CN102856316B - 发光器件封装件及包括其的光单元 - Google Patents

发光器件封装件及包括其的光单元 Download PDF

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Publication number
CN102856316B
CN102856316B CN201210066563.1A CN201210066563A CN102856316B CN 102856316 B CN102856316 B CN 102856316B CN 201210066563 A CN201210066563 A CN 201210066563A CN 102856316 B CN102856316 B CN 102856316B
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China
Prior art keywords
lead frame
light emitting
emitting device
cavity
disposed
Prior art date
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Expired - Fee Related
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CN201210066563.1A
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English (en)
Chinese (zh)
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CN102856316A (zh
Inventor
李东镕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Liyu Semiconductor Co ltd
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LG Innotek Co Ltd
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Priority to CN201610961544.3A priority Critical patent/CN106887426B/zh
Priority to CN201610963896.2A priority patent/CN106876376B/zh
Publication of CN102856316A publication Critical patent/CN102856316A/zh
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Publication of CN102856316B publication Critical patent/CN102856316B/zh
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Packaging Frangible Articles (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
CN201210066563.1A 2011-06-29 2012-03-14 发光器件封装件及包括其的光单元 Expired - Fee Related CN102856316B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201610961544.3A CN106887426B (zh) 2011-06-29 2012-03-14 发光器件封装件及包括其的光单元
CN201610963896.2A CN106876376B (zh) 2011-06-29 2012-03-14 发光器件封装件及包括其的光单元

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2011-0064097 2011-06-29
KR1020110064097A KR101823506B1 (ko) 2011-06-29 2011-06-29 발광 소자 패키지 및 이를 구비한 라이트 유닛

Related Child Applications (2)

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CN201610963896.2A Division CN106876376B (zh) 2011-06-29 2012-03-14 发光器件封装件及包括其的光单元
CN201610961544.3A Division CN106887426B (zh) 2011-06-29 2012-03-14 发光器件封装件及包括其的光单元

Publications (2)

Publication Number Publication Date
CN102856316A CN102856316A (zh) 2013-01-02
CN102856316B true CN102856316B (zh) 2016-12-14

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Application Number Title Priority Date Filing Date
CN201210066563.1A Expired - Fee Related CN102856316B (zh) 2011-06-29 2012-03-14 发光器件封装件及包括其的光单元
CN201610963896.2A Expired - Fee Related CN106876376B (zh) 2011-06-29 2012-03-14 发光器件封装件及包括其的光单元
CN201610961544.3A Expired - Fee Related CN106887426B (zh) 2011-06-29 2012-03-14 发光器件封装件及包括其的光单元

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN201610963896.2A Expired - Fee Related CN106876376B (zh) 2011-06-29 2012-03-14 发光器件封装件及包括其的光单元
CN201610961544.3A Expired - Fee Related CN106887426B (zh) 2011-06-29 2012-03-14 发光器件封装件及包括其的光单元

Country Status (5)

Country Link
US (6) US8455891B2 (https=)
EP (3) EP3001454B8 (https=)
JP (4) JP5959884B2 (https=)
KR (1) KR101823506B1 (https=)
CN (3) CN102856316B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11469220B2 (en) * 2018-01-17 2022-10-11 Osram Oled Gmbh Component and method for producing a component

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101824886B1 (ko) * 2011-03-25 2018-03-14 엘지이노텍 주식회사 발광소자 패키지
KR101823506B1 (ko) 2011-06-29 2018-01-30 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 라이트 유닛
JP2013179271A (ja) * 2012-01-31 2013-09-09 Rohm Co Ltd 発光装置および発光装置の製造方法
JP6104527B2 (ja) * 2012-06-29 2017-03-29 シャープ株式会社 発光装置
US20140167083A1 (en) * 2012-12-19 2014-06-19 Avago Technologies General Ip (Singapore) Pte. Ltd. Led package with integrated reflective shield on zener diode
KR102116830B1 (ko) * 2013-03-14 2020-06-01 서울바이오시스 주식회사 휴대 단말기의 살균장치
TWI523277B (zh) * 2013-07-12 2016-02-21 葳天科技股份有限公司 White light emitting diode module with ultraviolet light
CN104425479B (zh) * 2013-08-22 2018-03-30 展晶科技(深圳)有限公司 发光二极管封装结构及其制造方法
CN104716246B (zh) * 2013-12-17 2017-09-26 展晶科技(深圳)有限公司 光电元件封装结构及其制造方法
KR102041645B1 (ko) * 2014-01-28 2019-11-07 삼성전기주식회사 전력반도체 모듈
CN105098022A (zh) * 2014-05-19 2015-11-25 四川新力光源股份有限公司 Led封装器件、基板及其制作方法
JP6576094B2 (ja) * 2014-06-16 2019-09-18 シチズン電子株式会社 Ｌｅｄ発光装置
KR20160023011A (ko) * 2014-08-20 2016-03-03 삼성전자주식회사 발광소자 패키지
CN105742467A (zh) * 2014-12-30 2016-07-06 震扬集成科技股份有限公司 承载器阵列以及发光二极管封装结构
TW201626604A (zh) * 2015-01-14 2016-07-16 億光電子工業股份有限公司 發光二極體封裝結構
KR102606852B1 (ko) 2015-01-19 2023-11-29 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자
CN205050865U (zh) * 2015-09-25 2016-02-24 吴少健 一种led线路板
KR20170058489A (ko) * 2015-11-18 2017-05-29 주식회사 세미콘라이트 반도체 발광소자용 프레임
US10008648B2 (en) * 2015-10-08 2018-06-26 Semicon Light Co., Ltd. Semiconductor light emitting device
JP6831624B2 (ja) * 2015-11-27 2021-02-17 ローム株式会社 Ｌｅｄ発光装置
KR101877236B1 (ko) * 2016-11-04 2018-07-11 주식회사 세미콘라이트 반도체 발광소자 및 이의 제조방법
CN107978596B (zh) * 2016-10-24 2020-05-12 光宝光电(常州)有限公司 光感测器模组及其穿戴装置
JP2018142592A (ja) * 2017-02-27 2018-09-13 パナソニックＩｐマネジメント株式会社 光源モジュール、照明装置、および移動体
CN107086265B (zh) * 2017-06-02 2025-03-14 漳州立达信光电子科技有限公司 发光二极管模组跟灯具装置
KR20190012555A (ko) 2017-07-27 2019-02-11 서울바이오시스 주식회사 조명 장치
CN109386762A (zh) * 2017-08-10 2019-02-26 朱爱荣 一种散热型路灯
WO2019045513A1 (ko) * 2017-09-01 2019-03-07 엘지이노텍 주식회사 발광소자 패키지 및 이를 포함하는 조명장치
KR102401824B1 (ko) * 2017-09-01 2022-05-25 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지
JP6920618B2 (ja) * 2017-11-28 2021-08-18 日亜化学工業株式会社 発光装置
US10950764B2 (en) 2017-11-28 2021-03-16 Nichia Corporation Light-emitting device
JP6652117B2 (ja) * 2017-11-29 2020-02-19 日亜化学工業株式会社 樹脂パッケージおよび発光装置
US12191427B2 (en) * 2018-02-05 2025-01-07 Lg Innotek Co., Ltd. Semiconductor device package and light emitting device comprising same
KR20190127218A (ko) * 2018-05-04 2019-11-13 엘지이노텍 주식회사 반도체 소자 패키지 및 이를 포함하는 광조사장치
KR102559294B1 (ko) * 2018-05-28 2023-07-25 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지
US10453817B1 (en) 2018-06-18 2019-10-22 Texas Instruments Incorporated Zinc-cobalt barrier for interface in solder bond applications
EP3614437B1 (en) * 2018-08-22 2021-05-05 Lumileds LLC Semiconductor die
US10840082B2 (en) 2018-08-09 2020-11-17 Lam Research Corporation Method to clean SnO2 film from chamber
WO2020092287A1 (en) * 2018-11-01 2020-05-07 Excelitas Canada, Inc. Quad flat no-leads package for side emitting laser diode
CN111295045B (zh) * 2018-12-07 2023-08-04 台达电子工业股份有限公司 电源模块
US11553616B2 (en) 2018-12-07 2023-01-10 Delta Electronics, Inc. Module with power device
KR102814706B1 (ko) * 2019-06-05 2025-05-29 엘지이노텍 주식회사 발광소자 패키지 및 이를 구비한 조명 장치
US11899139B2 (en) 2019-09-20 2024-02-13 Intel Corporation Photonic devices with redundant components and their applications
JP7332412B2 (ja) * 2019-09-26 2023-08-23 ローム株式会社 半導体発光装置
TWI705562B (zh) * 2019-12-13 2020-09-21 國立中興大學 大面積被動式微發光二極體陣列顯示器
KR20210117726A (ko) * 2020-03-20 2021-09-29 엘지이노텍 주식회사 조명모듈 및 조명장치
US12575443B2 (en) * 2020-04-08 2026-03-10 Sony Group Corporation Semiconductor device and manufacturing method of semiconductor device
JP7827700B2 (ja) * 2021-03-30 2026-03-10 ローム株式会社 半導体装置
KR20230000009A (ko) * 2021-06-23 2023-01-02 삼성전자주식회사 반도체 발광 소자 및 반도체 발광 소자 어레이
JP2023042529A (ja) * 2021-09-14 2023-03-27 日亜化学工業株式会社 発光装置
US12575450B2 (en) * 2021-09-14 2026-03-10 Nichia Corporation Light-emitting device
JP2023082632A (ja) * 2021-12-02 2023-06-14 スタンレー電気株式会社 半導体発光装置
TWI833444B (zh) * 2022-11-14 2024-02-21 南茂科技股份有限公司 薄膜覆晶封裝結構
KR20240075261A (ko) * 2022-11-22 2024-05-29 엘지디스플레이 주식회사 발광 다이오드 패키지와 그의 제조 방법, 및 발광 장치
CN117438400A (zh) * 2023-12-18 2024-01-23 泉州市三安集成电路有限公司 一种半导体封装结构及封装方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007180227A (ja) * 2005-12-27 2007-07-12 Toshiba Corp 光半導体装置およびその製造方法
CN101350346A (zh) * 2007-07-19 2009-01-21 日亚化学工业株式会社 发光器件及其制造方法
US20090224271A1 (en) * 2007-03-30 2009-09-10 Seoul Semiconductor Co., Ltd. Led package
US20090230413A1 (en) * 2008-03-11 2009-09-17 Rohm Co., Ltd. Semiconductor light emitting device and method for manufacturing the same

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6600175B1 (en) * 1996-03-26 2003-07-29 Advanced Technology Materials, Inc. Solid state white light emitter and display using same
JP3559435B2 (ja) * 1997-01-10 2004-09-02 ローム株式会社 半導体発光素子
JP3673621B2 (ja) * 1997-07-30 2005-07-20 ローム株式会社 チップ型発光素子
JP2000058924A (ja) * 1998-08-06 2000-02-25 Shichizun Denshi:Kk 表面実装型発光ダイオード及びその製造方法
JP3736366B2 (ja) * 2001-02-26 2006-01-18 日亜化学工業株式会社 表面実装型発光素子およびそれを用いた発光装置
US6531328B1 (en) * 2001-10-11 2003-03-11 Solidlite Corporation Packaging of light-emitting diode
JP4009097B2 (ja) * 2001-12-07 2007-11-14 日立電線株式会社 発光装置及びその製造方法、ならびに発光装置の製造に用いるリードフレーム
US7262438B2 (en) 2005-03-08 2007-08-28 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. LED mounting having increased heat dissipation
KR100650191B1 (ko) 2005-05-31 2006-11-27 삼성전기주식회사 정전기 방전 충격에 대한 보호 기능이 내장된 고휘도 발광다이오드
JP2007027535A (ja) 2005-07-20 2007-02-01 Stanley Electric Co Ltd 光半導体装置
KR100632002B1 (ko) * 2005-08-02 2006-10-09 삼성전기주식회사 보호 소자를 포함하는 측면형 발광 다이오드
TWI284433B (en) 2006-02-23 2007-07-21 Novalite Optronics Corp Light emitting diode package and fabricating method thereof
KR100703218B1 (ko) * 2006-03-14 2007-04-09 삼성전기주식회사 발광다이오드 패키지
KR100729439B1 (ko) * 2006-03-23 2007-06-15 (주)싸이럭스 발광소자 패키지 구조체와 그 제조방법 및 이를 적용한발광소자의 제조방법
JP5119621B2 (ja) 2006-04-21 2013-01-16 日亜化学工業株式会社 発光装置
KR101134752B1 (ko) 2006-07-14 2012-04-13 엘지이노텍 주식회사 Ｌｅｄ 패키지
TWM315886U (en) * 2006-12-28 2007-07-21 Everlight Electronics Co Ltd Light emitting diode structure
JP4689637B2 (ja) * 2007-03-23 2011-05-25 シャープ株式会社 半導体発光装置
KR20080089041A (ko) 2007-03-30 2008-10-06 서울반도체 주식회사 외부리드 없는 리드프레임을 갖는 ｌｅｄ 패키지 및 그제조방법
JP2008270305A (ja) * 2007-04-17 2008-11-06 Nichia Corp 発光装置
JP5431688B2 (ja) * 2007-06-29 2014-03-05 ソウル セミコンダクター カンパニー リミテッド マルチｌｅｄパッケージ
KR100870950B1 (ko) * 2007-11-19 2008-12-01 일진반도체 주식회사 발광다이오드 소자 및 그 제조 방법
KR101365622B1 (ko) * 2007-11-29 2014-02-24 서울반도체 주식회사 방습 ｌｅｄ 패키지
KR100998233B1 (ko) * 2007-12-03 2010-12-07 서울반도체 주식회사 슬림형 ｌｅｄ 패키지
KR101476423B1 (ko) * 2008-05-23 2014-12-26 서울반도체 주식회사 Ｌｅｄ 패키지
TWM351985U (en) * 2008-07-25 2009-03-01 Bi Chi Corp LED base structure capable of enhancing effect of mixture of light
TWI380433B (en) * 2009-02-25 2012-12-21 Everlight Electronics Co Ltd Light emitting diode package
JP2010245481A (ja) * 2009-04-10 2010-10-28 Sharp Corp 発光装置
JP5507330B2 (ja) 2010-04-27 2014-05-28 ローム株式会社 Ｌｅｄモジュール
KR101823506B1 (ko) * 2011-06-29 2018-01-30 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 라이트 유닛

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007180227A (ja) * 2005-12-27 2007-07-12 Toshiba Corp 光半導体装置およびその製造方法
US20090224271A1 (en) * 2007-03-30 2009-09-10 Seoul Semiconductor Co., Ltd. Led package
CN101350346A (zh) * 2007-07-19 2009-01-21 日亚化学工业株式会社 发光器件及其制造方法
US20090230413A1 (en) * 2008-03-11 2009-09-17 Rohm Co., Ltd. Semiconductor light emitting device and method for manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11469220B2 (en) * 2018-01-17 2022-10-11 Osram Oled Gmbh Component and method for producing a component

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