2012156497A (ja) 2012-08-16
TWI497226B (zh) 2015-08-21
WO2012093609A1 (ja) 2012-07-12
TW201600935A (zh) 2016-01-01
KR101980508B1 (ko) 2019-05-20

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