KR101886923B1 - 다이본더 및 반도체 장치의 제조 방법 - Google Patents

다이본더 및 반도체 장치의 제조 방법 Download PDF

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KR101886923B1
KR101886923B1 KR1020160106879A KR20160106879A KR101886923B1 KR 101886923 B1 KR101886923 B1 KR 101886923B1 KR 1020160106879 A KR1020160106879 A KR 1020160106879A KR 20160106879 A KR20160106879 A KR 20160106879A KR 101886923 B1 KR101886923 B1 KR 101886923B1
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bonding
die
bonding head
shaft
drive shaft
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KR20170038654A (ko
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류이찌 다까노
히로시 마끼
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파스포드 테크놀로지 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4885—Wire-like parts or pins
    • H01L21/4896—Mechanical treatment, e.g. cutting, bending
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Wire Bonding (AREA)
KR1020160106879A 2015-09-30 2016-08-23 다이본더 및 반도체 장치의 제조 방법 Active KR101886923B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2015-194093 2015-09-30
JP2015194093A JP6573813B2 (ja) 2015-09-30 2015-09-30 ダイボンダおよび半導体装置の製造方法

Publications (2)

Publication Number Publication Date
KR20170038654A KR20170038654A (ko) 2017-04-07
KR101886923B1 true KR101886923B1 (ko) 2018-08-08

Family

ID=58417342

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KR1020160106879A Active KR101886923B1 (ko) 2015-09-30 2016-08-23 다이본더 및 반도체 장치의 제조 방법

Country Status (4)

Country Link
JP (1) JP6573813B2 (enrdf_load_stackoverflow)
KR (1) KR101886923B1 (enrdf_load_stackoverflow)
CN (1) CN106558524B (enrdf_load_stackoverflow)
TW (1) TWI613738B (enrdf_load_stackoverflow)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6889614B2 (ja) * 2017-05-31 2021-06-18 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
KR101969555B1 (ko) * 2017-08-18 2019-04-16 주식회사 한라정밀엔지니어링 반도체 칩 분리 장치 및 반도체 칩 분리 방법
JP6967411B2 (ja) * 2017-09-19 2021-11-17 ファスフォードテクノロジ株式会社 半導体製造装置、半導体装置の製造方法およびコレット
CH714351A1 (de) * 2017-11-17 2019-05-31 Besi Switzerland AG Bondkopf für die Montage von Bauelementen.
JP6978340B2 (ja) * 2018-02-19 2021-12-08 ファスフォードテクノロジ株式会社 実装装置および半導体装置の製造方法
TWI744850B (zh) * 2019-04-15 2021-11-01 日商新川股份有限公司 封裝裝置
JP7291586B2 (ja) 2019-09-19 2023-06-15 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
CN113873781B (zh) * 2021-12-06 2022-03-11 常州铭赛机器人科技股份有限公司 贴装头
CN114783938B (zh) * 2022-03-09 2023-05-05 恩纳基智能科技无锡有限公司 一种能自动上下料的高精度贴装设备及其使用方法
CN114678303A (zh) * 2022-04-01 2022-06-28 江苏科瑞恩自动化科技有限公司 一种晶圆环取料贴装装置及晶圆环取料贴装方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100251515B1 (ko) 1996-05-07 2000-04-15 모리시타 요이찌 다이-본딩 장치
JP2002009093A (ja) 2000-06-22 2002-01-11 Nidec Copal Corp ダイボンディング装置及び吸着ヘッド用昇降機構
WO2015075832A1 (ja) 2013-11-25 2015-05-28 キヤノンマシナリー株式会社 ボンディング装置およびボンディング方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1003212A3 (en) * 1998-11-18 2003-11-19 Fuji Photo Film Co., Ltd. Method of and apparatus for bonding light-emitting element
KR20020066795A (ko) * 2001-02-13 2002-08-21 디엔씨엔지니어링 주식회사 배속 정밀위치 결정장치
JP2004063696A (ja) * 2002-07-26 2004-02-26 Akio Sugiyama フリップチップボンダー
CN100579353C (zh) * 2006-06-29 2010-01-06 北京航空航天大学 高速全自动贴片机阵列式贴装头
ATE531468T1 (de) * 2007-09-10 2011-11-15 Samsys Gmbh Vorrichtung zum universellen automatischen zuführen und entladen von werkstücken für werkzeugmaschine
JP2010147246A (ja) * 2008-12-18 2010-07-01 Nec Corp 部品実装装置及び部品実装方法
JP2011233578A (ja) 2010-04-23 2011-11-17 Hitachi High-Tech Instruments Co Ltd 反動吸収装置及び半導体組立装置
US8857486B2 (en) * 2011-05-04 2014-10-14 Asm Technology Singapore Pte. Ltd. Flip arm module for a bonding apparatus incorporating changeable collet tools
JP2013026267A (ja) * 2011-07-15 2013-02-04 Hitachi High-Tech Instruments Co Ltd ２軸駆動機構及びダイボンダ並びにダイボンダの運転方法
JP5815345B2 (ja) * 2011-09-16 2015-11-17 ファスフォードテクノロジ株式会社 ダイボンダ及びボンディング方法
JP5886085B2 (ja) * 2012-03-06 2016-03-16 住友重機械工業株式会社 ステージ装置およびステージ装置の制御方法
CN103025075B (zh) * 2012-12-06 2015-04-29 深圳市硕安迪科技开发有限公司 一种高速贴片头

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100251515B1 (ko) 1996-05-07 2000-04-15 모리시타 요이찌 다이-본딩 장치
JP2002009093A (ja) 2000-06-22 2002-01-11 Nidec Copal Corp ダイボンディング装置及び吸着ヘッド用昇降機構
WO2015075832A1 (ja) 2013-11-25 2015-05-28 キヤノンマシナリー株式会社 ボンディング装置およびボンディング方法

Also Published As

Publication number Publication date
CN106558524B (zh) 2019-07-05
TWI613738B (zh) 2018-02-01
CN106558524A (zh) 2017-04-05
JP6573813B2 (ja) 2019-09-11
KR20170038654A (ko) 2017-04-07
TW201724287A (zh) 2017-07-01
JP2017069418A (ja) 2017-04-06

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