KR101823506B1 - 발광 소자 패키지 및 이를 구비한 라이트 유닛 - Google Patents

발광 소자 패키지 및 이를 구비한 라이트 유닛 Download PDF

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Publication number
KR101823506B1
KR101823506B1 KR1020110064097A KR20110064097A KR101823506B1 KR 101823506 B1 KR101823506 B1 KR 101823506B1 KR 1020110064097 A KR1020110064097 A KR 1020110064097A KR 20110064097 A KR20110064097 A KR 20110064097A KR 101823506 B1 KR101823506 B1 KR 101823506B1
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South Korea
Prior art keywords
lead frame
light emitting
emitting device
disposed
bonding
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Expired - Fee Related
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KR1020110064097A
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English (en)
Korean (ko)
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KR20130007170A (ko
Inventor
이동용
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엘지이노텍 주식회사
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Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020110064097A priority Critical patent/KR101823506B1/ko
Priority to US13/346,320 priority patent/US8455891B2/en
Priority to JP2012049714A priority patent/JP5959884B2/ja
Priority to CN201610963896.2A priority patent/CN106876376B/zh
Priority to CN201210066563.1A priority patent/CN102856316B/zh
Priority to CN201610961544.3A priority patent/CN106887426B/zh
Priority to EP17204875.3A priority patent/EP3309835B1/en
Priority to EP15193283.7A priority patent/EP3001454B8/en
Priority to EP12160149.6A priority patent/EP2541598B1/en
Publication of KR20130007170A publication Critical patent/KR20130007170A/ko
Priority to US13/891,014 priority patent/US9136451B2/en
Priority to US14/853,081 priority patent/US9515058B2/en
Priority to JP2016123265A priority patent/JP6117412B2/ja
Priority to US15/299,307 priority patent/US9728525B2/en
Priority to JP2017055268A priority patent/JP6400764B2/ja
Priority to US15/631,784 priority patent/US10147857B2/en
Application granted granted Critical
Publication of KR101823506B1 publication Critical patent/KR101823506B1/ko
Priority to JP2018166200A priority patent/JP2018207125A/ja
Priority to US16/178,219 priority patent/US10559734B2/en
Assigned to 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 reassignment 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 권리의 전부이전등록 Assignors: 엘지이노텍 주식회사
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

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  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Packaging Frangible Articles (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
KR1020110064097A 2011-06-29 2011-06-29 발광 소자 패키지 및 이를 구비한 라이트 유닛 Expired - Fee Related KR101823506B1 (ko)

Priority Applications (17)

Application Number Priority Date Filing Date Title
KR1020110064097A KR101823506B1 (ko) 2011-06-29 2011-06-29 발광 소자 패키지 및 이를 구비한 라이트 유닛
US13/346,320 US8455891B2 (en) 2011-06-29 2012-01-09 Light emitting device package and light unit including the same
JP2012049714A JP5959884B2 (ja) 2011-06-29 2012-03-06 発光素子パッケージ
CN201610963896.2A CN106876376B (zh) 2011-06-29 2012-03-14 发光器件封装件及包括其的光单元
CN201210066563.1A CN102856316B (zh) 2011-06-29 2012-03-14 发光器件封装件及包括其的光单元
CN201610961544.3A CN106887426B (zh) 2011-06-29 2012-03-14 发光器件封装件及包括其的光单元
EP17204875.3A EP3309835B1 (en) 2011-06-29 2012-03-19 Light emitting device package
EP15193283.7A EP3001454B8 (en) 2011-06-29 2012-03-19 Light emitting device package
EP12160149.6A EP2541598B1 (en) 2011-06-29 2012-03-19 Light emitting device package
US13/891,014 US9136451B2 (en) 2011-06-29 2013-05-09 Light emitting device package and light unit including the same
US14/853,081 US9515058B2 (en) 2011-06-29 2015-09-14 Light emitting device package and light unit including the same
JP2016123265A JP6117412B2 (ja) 2011-06-29 2016-06-22 発光素子パッケージ
US15/299,307 US9728525B2 (en) 2011-06-29 2016-10-20 Light emitting device package and light unit including the same
JP2017055268A JP6400764B2 (ja) 2011-06-29 2017-03-22 発光素子パッケージ
US15/631,784 US10147857B2 (en) 2011-06-29 2017-06-23 Light emitting device package and light unit including the same
JP2018166200A JP2018207125A (ja) 2011-06-29 2018-09-05 発光素子パッケージ
US16/178,219 US10559734B2 (en) 2011-06-29 2018-11-01 Light emitting device package and light unit including the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110064097A KR101823506B1 (ko) 2011-06-29 2011-06-29 발광 소자 패키지 및 이를 구비한 라이트 유닛

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020180008667A Division KR101946289B1 (ko) 2018-01-24 2018-01-24 발광 소자 패키지 및 이를 구비한 라이트 유닛

Publications (2)

Publication Number Publication Date
KR20130007170A KR20130007170A (ko) 2013-01-18
KR101823506B1 true KR101823506B1 (ko) 2018-01-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110064097A Expired - Fee Related KR101823506B1 (ko) 2011-06-29 2011-06-29 발광 소자 패키지 및 이를 구비한 라이트 유닛

Country Status (5)

Country Link
US (6) US8455891B2 (https=)
EP (3) EP3001454B8 (https=)
JP (4) JP5959884B2 (https=)
KR (1) KR101823506B1 (https=)
CN (3) CN102856316B (https=)

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KR101824886B1 (ko) * 2011-03-25 2018-03-14 엘지이노텍 주식회사 발광소자 패키지
KR101823506B1 (ko) 2011-06-29 2018-01-30 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 라이트 유닛
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TWI523277B (zh) * 2013-07-12 2016-02-21 葳天科技股份有限公司 White light emitting diode module with ultraviolet light
CN104425479B (zh) * 2013-08-22 2018-03-30 展晶科技(深圳)有限公司 发光二极管封装结构及其制造方法
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