KR101886923B1 - 다이본더 및 반도체 장치의 제조 방법 - Google Patents

다이본더 및 반도체 장치의 제조 방법 Download PDF

Info

Publication number
KR101886923B1
KR101886923B1 KR1020160106879A KR20160106879A KR101886923B1 KR 101886923 B1 KR101886923 B1 KR 101886923B1 KR 1020160106879 A KR1020160106879 A KR 1020160106879A KR 20160106879 A KR20160106879 A KR 20160106879A KR 101886923 B1 KR101886923 B1 KR 101886923B1
Authority
KR
South Korea
Prior art keywords
bonding
die
bonding head
shaft
drive shaft
Prior art date
Application number
KR1020160106879A
Other languages
English (en)
Korean (ko)
Other versions
KR20170038654A (ko
Inventor
류이찌 다까노
히로시 마끼
Original Assignee
파스포드 테크놀로지 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 파스포드 테크놀로지 주식회사 filed Critical 파스포드 테크놀로지 주식회사
Publication of KR20170038654A publication Critical patent/KR20170038654A/ko
Application granted granted Critical
Publication of KR101886923B1 publication Critical patent/KR101886923B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4885—Wire-like parts or pins
    • H01L21/4896—Mechanical treatment, e.g. cutting, bending
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Wire Bonding (AREA)
KR1020160106879A 2015-09-30 2016-08-23 다이본더 및 반도체 장치의 제조 방법 KR101886923B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015194093A JP6573813B2 (ja) 2015-09-30 2015-09-30 ダイボンダおよび半導体装置の製造方法
JPJP-P-2015-194093 2015-09-30

Publications (2)

Publication Number Publication Date
KR20170038654A KR20170038654A (ko) 2017-04-07
KR101886923B1 true KR101886923B1 (ko) 2018-08-08

Family

ID=58417342

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160106879A KR101886923B1 (ko) 2015-09-30 2016-08-23 다이본더 및 반도체 장치의 제조 방법

Country Status (4)

Country Link
JP (1) JP6573813B2 (ja)
KR (1) KR101886923B1 (ja)
CN (1) CN106558524B (ja)
TW (1) TWI613738B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6889614B2 (ja) * 2017-05-31 2021-06-18 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
KR101969555B1 (ko) * 2017-08-18 2019-04-16 주식회사 한라정밀엔지니어링 반도체 칩 분리 장치 및 반도체 칩 분리 방법
JP6967411B2 (ja) * 2017-09-19 2021-11-17 ファスフォードテクノロジ株式会社 半導体製造装置、半導体装置の製造方法およびコレット
JP6978340B2 (ja) * 2018-02-19 2021-12-08 ファスフォードテクノロジ株式会社 実装装置および半導体装置の製造方法
TWI744850B (zh) * 2019-04-15 2021-11-01 日商新川股份有限公司 封裝裝置
JP7291586B2 (ja) * 2019-09-19 2023-06-15 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
CN113873781B (zh) * 2021-12-06 2022-03-11 常州铭赛机器人科技股份有限公司 贴装头
CN114783938B (zh) * 2022-03-09 2023-05-05 恩纳基智能科技无锡有限公司 一种能自动上下料的高精度贴装设备及其使用方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100251515B1 (ko) 1996-05-07 2000-04-15 모리시타 요이찌 다이-본딩 장치
JP2002009093A (ja) 2000-06-22 2002-01-11 Nidec Copal Corp ダイボンディング装置及び吸着ヘッド用昇降機構
WO2015075832A1 (ja) 2013-11-25 2015-05-28 キヤノンマシナリー株式会社 ボンディング装置およびボンディング方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6208419B1 (en) * 1998-11-18 2001-03-27 Fuji Photo Film Co., Ltd. Method of and apparatus for bonding light-emitting element
KR20020066795A (ko) * 2001-02-13 2002-08-21 디엔씨엔지니어링 주식회사 배속 정밀위치 결정장치
JP2004063696A (ja) * 2002-07-26 2004-02-26 Akio Sugiyama フリップチップボンダー
CN100579353C (zh) * 2006-06-29 2010-01-06 北京航空航天大学 高速全自动贴片机阵列式贴装头
ATE531468T1 (de) * 2007-09-10 2011-11-15 Samsys Gmbh Vorrichtung zum universellen automatischen zuführen und entladen von werkstücken für werkzeugmaschine
JP2010147246A (ja) * 2008-12-18 2010-07-01 Nec Corp 部品実装装置及び部品実装方法
JP2011233578A (ja) 2010-04-23 2011-11-17 Hitachi High-Tech Instruments Co Ltd 反動吸収装置及び半導体組立装置
US8857486B2 (en) * 2011-05-04 2014-10-14 Asm Technology Singapore Pte. Ltd. Flip arm module for a bonding apparatus incorporating changeable collet tools
JP2013026267A (ja) * 2011-07-15 2013-02-04 Hitachi High-Tech Instruments Co Ltd ２軸駆動機構及びダイボンダ並びにダイボンダの運転方法
JP5815345B2 (ja) * 2011-09-16 2015-11-17 ファスフォードテクノロジ株式会社 ダイボンダ及びボンディング方法
JP5886085B2 (ja) * 2012-03-06 2016-03-16 住友重機械工業株式会社 ステージ装置およびステージ装置の制御方法
CN103025075B (zh) * 2012-12-06 2015-04-29 深圳市硕安迪科技开发有限公司 一种高速贴片头

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100251515B1 (ko) 1996-05-07 2000-04-15 모리시타 요이찌 다이-본딩 장치
JP2002009093A (ja) 2000-06-22 2002-01-11 Nidec Copal Corp ダイボンディング装置及び吸着ヘッド用昇降機構
WO2015075832A1 (ja) 2013-11-25 2015-05-28 キヤノンマシナリー株式会社 ボンディング装置およびボンディング方法

Also Published As

Publication number Publication date
KR20170038654A (ko) 2017-04-07
JP6573813B2 (ja) 2019-09-11
CN106558524A (zh) 2017-04-05
TWI613738B (zh) 2018-02-01
TW201724287A (zh) 2017-07-01
CN106558524B (zh) 2019-07-05
JP2017069418A (ja) 2017-04-06

Similar Documents

Publication Publication Date Title
KR101886923B1 (ko) 다이본더 및 반도체 장치의 제조 방법
KR101838456B1 (ko) 다이 본더, 본딩 방법 및 반도체 장치의 제조 방법
US10910248B2 (en) Electronic component mounting apparatus
JP6513226B2 (ja) 電子部品ハンドリングユニット
US10199254B2 (en) Method and system for transferring semiconductor devices from a wafer to a carrier structure
CN108346585B (zh) 半导体制造装置及半导体器件的制造方法
US20080301931A1 (en) Method And Apparatus For Mounting Semiconductor Chips
WO2010032427A1 (ja) 部品実装装置及び部品実装方法
JP6717630B2 (ja) 電子部品の実装装置
JP2019047089A (ja) 半導体製造装置および半導体装置の製造方法
CN107895705B (zh) 一种芯片倒置贴装设备
JP2010135574A (ja) 移載装置
US11410870B2 (en) Die attach systems, and methods of attaching a die to a substrate
KR20200119971A (ko) 반도체 본딩 장치 및 그 방법
KR101422401B1 (ko) 발광 소자 칩 본딩 장치
KR101657531B1 (ko) 다이 이송 유닛, 이를 포함하는 다이 본딩 장치 및 다이 이송 방법
KR100639400B1 (ko) 리드 픽 앤 플레이스 장비
KR102150542B1 (ko) 실장 장치, 및 반도체 장치의 제조 방법
JP6200737B2 (ja) ダイボンダ用ディッピング機構及びフリップチップボンダ
CN113451176B (zh) 电子零件的安装装置
CN117912986A (zh) 旋转裸片台装置以及包括其的裸片键合机
CN117936408A (zh) 裸片键合机以及裸片键合机的缓冲装置
JP2020074483A (ja) 電子部品の実装装置
JPH11297718A (ja) ダイピックアップ方法およびそれを用いた半導体製造装置
JP2014060234A (ja) ダイボンダ及びボンディング方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant