TWI560530B - - Google Patents

Info

Publication number
TWI560530B
TWI560530B TW104117415A TW104117415A TWI560530B TW I560530 B TWI560530 B TW I560530B TW 104117415 A TW104117415 A TW 104117415A TW 104117415 A TW104117415 A TW 104117415A TW I560530 B TWI560530 B TW I560530B
Authority
TW
Taiwan
Application number
TW104117415A
Other versions
TW201600935A (zh
Inventor
Keizou Kuroiwa
Kunie Ogata
Nobuaki Matsuoka
Nobuyuki Tasaki
Akira Miyata
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201600935A publication Critical patent/TW201600935A/zh
Application granted granted Critical
Publication of TWI560530B publication Critical patent/TWI560530B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Coating Apparatus (AREA)
TW104117415A 2011-01-05 2011-12-07 塗佈、顯像裝置，塗佈、顯像方法及記憶媒體 TW201600935A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011000756 2011-01-05

Publications (2)

Publication Number Publication Date
TW201600935A TW201600935A (zh) 2016-01-01
TWI560530B true TWI560530B (zh) 2016-12-01

Family

ID=46457468

Family Applications (2)

Application Number Title Priority Date Filing Date
TW100145046A TWI497226B (zh) 2011-01-05 2011-12-07 Coating, developing device, coating, developing method and memory medium
TW104117415A TW201600935A (zh) 2011-01-05 2011-12-07 塗佈、顯像裝置，塗佈、顯像方法及記憶媒體

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW100145046A TWI497226B (zh) 2011-01-05 2011-12-07 Coating, developing device, coating, developing method and memory medium

Country Status (4)

Country Link
JP (1) JP5696658B2 (zh)
KR (2) KR101900771B1 (zh)
TW (2) TWI497226B (zh)
WO (1) WO2012093609A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6005604B2 (ja) * 2012-09-13 2016-10-12 東京エレクトロン株式会社 現像処理装置
CN104597726A (zh) * 2013-10-30 2015-05-06 沈阳芯源微电子设备有限公司 涂胶显影机的工艺模块结构及布局方法
KR20220047346A (ko) * 2019-08-19 2022-04-15 도쿄엘렉트론가부시키가이샤 도포, 현상 장치
KR102556992B1 (ko) * 2020-09-10 2023-07-20 세메스 주식회사 세정 지그, 이를 포함하는 기판 처리 장치, 그리고 기판 처리 장치의 세정 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005228917A (ja) * 2004-02-13 2005-08-25 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2008277528A (ja) * 2007-04-27 2008-11-13 Tokyo Electron Ltd 基板の処理方法、基板の処理システム及びコンピュータ読み取り可能な記憶媒体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3280618B2 (ja) * 1998-03-24 2002-05-13 東京エレクトロン株式会社 熱処理装置
JP3593496B2 (ja) * 2000-07-24 2004-11-24 東京エレクトロン株式会社 塗布現像処理装置
US6879866B2 (en) * 2003-08-04 2005-04-12 Asml Netherlands B.V. Method, computer program product and apparatus for scheduling maintenance actions in a substrate processing system
JP4356936B2 (ja) * 2005-01-21 2009-11-04 東京エレクトロン株式会社 塗布、現像装置及びその方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005228917A (ja) * 2004-02-13 2005-08-25 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2008277528A (ja) * 2007-04-27 2008-11-13 Tokyo Electron Ltd 基板の処理方法、基板の処理システム及びコンピュータ読み取り可能な記憶媒体

Also Published As

Publication number Publication date
KR20180104780A (ko) 2018-09-21
TW201250393A (en) 2012-12-16
KR20140002697A (ko) 2014-01-08
JP5696658B2 (ja) 2015-04-08
JP2012156497A (ja) 2012-08-16
TWI497226B (zh) 2015-08-21
KR101900771B1 (ko) 2018-09-20
WO2012093609A1 (ja) 2012-07-12
TW201600935A (zh) 2016-01-01
KR101980508B1 (ko) 2019-05-20

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